BZT52C2V4LP - BZT52C39LP
SURFACE MOUNT ZENER DIODE
Features
Ultra-Small Leadless Surface Mount Package
Ideally Suited for Automated Assembly Processes
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data
Case: X1-DFN1006-2
Case Material: Molded Plastic, "Green" Molding Compound;
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Marking Information
Terminals: Finish
NiPdAu over Copper Leadframe;
Solderable per MIL-STD-202, Method 208
e4
Weight: 0.001 grams (Approximate)
Bottom View
Ordering Information
(Note 4)
Part Number
(Type Number)-7*
(Type Number)-7B**
Compliance
Commercial
Commercial
Case
X1-DFN1006-2
X1-DFN1006-2
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
*Add “-7” to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = BZT52C6V2LP-7.
**Add “-7B” to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = BZT52C6V2LP-7B.
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
BZT52CxxLP-7
BZT52CxxLP-7B
xx
Top View
Dot Denotes
Cathode Side
xx
Top View
Bar Denotes
Cathode Side
xx = Product Type Marking Code
OR
xx
Top View
Bar Denotes
Cathode Side
BZT52C2V4LP - BZT52C39LP
Document number: DS30506 Rev. 22 - 2
1 of 5
www.diodes.com
May 2015
© Diodes Incorporated
BZT52C2V4LP - BZT52C39LP
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Forward Voltage (Note 5)
@ I
F
= 10mA
Symbol
V
F
Value
0.9
Unit
V
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 6) T
A
= +25°C
(Note 6) T
A
= +25°C
Symbol
P
D
R
θJA
T
J,
T
STG
Value
250
500
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics
Type
Number
Marking
Code
(@T
A
= +25°C, unless otherwise specified.)
Maximum Zener Impedance
f = 1kHz
I
ZT
mA
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
2
2
Z
ZT
@ I
ZT
Z
ZK
@ I
ZK
Ω
100
600
100
600
95
600
95
600
90
600
90
600
90
600
80
500
60
480
40
400
10
150
15
15
15
15
20
20
25
30
30
40
45
55
55
70
90
130
80
80
80
100
150
150
150
170
200
200
225
225
250
250
350
350
I
ZK
mA
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.5
0.5
Maximum
Reverse
Current
(Note 5)
I
R
@ V
R
µA
V
50
1.0
20
1.0
10
1.0
5
1.0
5
1.0
3
1.0
3
1.0
3
2.0
2.0
2.0
1.0
2.0
3.0
4.0
2.0
1.0
0.7
0.5
0.2
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
4.0
5.0
5.0
6.0
7.0
8.0
8.0
8.0
10.5
11.2
12.6
14.0
15.4
16.8
25.2
27.3
Temperature
Coefficient
@ I
ZTC
mV/°C
Min
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-2.7
-2
0.4
1.2
2.5
3.2
3.8
4.5
5.4
6.0
7.0
9.2
10.4
12.4
14.4
16.4
18.4
36.5
36.8
Max
0
0
0
0
0
0
0
0.2
1.2
2.5
3.7
4.5
5.3
6.2
7.0
8.0
9.0
10.0
11.0
13.0
14.0
16.0
-
-
-
-
-
Test
Current
I
ZTC
mA
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Zener Voltage Range
(Note 5)
V
Z
@ I
ZT
Min (V)
2.20
2.5
2.8
3.1
3.4
3.7
4.0
4.4
4.8
5.2
5.8
6.4
7.0
7.7
8.5
9.4
10.4
11.4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
34.0
37.0
BZT52C2V4LP
BZT52C2V7LP
BZT52C3V0LP
BZT52C3V3LP
BZT52C3V6LP
BZT52C3V9LP
BZT52C4V3LP
BZT52C4V7LP
BZT52C5V1LP
BZT52C5V6LP
BZT52C6V2LP
BZT52C6V8LP
(Note 7)
BZT52C7V5LP
BZT52C8V2LP
BZT52C9V1LP
BZT52C10LP
BZT52C11LP
BZT52C12LP
BZT52C13LP
BZT52C15LP
BZT52C16LP
BZT52C18LP
BZT52C20LP
BZT52C22LP
BZT52C24LP
BZT52C36LP
BZT52C39LP
Notes:
WX
W1
W2
W3
W4
W5
W6
W7
9Y
9A
9B
9C
9D
9E
9F
9G
9H
9J
9K
9L
9M
9N
9P
9R
9S
9W
9X
Nom (V)
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
36
39
Max (V)
2.60
2.9
3.2
3.5
3.8
4.1
4.6
5.0
5.4
6.0
6.6
7.2
7.9
8.7
9.6
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
38.0
41.0
5. Short duration pulse test used to minimize self-heating effect.
6. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporated’s Suggested Pad Layout document, which
can be found on our website at http://www.diodes.com.
7. Device can withstand a repetitive, 1A pulse with tp = 300μs and T = 3s (forward or reverse direction).
BZT52C2V4LP - BZT52C39LP
Document number: DS30506 Rev. 22 - 2
2 of 5
www.diodes.com
May 2015
© Diodes Incorporated
BZT52C2V4LP - BZT52C39LP
I
F
, INSTANTANEOUS FORWARD VOLTAGE (mA)
300
Note 6
1000
T
A
= 150°C
T
A
= 125°C
T
A
= -40°C
T
A
= 25°C
P
D
, POWER DISSIPATION (mW)
250
100
200
T
A
= 105°C
150
10
T
A
= 85°C
T
A
= -65°C
100
1
50
0
0
0.1
0
0.3
0.6
0.9
1.2
1.5
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
25
50
75
100
125
T
A
, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Derating Curve
150
100
50
C5V6LP
C6V8LP
40
I
Z
, ZENER CURRENT (mA)
10
T
A
= 25°C
I
Z
, ZENER CURRENT (mA)
C6V2LP
C8V2LP
30
1
C4V7LP
20
0.1
10
Test Current I
Z
5.0mA
0.01
0
2
3
4
5
V
Z
, ZENER VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics
C10LP
C12LP
1
6
0
0
3
4
5
6
7
8
9 10
V
Z
, ZENER VOLTAGE (V)
Fig. 4 Typical Zener Breakdown Characteristics
1
2
30
C36LP
C39LP
I
Z
, ZENER CURRENT (mA)
20
C18LP
C22LP
I
Z
, ZENER CURRENT (mA)
C15LP
Test Current I
Z
2.0mA
10
Test Current I
Z
5.0mA
0
0
30
10
20
V
Z
, ZENER VOLTAGE (V)
Fig. 5 Typical Zener Breakdown Characteristics
V
Z
, ZENER VOLTAGE (V)
Fig. 6 Typical Zener Breakdown Characteristics
BZT52C2V4LP - BZT52C39LP
Document number: DS30506 Rev. 22 - 2
3 of 5
www.diodes.com
May 2015
© Diodes Incorporated
BZT52C2V4LP - BZT52C39LP
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
A
A1
D
R
E
b
X1-DFN1006-2
Dim
Min
Max
Typ
A
0.47
0.53
0.50
A1
0
0.05
0.03
b
0.45
0.55
0.50
D
0.95 1.075
1.00
E
0.55 0.675
0.60
e
-
-
0.40
L
0.20
0.30
0.25
R
0.05
0.15
0.10
All Dimensions in mm
L
e
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X1
X
Dimensions
C
G
X
X1
Y
Value (in mm)
0.70
0.30
0.40
1.10
0.70
Y
G
C
BZT52C2V4LP - BZT52C39LP
Document number: DS30506 Rev. 22 - 2
4 of 5
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May 2015
© Diodes Incorporated
BZT52C2V4LP - BZT52C39LP
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
BZT52C2V4LP - BZT52C39LP
Document number: DS30506 Rev. 22 - 2
5 of 5
www.diodes.com
May 2015
© Diodes Incorporated
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