E, I Grades .........................................–40°C to 125°C
MP Grade...........................................–55°C to 125°C
Storage Temperature Range...................–65°C to 150°C
Lead Temperature: Soldering, 10 sec .................... 300°C
(MSOP Package Only)
PIN CONFIGURATION
TOP VIEW
TOP VIEW
REF/BYP
I
MIN
FAULT
SHDN
IN
IN
1
2
3
4
5
6
12
11
10
9
8
7
I
MON
I
MAX
GND
ADJ
OUT
OUT
REF/BYP 1
I
MIN
2
FAULT
3
SHDN
4
IN 5
IN 6
MSE PACKAGE
12-LEAD PLASTIC MSOP
T
JMAX
= 125°C,
θ
JA
= 45°C/W,
θ
JC
= 5°C/W TO 10°C/W
EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
13
GND
12 I
MON
11 I
MAX
10 GND
9 ADJ
8 OUT
7 OUT
13
GND
DDB PACKAGE
12-LEAD (3mm 2mm) PLASTIC DFN
T
JMAX
= 125°C,
θ
JA
= 49°C/W,
θ
JC
= 13.5°C/W
EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
LT3050EMSE#PBF
LT3050IMSE#PBF
LT3050MPMSE#PBF
LT3050EMSE-3.3#PBF
LT3050IMSE-3.3#PBF
LT3050EMSE-5#PBF
LT3050IMSE-5#PBF
LT3050MPMSE-5#PBF
LT3050EDDB#PBF
LT3050IDDB#PBF
LT3050EDDB-3.3#PBF
LT3050IDDB-3.3#PBF
TAPE AND REEL
LT3050EMSE#TRPBF
LT3050IMSE#TRPBF
LT3050MPMSE#TRPBF
LT3050EMSE-3.3#TRPBF
LT3050IMSE-3.3#TRPBF
LT3050EMSE-5#TRPBF
LT3050IMSE-5#TRPBF
LT3050MPMSE-5#TRPBF
LT3050EDDB#TRPBF
LT3050IDDB#TRPBF
LT3050EDDB-3.3#TRPBF
LT3050IDDB-3.3#TRPBF
PART MARKING*
3050
3050
3050
305033
305033
30505
30505
30505
LFGC
LFGC
LFWR
LFWR
PACKAGE DESCRIPTION
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead (3mm
×
2mm) Plastic DFN
12-Lead (3mm
×
2mm) Plastic DFN
12-Lead (3mm
×
2mm) Plastic DFN
12-Lead (3mm
×
2mm) Plastic DFN
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
LT3050MPMSE-3.3#PBF LT3050MPMSE-3.3#TRPBF 305033
3050fa
2
LT3050 Series
ORDER INFORMATION
LEAD FREE FINISH
LT3050EDDB-5#PBF
LT3050IDDB-5#PBF
LEAD BASED FINISH
LT3050EMSE
LT3050IMSE
LT3050MPMSE
LT3050EMSE-3.3
LT3050IMSE-3.3
LT3050MPMSE-3.3
LT3050EMSE-5
LT3050IMSE-5
LT3050MPMSE-5
LT3050EDDB
LT3050IDDB
LT3050EDDB-3.3
LT3050IDDB-3.3
LT3050EDDB-5
LT3050IDDB-5
TAPE AND REEL
LT3050EDDB-5#TRPBF
LT3050IDDB-5#TRPBF
TAPE AND REEL
LT3050EMSE#TR
LT3050IMSE#TR
LT3050MPMSE#TR
LT3050EMSE-3.3#TR
LT3050IMSE-3.3#TR
LT3050MPMSE-3.3#TR
LT3050EMSE-5#TR
LT3050IMSE-5#TR
LT3050MPMSE-5#TR
LT3050EDDB#TR
LT3050IDDB#TR
LT3050EDDB-3.3#TR
LT3050IDDB-3.3#TR
LT3050EDDB-5#TR
LT3050IDDB-5#TR
PART MARKING*
LFWS
LFWS
PART MARKING*
3050
3050
3050
305033
305033
305033
30505
30505
30505
LFGC
LFGC
LFWR
LFWR
LFWS
LFWS
PACKAGE DESCRIPTION
12-Lead (3mm
×
2mm) Plastic DFN
12-Lead (3mm
×
2mm) Plastic DFN
PACKAGE DESCRIPTION
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead (3mm
×
2mm) Plastic DFN
12-Lead (3mm
×
2mm) Plastic DFN
12-Lead (3mm
×
2mm) Plastic DFN
12-Lead (3mm
×
2mm) Plastic DFN
12-Lead (3mm
×
2mm) Plastic DFN
12-Lead (3mm
×
2mm) Plastic DFN
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
ELECTRICAL CHARACTERISTICS
PARAMETER
Minimum Input Voltage (Notes 3, 11)
Regulated Output Voltage
CONDITIONS
I
LOAD
= 100mA
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. (Note 2)
MIN
l
l
l
l
l
l
l
l
l
l
TYP
1.6
3.3
3.3
5
5
600
600
2.2
3.3
0.4
7.2
8.4
0.2
MAX
2.2
3.333
3.366
5.05
5.1
606
612
16.5
25
3
33
50
4
UNITS
V
V
V
V
V
mV
mV
mV
mV
mV
mV
mV
mV
LT3050-3.3: V
IN
= 3.9V, I
LOAD
= 1mA
3.9V < V
IN
< 15V, 1mA < I
LOAD
< 100mA (Note 15)
LT3050-5: V
IN
= 5.6V, I
LOAD
= 1mA
5.6V < V
IN
15V, 1mA < I
LOAD
< 100mA (Note 15)
3.267
3.234
4.95
4.9
594
588
ADJ Pin Voltage (Notes 3, 4)
Line Regulation (Note 3)
V
IN
= 2.2V, I
LOAD
= 1mA
2.2V < V
IN
< 15V, 1mA < I
LOAD
< 100mA (Note 15)
LT3050-3.3: ΔV
IN
= 3.9V to 45V, I
LOAD
= 1mA
LT3050-5: ΔV
IN
= 5.6V to 45V, I
LOAD
= 1mA
LT3050: ΔV
IN
= 2.2V to 45V, I
LOAD
= 1mA
LT3050-3.3: V
IN
= 3.9V, I
LOAD
= 1mA to 100mA
LT3050-5: V
IN
= 5.6V, I
LOAD
= 1mA to 100mA
LT3050: V
IN
= 2.2V, I
LOAD
= 1mA to 100mA
Load Regulation (Note 3)
3050fa
3
LT3050 Series
ELECTRICAL CHARACTERISTICS
PARAMETER
Dropout Voltage
V
IN
= V
OUT(NOMINAL)
(Notes 5, 6)
CONDITIONS
I
LOAD
= 1mA
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 100mA
GND Pin Current
V
IN
= V
OUT(NOMINAL)
+ 0.6V (Notes 6, 7, 11)
I
LOAD
= 0mA
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
V
IN
= 12V, V
SHDN
= 0V
V
IN
= 12V
C
OUT
= 10μF, I
LOAD
= 100mA, V
OUT
= 600mV,
BW = 10Hz to 100kHz
C
OUT
= 10μF, C
BYP
= 0.01μF, I
LOAD
= 100mA, V
OUT
= 600mV
BW = 10Hz to 100kHz
V
OUT
= Off to On
V
OUT
= On to Off
V
SHDN
= 0V
V
SHDN
= 45V
V
IN
– V
OUT
= 2V, V
RIPPLE
= 0.5V
P-P
,
f
RIPPLE
= 120Hz, I
LOAD
= 100mA
LT3050
LT3050-3.3
LT3050-5
V
IN
= 2.2V,
FAULT
Asserted, I
FAULT
= 100μA
FAULT
= 5V,
FAULT
Not Asserted
V
IN
= –45V, V
OUT
= 0
V
OUT
= 1.2V, V
IN
= 0
V
IN
= 2.2V or V
OUT(NOMINAL)
+ 0.6V, V
OUT
= 0V, I
MAX
= 0V
V
IN
= 2.2V or V
OUT(NOMINAL)
+ 0.6V,
ΔV
OUT
= –5%
LT3050-3.3
3.9V < V
IN
< 13.3V, R
IMAX
= 2.26k
FAULT Pin Threshold (I
FAULT
)
3.9V < V
IN
< 13.3V, R
IMAX
= 1.5k
FAULT Pin Threshold (I
FAULT
)
3.9V < V
IN
< 13.3V, R
IMAX
= 1.15k
FAULT Pin Threshold (I
FAULT
)
LT3050, LT3050-5
5.6V < V
IN
< 15V, R
IMAX
= 2.26k
FAULT Pin Threshold (I
FAULT
)
5.6V < V
IN
< 15V, R
IMAX
= 1.5k
FAULT Pin Threshold (I
FAULT
)
5.6V < V
IN
< 15V, R
IMAX
= 1.15k
FAULT Pin Threshold (I
FAULT
)
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. (Note 2)
MIN
TYP
110
195
280
340
45
60
175
0.85
2.2
0.17
12.5
90
30
0.7
0.6
0.9
1.5
1
3
MAX
150
220
240
340
330
450
400
550
90
160
370
2
5.2
1
60
UNITS
mV
mV
mV
mV
mV
mV
mV
mV
μA
μA
μA
mA
mA
μA
nA
μV
RMS
μV
RMS
V
V
μA
μA
Quiescent Current in Shutdown
ADJ Pin Bias Current (Notes 3, 12)
Output Voltage Noise
Output Voltage Noise
Shutdown Threshold
SHDN
Pin Current (Note 13)
Ripple Rejection
0.3
70
55
51
85
70
66
140
0.01
0.2
240
250
1
300
10
dB
dB
dB
mV
μA
μA
μA
mA
FAULT
Pin Logic Low Voltage
FAULT
Pin Leakage Current
Input Reverse Leakage Current
Reverse Output Current (Note 14)
Internal Current Limit (Note 3)
External Programmed Current Limit
(Notes 6, 8)
110
l
l
l
l
l
l
48.8
73.6
96
47.8
72.1
94.4
51.4
77.5
101
50.4
75.9
99.3
54
81.4
106
52.9
79.7
104.3
mA
mA
mA
mA
mA
mA
3050fa
4
LT3050 Series
ELECTRICAL CHARACTERISTICS
PARAMETER
Minimum I
MIN
Threshold Accuracy
(Notes 6, 9)
I
MIN
Threshold Accuracy (Notes 6, 9)
Current Monitor Ratio (Notes 6, 10)
Ratio = I
OUT
/I
MON
CONDITIONS
LT3050-3.3: 3.9V < V
IN
< 13.3V, R
IMIN
= 110K
LT3050, LT3050-5: 5.6V < V
IN
< 15V, R
IMIN
= 110K
LT3050-3.3: 3.9V < V
IN
< 13.3V, R
IMIN
= 11.3K
LT3050, LT3050-5: 5.6V < V
IN
< 15V, R
IMIN
= 11.3K
I
LOAD
= 5mA, 25mA, 50mA, 75mA, 100mA
LT3050-3.3: V
IMON
= V
OUT
, 3.9V < V
IN
< 13.3V
LT3050, LT3050-5: V
IMON
= V
OUT
, 5.6V < V
IN
< 15V
l
l
l
l
l
l
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. (Note 2)
MIN
0.92
0.9
9.2
9
95
95
TYP
1.03
1
10.3
10
100
100
MAX
1.13
1.1
11.3
11
105
105
UNITS
mA
mA
mA
mA
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime. Absolute maximum input-to-output differential
voltage is not achievable with all combinations of rated IN pin and OUT pin
voltages. With the IN pin at 50V, the OUT pin may not be pulled below 0V.
The total differential voltage from IN to OUT must not exceed ±50V.
Note 2:
The LT3050 is tested and specified under pulse load conditions
such that T
J
~ T
A
. The LT3050E is 100% production tested at T
A
= 25°C.
Performance at –40°C and 125°C is assured by design, characterization
and correlation with statistical process controls. The LT3050I is
guaranteed over the full –40°C to 125°C operating junction temperature
range. The LT3050MP is 100% tested over the –55°C to 125°C operating
junction temperature range.
Note 3:
The LT3050 adjustable version is tested and specified for these
conditions with ADJ pin connected to the OUT pin.
Note 4:
Maximum junction temperature limits operating conditions.
Regulated output voltage specifications do not apply for all possible
combinations of input voltage and output current. If operating at the
maximum input voltage, limit the output current range. If operating at the
maximum output current, limit the input voltage range.
Note 5:
Dropout voltage is the minimum differential IN-to-OUT voltage
needed to maintain regulation at a specified output current. In dropout,
the output voltage equals (V
IN
- V
DROPOUT
). For some output voltages,
minimum input voltage requirements limit dropout voltage.
Note 6:
To satisfy minimum input voltage requirements, the LT3050
adjustable version is tested and specified for these conditions with an
external resistor divider (60k bottom, 440k top) which sets V
OUT
to 5V.
The external resistor divider adds 10μA of DC load on the output. This
external current is not factored into GND pin current.
Note 7:
GND pin current is tested with V
IN
= V
OUT(NOMINAL)
+ 0.6V and
a current source load. GND pin current increases in dropout. For the
fixed output voltage versions, an internal resistor divider adds about
10μA to GND pin current. See the GND Pin Current curves in the Typical
Performance Characteristics section.
Note 8:
Current limit varies inversely with the external resistor value tied
from the I
MAX
pin to GND. For detailed information on how to set the
I
MAX
pin resistor value, please see the Operation section. If a programmed
current limit is not needed, the I
MAX
pin must be tied to GND and internal
protection circuitry implements short-circuit protection as specified.
Note 9:
The I
MIN
fault condition asserts if the output current falls below the
I
MIN
threshold defined by an external resistor from the I
MIN
pin to GND.
For detailed information on how to set the I
MIN
pin resistor value, please
see the Operation section. I
MIN
settings below the Minimum I
MIN
Accuracy
specification in the Electrical Characteristics section are not guaranteed
to ± 10% tolerance. If the I
MIN
fault condition is not needed, the I
MIN
pin
must be left floating (unconnected).
Note 10:
The current monitor ratio varies slightly when V
IMON
≠ V
OUT
. For
detailed information on how to calculate the output current from the I
MON
pin, please see the Operation section. If the current monitor function is not
needed, the I
MON
pin must be tied to GND.
Note 11:
To satisfy requirements for minimum input voltage, current limit
is tested at V
IN
= V
OUT(NOMINAL)
+1V or V
IN
= 2.2V, whichever is greater.
Note 12:
ADJ pin bias current flows out of the ADJ pin:
Note 13:
SHDN
pin current flows into the
SHDN
pin.
Note 14:
Reverse output current is tested with the IN pin grounded and the
OUT pin forced to the specified voltage. This current flows into the OUT pin
and out of the GND pin.
Note 15:
100mA of output current does not apply to the full range of input
voltage due to the internal current limit foldback.
Note 16:
The ADJ pin cannot be externally driven for fixed output voltage
options. LTC allows the use of a small feedforward capacitor from OUT
to ADJ to reduce noise and improve transient response. See the Bypass
Capacitance section of the Applications Information.
After getting a 5.5V power supply, there are several options. Let's take a look at the design of this High Efficiency Step Down ConverterThe design of this TPS62090RGTR looks good, with a BUCK topolog...
How to perform complete and rigorous configuration in the configuration software for specific engineering applications so that the configuration software can work normally. The following lists the typ...
That is, the address of SEG0 and SEG1 is 00H. If I want to light up all segments of 5, but the upper four bits of 5 are at address 04H, and the lower four bits are at address 05H. It is inconvenient t...
The most direct feeling about setting the system clock is that it is too troublesome. This is also an unavoidable problem. The Cortex clock is very troublesome, and NXP does not have the graphical ini...
Photovoltaic inverters are the core equipment of photovoltaic systems. Their main function is to convert the direct current generated by photovoltaic modules into alternating current that meets the...[Details]
In the war without gunpowder between China and the United States,
ZTE
has become a new victim. The seven-year chip ban by the United States has pushed this communications giant to a life-or...[Details]
The status of interrupts in developing embedded systems is absolutely unquestionable. In the era of C51 microcontrollers, there were only 5 interrupts, including 2 external interrupts, 2 timer/counte...[Details]
China Energy Storage Network News:
The State Grid Corporation of China, this elephant, is planning to turn around and enter the emerging power service market.
The rallying cry for the tr...[Details]
There has been a lot of news about Huawei
phones
recently
. At the
Huawei
Global Analyst Conference
on the 17th
,
Huawei
announced that it will launch
5G
phones
in the seco...[Details]
As cryptocurrency continues to gain popularity, a technology hidden behind it has attracted more attention from the world, that is the now hotly debated
blockchain
. Let's follow the embedd...[Details]
On May 8,
Google
I/O 2018 Developer Conference was held as scheduled in Mountain View, California. In the second year of the full promotion of the "AI first" strategy, artificial intelligen...[Details]
Mobile communication resale business means that enterprises can contract part of the communication network usage rights from basic telecommunications operators, repackage them into their own brands...[Details]
Household photovoltaic power stations mainly utilize idle resources on existing household buildings, such as roofs, wall facades, balconies, courtyards, etc., to install and use distributed photovo...[Details]
Why does MCU have a watchdog? With this question, let's learn about watchdogs. Even the 51 single-chip microcomputer has a watchdog, which shows that this dog has a special meaning to us. The purpose...[Details]
This is a "cooperation" that is related to the future development of China's semiconductor industry. Let's follow the embedded editor to learn more about the relevant content.
Last week, a...[Details]
Introduction: As a power electronic device, the photovoltaic inverter mainly converts the direct current generated by the photovoltaic module into alternating current. Because there are thousands o...[Details]
Ouster LiDAR OS-1 (left) and OS-2 (center) Velodyne invented the modern 3D LiDAR scanner in the mid-2000s, but in recent years conventional wisdom has held that Velodyne’s design — 64 lasers mounted...[Details]
The pins of stm32 have two uses: GPIO (general purpose io) and AFIO (alternate function io) For some pins (depending on the chip), neither of these two uses exists. For example, in 64-pin products, O...[Details]
Analogue and Mixed Signal
京公网安备 11010802033920号
EEWORLD
