xMR Sensor Signal Conditioner
ZSSC5101
Datasheet
Brief Description
The ZSSC5101 is a CMOS integrated circuit for con-
verting sine and cosine signals obtained from
magnetoresistive bridge sensors into a ratiometric
analog voltage with a user-programmable range of
travel and clamping levels.
The ZSSC5101 accepts sensor bridge arrangements
for both rotational as well as linear movement.
Depending on the type of sensor bridge, a full-scale
travel range of up to 360 mechanical degrees can be
obtained.
Programming of the device is performed through the
output pin, allowing in-line programming of fully
assembled 3-wire sensors. Programming param-
eters are stored in an EEPROM and can be re-pro-
grammed multiple times.
The ZSSC5101 is fully automotive-qualified with an
ambient temperature range up to 160°C.
Benefits
•
•
•
•
•
•
•
•
•
•
No external trimming components required
PC-controlled configuration and single-pass
calibration via one-wire interface allows
programming of fully assembled sensors
Can be used with low-cost ferrite magnets
Allows large air gaps between sensors and
magnets
Optimized for automotive environments with
extended temperature range and special
protection circuitry with excellent electro-
magnetic compatibility
Power supply monitoring
Sensor monitoring
Detection of EEPROM memory failure
Connection failure management
High accuracy: ± 0.15° integral nonlinearity (INL)
after calibration
Features
•
•
•
•
•
•
•
•
•
•
•
•
Ratiometric analog output
Up to 4608 analog steps
Step size as small as 0.022°
Programming through output pin via
one-wire interface
Offset calibration of the bridge input signals
Programmable linear transfer characteristic:
Zero position
Angular range
Upper and lower clamping levels
Rising or falling slope
Loss of magnet indication with programmable
threshold level
Accepts anisotropic, giant, and tunnel magneto-
resistive bridge sensors (AMR, GMR and TMR)
Programmable 32-bit user ID
CRC, error detection, and error correction
on EEPROM data
Diagnostics: broken-wire detection
Automotive-qualified to AEC-Q100, grade 0
Available Support
•
•
Evaluation Kit
Application Notes
Physical Characteristics
•
•
•
Wide operation temperature: -40 C to
+
160 C (die)
Supply voltage: 4.5V to 5.5V
SSOP-14 package, bare die, or unsawn wafer
ZSSC5101 Typical Application Circuit
Sensor Bridges
VDDS
VSINP
ZSSC5101
C
B
100nF
+5V
VSINN
VCOSP
VCOSN
VDDE
VOUT
VSSE
Load
Circuit
R
out
C
out
VSSS
© 2016 Integrated Device Technology, Inc.
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January 22, 2016
xMR Sensor Signal Conditioner
ZSSC5101
Datasheet
ZSSC5101 Block Diagram
VDDE
VDDS
Digital Signal Processing and Control
VDDS
VSSS
Power Supply Regulators
Applications
One-Wire
Interface
Sin
VSSS
EEPROM
VDDS
Cos
VSSS
VSINP
VSINN
VCOSP
VCOSN
MUX
PGA
ADC
Cordic
Algorithm
DAC
Interface
Buffer
Amp.
VOUT
Analog Frontend AFE
VSSE
•
•
•
•
•
•
•
•
Absolute Rotary Position Sensor
Steering Wheel Position Sensor
Pedal Position Sensor
Throttle Position Sensor
Float-Level Sensor
Ride Height Position Sensor
Non-Contacting Potentiometer
Rotary Dial
Application Circuit for AMR Sensors
AMR Sensor Bridge
Application Circuit for TMR Sensors
TMR Sensor Bridge
e.g., MDT MMA253F
VCC
Rs
1
VDDS
VDDS
VSINP
ZSSC5101
C
B
100nF
+5V
X+
3
Rp
5
Rs
2
Rp
6
VSINP
VSINN
VCOSP
VCOSN
ZSSC5101
VDDE
VOUT
VSSE
Load
Circuit
X-
Rs
VDDE
VOUT
VSSE
10
C
B
100nF
+5V
Load
Circuit
VSINN
VCOSP
12
R
out
C
out
Y+
R
out
11
C
out
Rs
VCOSN
VSSS
VSSS
GND
Y-
4
Rs=51k
Ω
Rp = 5k
Ω
to 10k
Ω
Ordering Information
Sales Code
ZSSC5101BE1B
ZSSC5101BE2B
ZSSC5101BE3B
ZSSC5101BE1C
ZSSC5101BE4R
ZSSC5101BE4T
ZSSC5101 KIT
Description
ZSSC5101 Die – Temperature range: -40°C to +160°C
ZSSC5101 Die – Temperature range: -40°C to +160°C
ZSSC5101 Die – Temperature range: -40°C to +160°C
ZSSC5101 Die – Temperature range: -40°C to +160°C
ZSSC5101 SSOP-14 – Temperature range: -40°C to +150°C
ZSSC5101 SSOP-14 – Temperature range: -40°C to +150°C
Delivery Package
8” tested wafer, unsawn, thickness = 390 ±15µm
8” tested wafer, unsawn, thickness = 725 ±15µm
8” tested wafer, unsawn, thickness = 250 ±15µm
8” tested wafer, sawn on frame, thickness = 390 ±15µm
13” tape and reel
Tube
Evaluation Kit: USB Communication Board, ZSSC5101 AMR board, adapters. Software is downloaded (see data sheet).
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
Sales
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
Tech Support
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an
implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property
rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit
www.idt.com/go/glossary.
All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2016 Integrated Device Technology, Inc.
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January 22, 2016
ZSSC5101 Datasheet
Contents
1
IC Characteristics ............................................................................................................................................. 5
1.1. Absolute Maximum Ratings ....................................................................................................................... 5
1.2. Operating Conditions ................................................................................................................................. 5
1.3. Electrical Parameters ................................................................................................................................ 6
1.3.1. ZSSC5101 Characteristics .................................................................................................................. 6
1.3.2. Input Stage Characteristics ................................................................................................................. 7
1.3.3. Digital Calculation Characteristics ...................................................................................................... 8
1.3.4. Analog Output Stage Characteristics (Digital to VOUT) ..................................................................... 9
1.3.5. Analog Input to Analog Output Characteristics (Full Path) ............................................................... 10
1.3.6. Digital Interface Characteristics (CMOS compatible) ....................................................................... 10
1.3.7. Supervision Circuits .......................................................................................................................... 11
1.3.8. Power Loss Circuit ............................................................................................................................ 11
Circuit Description .......................................................................................................................................... 12
2.1. Overview .................................................................................................................................................. 12
2.2. Functional Description ............................................................................................................................. 12
2.3. One-Wire Interface and Command Mode (CM) ...................................................................................... 13
2.4. Power-Up/Power-Down Characteristics .................................................................................................. 14
2.5. Power Loss / GND Loss .......................................................................................................................... 14
2.5.1. Purpose ............................................................................................................................................. 14
2.5.2. Power Loss Behavior ........................................................................................................................ 14
2.6. Diagnostics Mode (DM) ........................................................................................................................... 15
EEPROM ........................................................................................................................................................ 16
3.1. User Programmable Parameters in EEPROM ........................................................................................ 16
3.2. CRC Algorithm ......................................................................................................................................... 16
3.3. EDC Algorithm ......................................................................................................................................... 16
Application Circuit Examples .......................................................................................................................... 17
4.1. Typical Application Circuit for AMR Double Wheatstone Sensor Bridges............................................... 17
4.2. Typical Application Circuit for TMR Sensor Bridges................................................................................ 18
4.3. Mechanical Set-up for Absolute Angle Measurements ........................................................................... 18
4.4. Mechanical Set-up for Linear Distance Measurements .......................................................................... 20
4.5. Input-to-Output Characteristics Calculation Examples ............................................................................ 21
ESD and Latch-up Protection ......................................................................................................................... 22
5.1. Human Body Model ................................................................................................................................. 22
5.2. Machine Model ........................................................................................................................................ 22
5.3. Charged Device Model ............................................................................................................................ 22
5.4. Latch-Up .................................................................................................................................................. 22
Pin Configuration and Package Dimensions .................................................................................................. 23
2
3
4
5
6
© 2016 Integrated Device Technology, Inc.
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January 22, 2016
ZSSC5101 Datasheet
6.1. Package Drawing – SSOP-14 ................................................................................................................. 24
6.2. Die Dimensions and Pad Coordinates .................................................................................................... 25
7 Layout Requirements ..................................................................................................................................... 25
8 Reliability and RoHS Conformity .................................................................................................................... 25
9 Ordering Information ...................................................................................................................................... 26
10 Related Documents ........................................................................................................................................ 26
11 Glossary ......................................................................................................................................................... 27
12 Document Revision History ............................................................................................................................ 28
List of Figures
Figure 2.1
Figure 4.1
Figure 4.2
Figure 4.3
Figure 4.4
Figure 4.5
Figure 6.1
Figure 6.2
ZSSC5101 Block Diagram ................................................................................................................ 12
ZSSC5101 with AMR Sensor Bridge ................................................................................................ 17
ZSSC5101 with TMR Sensor Bridge ................................................................................................ 18
Mechanical Set-up for Rotational Measurements and Programming Options ................................. 19
Mechanical Set-up for Linear Distance Measurements and Programming Options ........................ 20
Input-to-Output Characteristics with Parameters.............................................................................. 21
Package Dimensions – SSOP-14 ..................................................................................................... 24
Pin Map and Pad Position of the ZSSC5101 SSOP-14 Package .................................................... 25
List of Tables
Table 1.1
Table 1.2
Table 1.3
Table 1.4
Table 1.5
Table 1.6
Table 1.7
Table 1.8
Table 1.9
Table 1.10
Table 2.1
Table 2.2
Table 2.3
Table 3.1
Table 6.1
Absolute Maximum Ratings ................................................................................................................ 5
Operating Conditions .......................................................................................................................... 5
Electrical Characteristics .................................................................................................................... 6
Input Stage Characteristics ................................................................................................................. 7
Digital Calculation Characteristics ...................................................................................................... 8
Analog Output Stage Characteristics ................................................................................................. 9
Full Analog Path Characteristics....................................................................................................... 10
Digital Interface Characteristics ........................................................................................................ 10
Supervision Circuits .......................................................................................................................... 11
Power Loss Circuit ............................................................................................................................ 11
Output Modes during Power-Up and Power-Down .......................................................................... 14
Power Loss Behavior ........................................................................................................................ 14
Diagnostics Mode ............................................................................................................................. 15
EEPROM — User Area .................................................................................................................... 16
Pin Configuration .............................................................................................................................. 23
© 2016 Integrated Device Technology, Inc.
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January 22, 2016
ZSSC5101 Datasheet
1
1.1.
IC Characteristics
Absolute Maximum Ratings
Absolute Maximum Ratings
Parameter
Symbol
V
DDE
V
DDS
Min
-0.3
-0.3
-0.3
V
OUT
T
S
-0.3
-60
Typ.
Max
5.7
V
DDE
+0.3
V
DDS
V
DDE
+0.3
160
Unit
V
V
V
V
°C
Table 1.1
1.1.1.1.
Supply voltage at VDDE pin
1.1.1.2.
Voltage at VDDS pin
1.1.1.3.
Voltage at VSINP, VSINN, VCOSP, and VCOSN pins
1.1.1.4.
Voltage at VOUT pin
1.1.1.5.
Storage temperature
1.2.
Operating Conditions
Operating Conditions
Parameter
Symbol
V
DDE
1)
1), 2)
Table 1.2
Note: See important notes at the end of the table.
Min
4.5
-40
-60
-40
10
75
100
4.0
20
5
1000
t
PROG
t
RET
20
17
200
V
IN-RANGE
V
OFFSET-COMP
T
COEFF-RANGE
-4
-4
±23
+4
+4
Typ.
5.0
Max
5.7
160
160
150
150
Unit
V
°C
°C
°C
°C
nF
mA
nF
kΩ
°/s
ms
years
cycles
mV/V
mV/V
(µV/V)/K
1.2.1.1.
1.2.1.2.
1.2.1.3.
1.2.1.4.
1.2.1.5.
1.2.1.6.
1.2.1.7.
1.2.1.8.
1.2.1.9.
1.2.1.10.
1.2.1.11.
1.2.1.12.
1.2.1.13.
1.2.1.14.
1.2.1.15.
1.2.1.16.
Supply voltage for normal operation
Operating ambient temperature range, bare die
Extended ambient temperature range, bare die
T
A
T
A
T
A
T
A-EEP
C
B
I
BRIDGE
C
OUT
R
LOAD
Operating ambient temperature range, SSOP-14
Temperature range – EEPROM programming
Blocking capacitance between VDDE and VSSE pins
Sensor bridge current (sine and cosine)
Capacitive load at outputs
Output pull-up or pull-down load
Angular rate (mechanical)
EEPROM programming time for a single address
(condition: f
DIGITAL
is within specification; see 1.3.1.7)
Data retention time of memory over lifetime at
maximum average temperature 50°C
EEPROM endurance
Range of differential input voltage
(range of differential sensor output signal)
Range of offset voltage at input that can be digitally
compensated
Range of offset temperature compensation at input
that can be digitally compensated
© 2016 Integrated Device Technology, Inc.
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