Thermofuses
https://www.schurter.com /PG22
RTS
SMD thermal fuse for high currents
60 VDC · up to 100 A · 210 °C · PCB, SMT
Description
See below:
Approvals and Compliances
Applications
- Wherever power transistors are used
- Automotive: Cooling fan applications, ABS power steering, PTC hea-
ters, HVAC, Glow plugs, Diesel fuel heaters
- Industrial: Battery Protection, Power supplies, Lighting ballasts, H-
Bridge circuits, Motor drivers
- Patented surface mount thermal fuse to protect against thermal runa-
way of power semiconductors such as: MOSFET's, IC's, IGBT's,
Triac's, SCR's, etc.
- Provides physical protection in cases where all software-based security
measures have failed
Unique Selling Proposition
-
-
-
-
Separates rated voltages up to 60VDC
Reflow compatible through mechanical activation procedure
Galvanic separation happens inside the RTS housing
Smallest footprint with just two contacts
Other versions on request
Weblinks
- Thermal fuse with integrated shunt
- Thermal fuse with integrated fuse
pdf datasheet, html-datasheet, General Product Information, Packaging
details, Distributor-Stock-Check, Detailed request for product, Landing
Page, Video
Technical Data
Rated Voltage
Breaking Capacity
Operating current
Mounting
Allowable Operation Tempe-
rature
Tripping temperature
Material: Housing
Material: Terminals
Unit Weight
Storage Conditions
Product Marking
60 VDC
400 A
up to 100 A
PCB,SMT
-40 °C to +150 °C
210 °C
Plastics
Tin-Plated Copper Alloy
0.75 g
0 °C to 40 °C, max. 70% r.h.
Variant Code, Lot no.
Maximum reflow temperature
Soldering Methods
Solderability
Resistance to Soldering Heat
Activation force
Activation distance
260 °C (peak)
Reflow
Soldering Profile
245 °C / 3 sec acc. to IEC 60068-2-58
260 °C / 30 sec acc. to IPC/JEDEC J-
STD-020D, Level 1
Fa = max. 50 N
Sa = 1.1 ± 0.1 mm
Approvals and Compliances
Detailed information on product approvals, code requirements, usage instructions and detailed test conditions can be looked up in
Details about
Approvals
SCHURTER products are designed for use in industrial environments. They have approvals from independent testing bodies according to national
and international standards. Products with specific characteristics and requirements such as required in the automotive sector according to IATF
16949, medical technology according to ISO 134485 or in the aerospace industry can be offered exclusively with customer-specific, individual agree-
ments by SCHURTER.
Application standards
Application standards where the product can be used
Organization
Design
Designed for applications acc.
Standard
IEC/UL 60950
Description
IEC 60950-1 includes the basic requirements for the safety of information
technologyequipment.
Fuses
1
RTS
Compliances
The product complies with following Guide Lines
Identification
Details
RoHS
REACH
Initiator
SCHURTER AG
SCHURTER AG
Description
EU Directive RoHS 2011/65/EU
https://www.schurter.com /PG22
Thermofuses
On 1 June 2007, Regulation (EC) No 1907/2006 on the Registration,
Evaluation, Authorization and Restriction of Chemicals 1 (abbreviated as
"REACH") entered into force.
AEC-Q200 is a test standard for passive components used in automotive
applications. SCHURTER tests components according to the customer's
agreement and is certified according to IATF 16949.
Q200
AEC
Automotive
SCHURTER AG
Dimension [mm]
Reflow soldering pads
0
6.7
+0.15
0
0.2
+0.1
8.7
8.8
±0.1
6.6
3.1
4.8
2.9
2.9
2.9
6.6
±0.1
Activation status
Deactivated
4.5
Activated: must be mechanically activated after reflow
2
Fuses
Thermofuses
https://www.schurter.com /PG22
RTS
Activation specification
Sa = 1.1
±0.1
mm
Fa = max. 50 N
Ø
4
Ø
4
Diagrams
Thermofuse
heat source
(e.g. failed Power-FET)
Thermal
Coupling
Battery
Load
All Variants
Cold Resistance typ. (max.)
95
μΩ
(120
μΩ)
95
μΩ
(120
μΩ)
Packaging unit [PCS]
100
750
Order Number
3-104-513
3-104-514
Availability for all products can be searched real-time:https://www.schurter.com/en/Stock-Check/Stock-Check-SCHURTER
Nominal Current: < 100 A
Nominal Current depends on the implementation on the board (Cu area/ thickness)
Breaking Capacity: 400 A @ 24 VDC (> 18
μH)
/ 200 A @ 50 VDC (> 27
μH)
/ 170 A @ 60 VDC (> 32
μH)
All measurements carried out on a board based on IEC 60127-4 with 20 mm track width and 70
μm
copper layer thickness
Packaging Unit
Blister Tape 33 cm Reel in ESD Plastic Bag
The specifications, descriptions and illustrations indicated in this document are based on current
information. All content is subject to modifications and amendments. Information furnished is believed
to be accurate and reliable. However, users should independently evaluate the suitability and test each
product selected for their own applications.
Fuses
3
07.03.2018
Microcontroller MCU
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