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BC327_07

Description
800 mA, 45 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92
Categorysemiconductor    Discrete semiconductor   
File Size65KB,5 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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BC327_07 Overview

800 mA, 45 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92

BC327_07 Parametric

Parameter NameAttribute value
Number of terminals3
Transistor polarityPNP
Maximum collector current0.8000 A
Maximum Collector-Emitter Voltage45 V
Processing package description铅 FREE, CASE 29-11, TO-226, 3 PIN
Lead-freeYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateACTIVE
packaging shaperound
Package Sizecylindrical
Terminal formTHROUGH-hole
terminal coatingtin silver copper
Terminal locationBOTTOM
Packaging MaterialsPlastic/Epoxy
structuresingle
Number of components1
transistor applicationsamplifier
Transistor component materialssilicon
Maximum ambient power consumption0.6250 W
Transistor typeUniversal small signal
Minimum DC amplification factor250
Rated crossover frequency260 MHz
BC327, BC327−16,
BC327−25, BC327−40
Amplifier Transistors
PNP Silicon
Features
http://onsemi.com
COLLECTOR
1
2
BASE
3
EMITTER
Pb−Free Packages are Available*
MAXIMUM RATINGS
Rating
Collector −Emitter Voltage
Collector −Base Voltage
Collector −Emitter Voltage
Collector Current − Continuous
Total Power Dissipation @ T
A
= 25°C
Derate above T
A
= 25°C
Total Power Dissipation @ T
A
= 25°C
Derate above T
A
= 25°C
Operating and Storage Junction
Temperature Range
Symbol
V
CEO
V
CES
V
EBO
I
C
P
D
P
D
T
J
, T
stg
Value
−45
−50
−5.0
−800
625
5.0
1.5
12
−55 to +150
Unit
Vdc
Vdc
Vdc
mAdc
mW
mW/°C
W
mW/°C
°C
TO−92
CASE 29
STYLE 17
12
1
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Symbol
R
qJA
R
qJC
Max
200
83.3
Unit
°C/W
°C/W
3
STRAIGHT LEAD
BULK PACK
3
BENT LEAD
TAPE & REEL
AMMO PACK
2
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
MARKING DIAGRAM
BC
xx
AYWW
G
G
BCxx = Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering, marking, and shipping information in
the package dimensions section on page 4 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2007
1
March, 2007 − Rev. 5
Publication Order Number:
BC327/D

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