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conga-TC170/CSA-B-2.5

Description
Heat Sinks Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
CategoryThermal management products   
File Size300KB,3 Pages
Manufacturercongatec
Environmental Compliance
Download Datasheet Parametric Compare View All

conga-TC170/CSA-B-2.5 Overview

Heat Sinks Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded, 15mm fins, 18mm overall heat sink height and integrated 12V fan.

conga-TC170/CSA-B-2.5 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
Manufacturercongatec
Product CategoryHeat Sinks
RoHSDetails
ProductHeat Sinks
Designed forconga-TC97/TC170/TC175
TypeCooling Solution
Factory Pack Quantity1
FAST AND COMPACT
conga-TC170
-
6
th
Generation Intel
®
Core
SOC processor
-
Intel
®
Gen9 HD Graphics with HEVC (H.265) support
-
Low power consumption (TDP 15W, cTDP 8.5W)
-
Up to 32 GByte dual channel DDR4 memory
-
COM Express Compact Type 6 module 95x95 mm²
Formfactor
CPU
COM Express
®
Compact, (95 x 95 mm), Type 6 Connector Pinout
Intel
®
Core
i7-6600U
Intel
®
Core
i5-6300U
Intel
®
Core
i3-6100U
Intel
®
Celeron
®
3955U
2.6 GHz Dual Core
2.4 GHz Dual Core
2.3 GHz Dual Core
2.0 GHz Dual Core
Turbo Boost 3.4 GHz
Turbo Boost 3.0 GHz
4 MB Cache
3 MB Cache
3 MB Cache
2 MB Cache
TDP 15W
TDP 15W
TDP 15W
TDP 15W
GT2
GT2
GT2
GT1
Intel
®
Turbo Boost Technology | Intel
®
Hyper-Threading Technology (HT) | Intel
®
Advanced Vector Extensions 2.0 (AVX2) Intel
®
Advanced Encryption
Standard New Instructions (AES-NI) | Integrated dual channel memory controller up to 34,1 GByte/sec. memory bandwidth | Integrated Intel
®
Gen9
HD Graphics with frequency up to 1.05 GHz | Intel
®
Clear Video HD Technology | Intel
®
Virtualization Technology (VT) | Intel
®
Trusted Execution
Technology (TXT) | Intel
®
Secure Key
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32 GByte dual channel
Integrated PCH-LP
Intel
®
i219-LM GbE LAN Controller with AMT 11 support
8x PCI Express GEN. 3.0 lanes | 3x Serial ATA
®
Gen 3 (can be config. as RAID) |
4x USB
3.0 (XHCI) | 8x USB 2.0 (XHCI) | LPC bus (no DMA)
I²C bus (fast mode, 400 kHz, multi-master) | 2x UART
Digital High Definition Audio Interface with support for multiple audio codecs
Intel
®
Gen9 HD Graphics Engine with OpenCL 2.0, OpenGL 4.3 and DirectX12 (for Windows 10) support | up to three independent displays: HDMI
1.4a / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40
MBit/s | HEVC, VP8, VP9 and VDENC encoding
Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200
Automatic Panel Detection via EDID/EPI
2x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA (optional)
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup
I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
AMI Aptio
®
UEFI 2.x firmware | 8/16 MByte serial SPI firmware flash
The conga-TC170 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0). It is capable of calculating efficient hash and
RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e
commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 4.0 with battery support
Microsoft
®
Windows 10 | Microsoft
®
Windows 10 IoT Enterprise | Microsoft
®
Windows 8 | Microsoft
®
Windows 7 | Linux | Microsoft
®
Windows
embedded Standard
See User’s Guide for full details
Operating: 0 .. +60°C
Storage: -20 .. +80°C
Storage: 5 - 95% r. H. non cond.
LVDS
(eDP optional)
Digital Display Interface (DDI)
congatec Board Controller
Embedded BIOS Features
Security
Power Management
Operating Systems
Power Consumption
Temperature
Humidity
Size
Operating: 10 - 90% r. H. non cond.
95 x 95 mm (3.74” x 3.74”)
www.congatec.com

conga-TC170/CSA-B-2.5 Related Products

conga-TC170/CSA-B-2.5 TC170/i3-6100U TC170/i5-6300U TC170/3995U conga-TC170/CSA-B-2.7
Description Heat Sinks Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded, 15mm fins, 18mm overall heat sink height and integrated 12V fan. Computer-On-Modules - COM COM Express Type 6 Compact module with Intel Core i3-6100U dual core processor with 2.3GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface. Computer-On-Modules - COM COM Express Type 6 Compact module with Intel Core i5-6300U dual core processor with 2.4GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface. Computer-On-Modules - COM COM Express Type 6 Compact module with Intel Celeron Processor 3955U dual core processor with 2.0GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface. Heat Sinks Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
Product Attribute Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value
Manufacturer congatec congatec congatec congatec congatec
Product Category Heat Sinks Computer-On-Modules - COM Computer-On-Modules - COM Computer-On-Modules - COM Heat Sinks
RoHS Details Details Details Details Details
Factory Pack Quantity 1 1 1 1 1
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