1,048,576-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE
| MSC23137D-XXBS9 | MSC23137D-60DS9 | MSC23137D-70BS9 | MSC23137D-60BS9 | MSC23137D-XXDS9 | MSC23137D-70DS9 | MSC23137D | |
|---|---|---|---|---|---|---|---|
| Description | 1,048,576-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 1,048,576-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 1,048,576-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 1,048,576-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 1,048,576-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 1,048,576-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 1,048,576-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE |
| Maker | - | OKI | OKI | OKI | - | OKI | - |
| Parts packaging code | - | MODULE | MODULE | MODULE | - | MODULE | - |
| Contacts | - | 72 | 72 | 72 | - | 72 | - |
| Reach Compliance Code | - | unknow | unknow | unknow | - | unknow | - |
| ECCN code | - | EAR99 | EAR99 | EAR99 | - | EAR99 | - |
| access mode | - | FAST PAGE | FAST PAGE | FAST PAGE | - | FAST PAGE | - |
| Maximum access time | - | 60 ns | 70 ns | 60 ns | - | 70 ns | - |
| JESD-30 code | - | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | - | R-XSMA-N72 | - |
| memory density | - | 37748736 bi | 37748736 bi | 37748736 bi | - | 37748736 bi | - |
| Memory IC Type | - | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | - | FAST PAGE DRAM MODULE | - |
| memory width | - | 36 | 36 | 36 | - | 36 | - |
| Number of functions | - | 1 | 1 | 1 | - | 1 | - |
| Number of ports | - | 1 | 1 | 1 | - | 1 | - |
| Number of terminals | - | 72 | 72 | 72 | - | 72 | - |
| word count | - | 1048576 words | 1048576 words | 1048576 words | - | 1048576 words | - |
| character code | - | 1000000 | 1000000 | 1000000 | - | 1000000 | - |
| Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | - |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | - | 70 °C | - |
| organize | - | 1MX36 | 1MX36 | 1MX36 | - | 1MX36 | - |
| Package body material | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | - |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - |
| Package form | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | - |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
| Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | - |
| Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | - |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | - | 5 V | - |
| surface mount | - | NO | NO | NO | - | NO | - |
| technology | - | CMOS | CMOS | CMOS | - | CMOS | - |
| Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | - |
| Terminal form | - | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD | - |
| Terminal location | - | SINGLE | SINGLE | SINGLE | - | SINGLE | - |
京公网安备 11010802033920号
EEWORLD
