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BGU8006Z

Description
RF Amplifier BGU8006/WLCSP6///REEL13 Q2/T3 *SPECIAL MARK CHIPS
CategoryTopical application    Wireless rf/communication   
File Size399KB,19 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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BGU8006Z Overview

RF Amplifier BGU8006/WLCSP6///REEL13 Q2/T3 *SPECIAL MARK CHIPS

BGU8006Z Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerNXP
Product CategoryRF Amplifier
Unit Weight0.000005 oz
BGU8006
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo
and Compass
Rev. 3 — 17 November 2016
Product data sheet
1. Product profile
1.1 General description
The BGU8006 is a Low Noise Amplifier (LNA) for GNSS receiver applications. It comes as
extremely small and thin Wafer Level Chip Scale Package (WLCSP). The BGU8006
requires one external matching inductor and one external decoupling capacitor.
The BGU8006 adapts itself to the changing environment resulting from co-habitation of
different radio systems in modern cellular handsets. It has been designed for low power
consumption and optimal performance when jamming signals from co-existing cellular
transmitters are present. At low jamming power levels it delivers 17.2 dB gain at a noise
figure of 0.60 dB. During high jamming power levels, resulting for example from a cellular
transmit burst, it temporarily increases its bias current to improve sensitivity.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits
Covers full GNSS L1 band, from 1559 MHz to 1610 MHz
Noise figure (NF) = 0.60 dB
Gain 17.2 dB
High input 1 dB compression point of
7.5
dBm
High out of band IP3
i
of 6 dBm
Supply voltage 1.5 V to 3.1 V
Optimized performance at very low 3.6 mA supply current
Power-down mode current consumption < 1
A
Integrated temperature stabilized bias for easy design
Requires only one input matching inductor and one supply decoupling capacitor
Input and output DC decoupled
ESD protection on all pins (HBM > 2 kV)
Integrated matching for the output
Extremely small Wafer Level Chip Scale Package (WLCSP) 0.65
0.44
0.2 mm;
6 solder bumps; 0.22 mm bump pitch
180 GHz transit frequency - SiGe:C technology

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