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R5F56316SDFC#V0

Description
32-bit Microcontrollers - MCU RX631 256KB/128KB LQFP176 CAN 2.7V~3.6V
Categorysemiconductor    The embedded processor and controller   
File Size2MB,211 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Environmental Compliance
Download Datasheet Download user manual Parametric View All

R5F56316SDFC#V0 Overview

32-bit Microcontrollers - MCU RX631 256KB/128KB LQFP176 CAN 2.7V~3.6V

R5F56316SDFC#V0 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerRenesas Electronics Corporation
Product Category32-bit Microcontrollers - MCU
RoHSDetails
PackagingTray
Moisture SensitiveYes
Factory Pack Quantity40
Features
RX63N Group, RX631 Group
Renesas MCUs
100-MHz 32-bit RX MCU, on-chip FPU, 165 DMIPS, up to 2-MB flash
memory, various communications interfaces including Ethernet MAC,
full-speed USB 2.0 host/function/OTG interface, CAN, 10- & 12-bit A/D
converters, RTC
R01DS0098EJ0180
Rev.1.80
May 13, 2014
Features
RX63N Group products incorporate an Ethernet controller while
RX631 Group products do not.
32-bit RX CPU core
Max. operating frequency: 100 MHz
Capable of 165 DMIPS in operation at 100 MHz
Single precision 32-bit IEEE-754 floating point
Two types of multiply-and-accumulation unit (between memories and
between registers)
32-bit multiplier (fastest instruction execution takes one CPU clock cycle)
Divider (fastest instruction execution takes two CPU clock cycles)
Fast interrupt
CISC Harvard architecture with 5-stage pipeline
Variable-length instructions: Ultra-compact code
Supports the memory protection unit (MPU)
JTAG and FINE (two-line) debugging interfaces
PLQP0176KB-A
PLQP0144KA-A
PLQP0100KB-A
PLQP0064KB-A
PLQP0048KB-A
24 × 24 mm, 0.5-mm pitch
20 × 20 mm, 0.5-mm pitch
14 × 14 mm, 0.5-mm pitch
10 × 10 mm, 0.5-mm pitch
7 × 7 mm, 0.5-mm pitch
PTLG0177KA-A 8 × 8 mm, 0.5-mm pitch
PTLG0145KA-A 7 × 7 mm, 0.5-mm pitch
PTLG0100JA-A 7 × 7 mm, 0.65-mm pitch
PTLG0064JA-A 6 × 6 mm, 0.65-mm pitch
PLBG0176GA-A 13 × 13mm, 0.8-mm pitch
Various communications interfaces
Low-power design and architecture
Operation from a single 2.7- to 3.6-V supply
Low power consumption: A product that supports all peripheral functions
draws only 500
μA/MHz.
RTC is capable of operation from a dedicated power supply (min. operating
voltage: 2.3 V).
Four low-power modes
Supports ROM-less versions and versions with up to 2 Mbytes of ROM
(ROMless/256 Kbytes/384 Kbytes/512 Kbytes: RX631 Group only)
100-MHz operation, 10-ns read cycle (no wait states)
768-Kbyte to 2-Mbyte capacities
User code is programmable by on-board or off-board programming
ROM-less or 32 Kbytes of ROM (reprogrammable up to 100,000 times)
Programming/erasing as background operations (BGOs)
64 Kbytes/128 Kbytes/192 Kbytes/256 Kbytes of SRAM
For instructions and operands
Can provide backup on deep software standby
DMAC: Four channels
DTC
EXDMAC: Two channels
Dedicated DMAC for the Ethernet controller: Single channel
On-chip main flash memory, no wait states
Ethernet MAC (1) (not in RX631 Group products)
Host/function or OTG controller (1) and function controller (1) with full-
speed USB 2.0 transfer
CAN (compliant with ISO11898-1), incorporating 32 mailboxes (up to 3
modules)
SCI with multiple functionalities (up to 13)
Choose from among asynchronous mode, clock-synchronous mode, smart-
card interface mode, simplified SPI, simplified I2C, and extended serial
mode.
I
2
C bus interface for transfer at up to 1 Mbps (up to 4)
RSPI for high-speed transfer (up to 3)
Parallel data capture unit (PDC) (1) (available for 512 Kbytes/384 Kbytes/
256 Kbytes flash memory with 177-pin, 176-pin, 145-pin, and 144-pin)
Buses for high-speed data transfer (max. operating frequency of 50 MHz)
8 CS areas (8 × 16 Mbytes)
Multiplexed bus or separate bus are selectable per area.
8-, 16-, or 32-bit bus space is selectable per area
Independent SDRAM area (128 Mbytes)
External address space
On-chip data flash memory
On-chip SRAM, no wait states
Up to 20 extended-function timers
DMA
16-bit MTU2: input capture, output compare, PWM waveform output,
phase-counting mode (6 channels)
16-bit TPU: input capture, output compare, phase-counting mode (12
channels)
8-bit TMR (4 channels)
16-bit compare-match timers (4 channels)
Up to 21 × 12-bit channels, and incorporating 1 sample-and-hold circuit
Up to 8 × 10-bit channels, and incorporating 1 sample-and-hold circuit
Addition of results of A/D conversion (in the 12-bit converter)
Self diagnosis (for the 10-bit converter)
A/D converter for 1-MHz Operation
Reset and supply management
Power-on reset (POR)
Low voltage detection (LVD) with voltage settings
External crystal oscillator or internal PLL for operation at 4 to 16 MHz
Internal 125-kHz LOCO and 50-MHz HOCO
125-kHz clocks for the IWDT
Adjustment functions (30 seconds, leap year, and error)
Time capture function
(for capturing times in response to event-signal input on external pins)
125-kHz LOCO clock operation
Clock functions
10-bit D/A converter: 2 channels
Temperature sensor for measuring temperature within
the chip
■DEU
AES encryption and decryption functions
128/192/256-bit key length
ECB/CBC mode
Real-time clock
Independent watchdog timer
Useful functions for IEC60730 compliance
Register write protection can protect values in
important registers against overwriting.
Up to 134 pins for general I/O ports
Unique ID
5-V tolerance, open drain, input pull-up, switchable driving ability
16-byte ID code is provided for each chip (only for the G version)
D version: -40 to +85°C
G version: -40 to +105°C
Oscillation-stoppage detection, frequency measurement, CRC, IWDT, self-
diagnostic function for the A/D converter, etc.
Operating temp. range
R01DS0098EJ0180 Rev.1.80
May 13, 2014
Page 1 of 208

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