EMIF08-VID01C2
8 line low capacitance EMI filter
and ESD protection
Main product characteristics
Where EMI filtering in ESD sensitive equipment is
required :
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LCD & camera for mobile phones
Computers and printers
Communication systems
MCU Boards
Description
The EMIF08-VID01C2 is an 8 line highly
integrated device designed to suppress EMI/RFI
noise in all systems subjected to electromagnetic
interference. The flip chip packaging means the
package size is equal to the die size.
This filter includes ESD protection circuitry, which
prevents damage to the application when it is
subjected to ESD surges up to 15kV.
Coated flip chip package
Pin configuration (Bumps side)
Benefits
■
■
■
■
■
■
■
■
■
12 11 10
I8
GND
G ND
9 8 7
I6
GND
G ND
6 5 4
I4
GND
G ND
3 2 1
I2
GND
G ND
High efficiency EMI filter (-33 dB @ 900 Mhz)
Low line capacitance suitable for high speed
data bus
Low serial resistance for camera impedance
adaptation
Optimized PCB space consuming: 1.29 mm x
3.92 mm
Very thin package: 0.695 mm
Coating resin on back side and lead free
package
High efficiency in ESD suppression on inputs
pins (IEC61000-4-2 level 4).
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration & wafer level packaging.
I7
I5
I3
I1
A
B
C
O8
O7
O6
O5
O4
O3
O2
O1
Complies with following standards:
IEC61000-4-2
level 4 input pins
level 1 output pins
15 kV
8 kV
2 kV
2 kV
(air discharge)
(contact discharge
(air discharge)
(contact discharge
MIL STD 883E - Method 3015-6 Class 3
August 2005
Rev 2
1/6
www.st.com
6
1 Electrical characteristics (T
amb
= 25°C)
EMIF08-VID01C2
Figure 1.
Basic cell configuration
Input
R
Output
R = 100
Ω
Cline = 16 pF typ. @ 3 V
Table 1.
Symbol
Vpp
Tj
T
op
T
stg
Absolute ratings (limiting values)
Parameter
ESD discharge IEC61000-4-2 air discharge
ESD discharge IEC61000-4-2 contact discharge
Maximum junction temperature
Operating temperature range
Storage temperature range
Value
15
8
125
-40 to +85
-55 to +150
Unit
kV
KV
°C
°C
°C
1
Electrical characteristics (T
amb
= 25°C)
Symbol
V
BR
I
RM
V
RM
R
C
line
Parameters
Breakdown voltage
Leakage current @ V
RM
Stand-off voltage
Series resistance between Input &
Output
Input capacitance per line
I
M
R
V
RM
V
BR
V
I
Symbol
V
BR
I
RM
R
I/O
C
line
I
R
= 1mA
Test conditions
Min
6
Typ
8
Max
10
500
Unit
V
nA
Ω
pF
V
RM
= 3V per line
I=10mA
V
R
= 3V DC, 1 MHz
80
100
16
120
19
2/6
EMIF08-VID01C2
Figure 2.
dB
0
-5
-10
-15
1 Electrical characteristics (T
amb
= 25°C)
S21 (dB) attenuation measurement
Figure 3.
dB
0
-10
-20
-30
-40
Analog crosstalk measurement
-20
-50
-25
-30
-35
-40
-60
-70
-80
-90
f (Hz)
-45
100k
1M
10M
100M
1G
f (Hz)
100k
1M
10M
100M
1G
-100
Figure 4.
ESD response to IEC61000-4-2
(+15 kV air discharge) on one
input V
in
and one output V
out
Figure 5.
ESD response to IEC61000-4-2
(- 15 kV air discharge) on one
input V
in
and one output V
out
Input
10V/d
Input
10V/d
Output
10V/d
Output
10V/d
200ns/d
200ns/d
Figure 6.
Line capacitance versus applied
voltage
C
LINE
(pF)
28
26
24
22
20
18
16
14
12
10
0
1
2
V
LINE
(V)
3
4
5
3/6
2 Ordering information scheme
EMIF08-VID01C2
2
Ordering information scheme
EMIF
EMI Filter
Number of lines
X: resistance (Ohms)
Z: capacitance value / 10 pF
or
Application (3 letters) and
Version (2 digits)
C: Coated flip chip
1: Pitch = 500 µm, Bump = 315 µm
2: Lead free Pitch = 500 µm, Bump = 315 µm
vv
-
xxx zz
C
y
3
Package mechanical data flip chip
500µm +/-50
250µm +/-50
315 µm +/- 50
435 µm +/-50
695µm +/- 70
50
1µ
m
3.92 mm +/-50µm
Figure 7.
Marking
365
240
Figure 8.
Foot print receommendation
Dot, ST Logo
xx = marking
z = packaging
location
yww = date code
Dimensions in
Copper pad Diameter :
250µm recommended , 300µm max
®
E
Solder stencil opening : 330µm
x x z
y w w
w w
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
4/6
1.29 mm +/-50µm
+/ -
50
365
40
40
40
220
EMIF08-VID01C2
Figure 9.
Flip chip tape and reel specification
Dot identifying Pin A1 location
4 +/- 0.1
4 Ordering information
f
1.5 +/- 0.1
1.75 +/- 0.1
5.5 +/- 0.5
0.73 +/- 0.05
12 +/- 0.3
12 +/- 0.3
ST
ST
ST
E
ST
E
ST
E
ST
E
ST
E
ST
E
ST
E
yww
yww
yww
yww
yww
xxz
xxz
xxz
User direction of unreeling
xxz
xxz
4 +/- 0.1
4
Ordering information
Ordering code
EMIF08-VID01C2
Marking
GS
Package
Flip Chip
Weight
7.4mg
Base qty
5000
Delivery mode
7” Tape and reel
5
Revision history
Date
13-Jul-2005
11-Aug-2005
Revision
1
2
Initial release.
Fonts changed in Figures 7, 8, and 9.
Changes
5/6
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