UVPROM, 128KX16, 200ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44
| Parameter Name | Attribute value |
| Maker | AMD |
| Parts packaging code | LCC |
| package instruction | WQCCN, LCC44,.65SQ |
| Contacts | 44 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| I/O type | COMMON |
| JESD-30 code | S-CQCC-N44 |
| JESD-609 code | e0 |
| length | 16.51 mm |
| memory density | 2097152 bit |
| Memory IC Type | UVPROM |
| memory width | 16 |
| Number of functions | 1 |
| Number of terminals | 44 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 128KX16 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | WQCCN |
| Encapsulate equivalent code | LCC44,.65SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, WINDOW |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum seat height | 3.556 mm |
| Maximum standby current | 0.00015 A |
| Maximum slew rate | 0.06 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| width | 16.51 mm |
| Base Number Matches | 1 |
| 5962-9214002MXA | 5962-9214001MXA | 5962-9214001MQA | PTN1010K2083DGW0 | 5962-9214003MQA | 5962-9214003MXA | |
|---|---|---|---|---|---|---|
| Description | UVPROM, 128KX16, 200ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 | UVPROM, 128KX16, 250ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 | UVPROM, 128KX16, 250ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 | Fixed Resistor, Thin Film, 0.5W, 208000ohm, 150V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 1010, CHIP | UVPROM, 128KX16, 150ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 | UVPROM, 128KX16, 150ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 |
| package instruction | WQCCN, LCC44,.65SQ | WQCCN, LCC44,.65SQ | WDIP, DIP40,.6 | CHIP | WDIP, DIP40,.6 | WQCCN, LCC44,.65SQ |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Number of terminals | 44 | 44 | 40 | 2 | 40 | 44 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 155 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package form | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | IN-LINE, WINDOW | SMT | IN-LINE, WINDOW | CHIP CARRIER, WINDOW |
| surface mount | YES | YES | NO | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | THIN FILM | CMOS | CMOS |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | Gold (Au) - with Nickel (Ni) barrier | TIN LEAD | TIN LEAD |
| Maker | AMD | AMD | AMD | - | AMD | AMD |
| Parts packaging code | LCC | LCC | DIP | - | DIP | LCC |
| Contacts | 44 | 44 | 40 | - | 40 | 44 |
| Maximum access time | 200 ns | 250 ns | 250 ns | - | 150 ns | 150 ns |
| I/O type | COMMON | COMMON | COMMON | - | COMMON | COMMON |
| JESD-30 code | S-CQCC-N44 | S-CQCC-N44 | R-GDIP-T40 | - | R-GDIP-T40 | S-CQCC-N44 |
| JESD-609 code | e0 | e0 | e0 | - | e0 | e0 |
| length | 16.51 mm | 16.51 mm | 52.2605 mm | - | 52.2605 mm | 16.51 mm |
| memory density | 2097152 bit | 2097152 bit | 2097152 bit | - | 2097152 bit | 2097152 bit |
| Memory IC Type | UVPROM | UVPROM | UVPROM | - | UVPROM | UVPROM |
| memory width | 16 | 16 | 16 | - | 16 | 16 |
| Number of functions | 1 | 1 | 1 | - | 1 | 1 |
| word count | 131072 words | 131072 words | 131072 words | - | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | - | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| organize | 128KX16 | 128KX16 | 128KX16 | - | 128KX16 | 128KX16 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | WQCCN | WQCCN | WDIP | - | WDIP | WQCCN |
| Encapsulate equivalent code | LCC44,.65SQ | LCC44,.65SQ | DIP40,.6 | - | DIP40,.6 | LCC44,.65SQ |
| Package shape | SQUARE | SQUARE | RECTANGULAR | - | RECTANGULAR | SQUARE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| Filter level | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - | MIL-STD-883 | MIL-STD-883 |
| Maximum seat height | 3.556 mm | 3.556 mm | 5.588 mm | - | 5.588 mm | 3.556 mm |
| Maximum standby current | 0.00015 A | 0.00015 A | 0.00015 A | - | 0.00015 A | 0.00015 A |
| Maximum slew rate | 0.06 mA | 0.06 mA | 0.06 mA | - | 0.06 mA | 0.06 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| Temperature level | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY |
| Terminal form | NO LEAD | NO LEAD | THROUGH-HOLE | - | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | - | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | DUAL | - | DUAL | QUAD |
| width | 16.51 mm | 16.51 mm | 15.24 mm | - | 15.24 mm | 16.51 mm |
| Base Number Matches | 1 | 1 | 1 | - | 1 | - |