Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2:
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Recommended Operating Condition
Item
Operating Temperature Range
Supply Voltage
Maximum Output Current (DC)
(Note 3)
Not exceeding Tj =150°C.
Symbol
Topr
V
CC1
, V
CC2
I
OUT
Min
-25
+8
-
Typ
+25
+24
-
Max
+85
+28
+1.2
(Note 3)
Unit
°C
V
A/Phase
Thermal Resistance
(Note 4)
Parameter
UQFN040V5050
Junction to Ambient
Junction to Top Characterization Parameter
(Note 5)
θ
JA
Ψ
JT
95.2
7
31.7
4
°C/W
°C/W
Symbol
Thermal Resistance (Typ)
1s
(Note 6)
2s2p
(Note
7)
Unit
(Note 4)
Based on JESD51-2A(Still-Air).
(Note 5)
The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 6)
Using a PCB board based on JESD51-3.
(Note 7)
Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Top
Copper Pattern
Footprints and Traces
Layer Number of
Measurement Board
4 Layers
Top
Copper Pattern
Footprints and Traces
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.57 mmt
Thickness
70 μm
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Thickness
70 μm
Copper Pattern
74.2 mm x 74.2 mm
Thickness
35 μm
Thermal Via
(Note 8)
Pitch
Diameter
1.20 mm
Φ0.30 mm
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
(Note 8)
This thermal via connects with the copper pattern of all layers.
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