805J250821MCBE03 datasheet, PDF

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805J250821MCBE03: DescriptionFeed Through Capacitor, 1 Function(s), 25V, EIA STD PACKAGE SIZE 0603, CERAMIC PACKAGE-3; Categoryfilter; File Size193KB，4 Pages; ManufacturerSyfer; Environmental Compliance

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805J250821MCBE03 Overview

Feed Through Capacitor, 1 Function(s), 25V, EIA STD PACKAGE SIZE 0603, CERAMIC PACKAGE-3

805J250821MCBE03 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Syfer
Reach Compliance Code	compliant
ECCN code	EAR99
capacitance	820 µF
filter type	FEED THROUGH CAPACITOR
high	1 mm
Minimum insulation resistance	10000 MΩ
JESD-609 code	e3
length	2 mm
Manufacturer's serial number	BLC
Installation type	SURFACE MOUNT
Number of functions	1
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
method of packing	BULK
physical size	L2.0XB1.25XH1.0 (mm)/L0.079XB0.049XH0.039 (inch)
Rated voltage	25 V
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrier
Base Number Matches	1

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Integrated

Passive Components

Balanced Line EMI Chip

BLC

The Syfer Balanced Line Chip is a 3 terminal EMI chip device. The

revolutionary design provides simultaneous line-to-line and line-to-

ground filtering, using a single ceramic chip. In this way, differential

and common mode filtering are provided in one device. Capable of

replacing 2 or more conventional devices, it is ideal for balanced lines,

twisted pairs and dc motors, in automotive, audio, sensor and other

applications.

These filters can prove invaluable in meeting stringent EMC demands

particularly in automotive applications.

Specifications

Dielectric

Electrical Configuration

Capacitance Measurement

Typical Capacitance Matching

Temperature Rating

Dielectric Withstand Volage

Insulation Resistance

Termination Material

X7R or C0G

Multiple capacitance

At 1000hr point

Better than 5%

-55°C to 125°C

2.5 x Rated Volts for 5 secs.

Charging current limited to 50mA Max.

10,000 Mohms Min

Nickel Barrier

Advantages

●

Replaces 2 or 3 capacitors with one device

●

Matched capacitance line to ground on both lines

●

Low inductance due to cancellation effect

●

Capacitance line to line

●

Differential and common mode attenuation

●

Effects of temperature and voltage variation eliminated

●

Effect of ageing equal on both lines

●

High current capability

INPUT 1

GROUND

Applications

●

Balanced lines

●

Twisted pairs

●

EMI Suppression on DC motors

●

Sensor/transducer applications

●

Wireless communications

●

Audio

INPUT 2

Chip

Size

0603*

0805

1206

1410

1812

2220

1.6±0.2 (0.063±0.008)

2.0±0.3 (0.08±0.012)

3.2±0.3 (0.126±0.012)

3.6±0.3 (0.14±0.012)

4.5±0.35 (0.18±0.14)

5.7±0.4 (0.22±0.016)

0.8±0.2 (0.03±0.008)

1.25±0.2 (0.05±0.008)

1.60±0.2 (0.063±0.008)

2.5±0.3 (0.1±0.012)

3.2±0.3 (0.126±0.012)

5.0±0.4 (0.2±0.016)

0.5±0.15 (0.02±0.006)

1.0±0.15 (0.04±0.006)

1.1±0.2 (0.43±0.008)

2 max. (0.08 max.)

2.5 max. (0.1 max.)

0.3±0.2 (0.012±0.008)

0.5±0.25 (0.02±0.01)

0.95±0.3 (0.037±0.012)

1.20±0.3 (0.047±0.012)

1.5±0.35 (0.6±0.14)

2.25±0.4 (0.09±0.016)

0.2±0.1 (0.008±0.004)

0.3±0.15 (0.012±0.006)

0.5±0.25 (0.02±0.01)

0.75±0.25 (0.03±0.01)

Recommended Solder Lands

Insertion Loss Characteristics (common mode)

Typical 50 ohm system

220nF

4.7nF

2.2nF

1nF

470pF

220pF

100pF

47pF

22pF

100nF

47nF

22nF

10nF

Chip Size

0603*

0805

1206

1410

1812

2220

0.6 (0.024)

0.95 (0.037)

1.2 (0.047)

2.05 (0.08)

2.65 (0.104)

4.15 (0.163)

Dimensions

0.6 (0.024)

0.9 (0.035)

1.0 (0.04)

1.4 (0.055)

mm (inches)

0.4 (0.016) 0.2 (0.008)

0.3 (0.012) 0.4 (0.016)

0.6 (0.024) 0.8 (0.03)

0.7 (0.028) 0.9 (0.035)

0.8 (0.03) 1.4 (0.055)

1.2 (0.047) 1.8 (0.071)

Insertion Loss (dB)

0.1

100

1000

Frequency (MHz)

notes

1. For details of ordering see page 62

2. For soldering and installation information see page 69

The 0603 chip size is a development item that will be available during the life

of this catalogue. All technical information should be considered provisional

and subject to change.

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