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70914S25PFGB

Description
Dual-Port SRAM, 4KX9, 25ns, CMOS, PQFP80, 14 X 14 X 1.40 MM, GREEN, TQFP-80
Categorystorage    storage   
File Size117KB,12 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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70914S25PFGB Overview

Dual-Port SRAM, 4KX9, 25ns, CMOS, PQFP80, 14 X 14 X 1.40 MM, GREEN, TQFP-80

70914S25PFGB Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instructionQFP, QFP80,.64SQ
Contacts80
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time25 ns
I/O typeCOMMON
JESD-30 codeS-PQFP-G80
JESD-609 codee3
length14 mm
memory density36864 bit
Memory IC TypeDUAL-PORT SRAM
memory width9
Humidity sensitivity level3
Number of functions1
Number of ports2
Number of terminals80
word count4096 words
character code4000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize4KX9
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP80,.64SQ
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
Filter levelMIL-PRF-38535
Maximum seat height1.6 mm
Maximum standby current0.02 A
Minimum standby current4.5 V
Maximum slew rate0.29 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width14 mm
Base Number Matches1
HIGH SPEED 36K (4K X 9)
SYNCHRONOUS
DUAL-PORT RAM
Features
IDT70914S
LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018
High-speed clock-to-data output times
– Commercial: 12/15/20ns (max.)
Low-power operation
– IDT70914S
Active: 850 mW (typ.)
Standby: 50 mW (typ.)
Architecture based on Dual-Port RAM cells
– Allows full simultaneous access from both ports
Synchronous operation
– 4ns setup to clock, 1ns hold on all control, data, and address
inputs
– Data input, address, and control registers
– Fast 12ns clock to data out
– Self-timed write allows fast cycle times
– 16ns cycle times, 60MHz operation
Clock Enable feature
TTL-compatible, single 5V (+ 10%) power supply
Guaranteed data output hold times
Available in 68-pin PLCC, and 80-pin TQFP
Industrial temperature range (-40°C to +85°C) is available for
selected speeds
Green parts available, see ordering information
Functional Block Diagram
REGISTER
REGISTER
I/O
0-8L
WRITE
LOGIC
MEMOR
MEMORY
Y
ARRAY
ARRAY
WRITE
LOGIC
I/O
0-8R
SENSE
SENSE
AMPS DECODER DECODER AMPS
OE
L
CLK
L
CLKEN
L
Self-
timed
Write
Logic
REG
en
REG
en
OE
R
CLK
R
CLKEN
R
Self-
timed
Write
Logic
R/W
L
CE
L
REG
REG
R/W
R
CE
R
3490 drw 01
A
0L
-A
11L
A
0R
-A
11R
FEBUARY 2018
1
©2018 Integrated Device Technology, Inc.
DSC-3490/11

70914S25PFGB Related Products

70914S25PFGB 70914S20JG 70914S20JGB
Description Dual-Port SRAM, 4KX9, 25ns, CMOS, PQFP80, 14 X 14 X 1.40 MM, GREEN, TQFP-80 Dual-Port SRAM, 4KX9, 20ns, CMOS, PQCC68, 0.950 X 0.950 X 0.170 INCH, GREEN, PLASTIC, LCC-68 Dual-Port SRAM, 4KX9, 20ns, CMOS, PQCC68, 0.950 X 0.950 X 0.170 INCH, GREEN, PLASTIC, LCC-68
Is it lead-free? Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code QFP LCC LCC
package instruction QFP, QFP80,.64SQ QCCJ, LDCC68,1.0SQ QCCJ, LDCC68,1.0SQ
Contacts 80 68 68
Reach Compliance Code compliant compliant compliant
ECCN code 3A001.A.2.C EAR99 3A001.A.2.C
Maximum access time 25 ns 20 ns 20 ns
I/O type COMMON COMMON COMMON
JESD-30 code S-PQFP-G80 S-PQCC-J68 S-PQCC-J68
JESD-609 code e3 e3 e3
length 14 mm 24.13 mm 24.13 mm
memory density 36864 bit 36864 bit 36864 bit
Memory IC Type DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
memory width 9 9 9
Humidity sensitivity level 3 1 1
Number of functions 1 1 1
Number of ports 2 2 2
Number of terminals 80 68 68
word count 4096 words 4096 words 4096 words
character code 4000 4000 4000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 70 °C 125 °C
Minimum operating temperature -55 °C - -55 °C
organize 4KX9 4KX9 4KX9
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP QCCJ QCCJ
Encapsulate equivalent code QFP80,.64SQ LDCC68,1.0SQ LDCC68,1.0SQ
Package shape SQUARE SQUARE SQUARE
Package form FLATPACK CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 4.572 mm 4.572 mm
Maximum standby current 0.02 A 0.015 A 0.02 A
Minimum standby current 4.5 V 4.5 V 4.5 V
Maximum slew rate 0.29 mA 0.29 mA 0.29 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level MILITARY COMMERCIAL MILITARY
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal form GULL WING J BEND J BEND
Terminal pitch 0.635 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 30 30
width 14 mm 24.13 mm 24.13 mm
Base Number Matches 1 1 1
Filter level MIL-PRF-38535 - MIL-PRF-38535

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