AHC SERIES, QUAD 2-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 14 |
| Reach Compliance Code | compliant |
| series | AHC |
| JESD-30 code | R-GDIP-T14 |
| length | 19.56 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.008 A |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Maximum supply current (ICC) | 0.02 mA |
| Prop。Delay @ Nom-Sup | 8.5 ns |
| propagation delay (tpd) | 13 ns |
| Certification status | Qualified |
| Schmitt trigger | NO |
| Filter level | MIL-STD-883 |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 5962-9682201QCX | 5962-9682201Q2X | 5962-9682201QDX | |
|---|---|---|---|
| Description | AHC SERIES, QUAD 2-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 | AHC SERIES, QUAD 2-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 | AHC SERIES, QUAD 2-INPUT NAND GATE, CDFP14, CERAMIC, DFP-14 |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments |
| Parts packaging code | DIP | QLCC | DFP |
| package instruction | DIP, | CERAMIC, LCC-20 | QFF, |
| Contacts | 14 | 20 | 14 |
| Reach Compliance Code | compliant | compliant | compliant |
| series | AHC | AHC | AHC |
| JESD-30 code | R-GDIP-T14 | S-CQCC-N20 | R-GDFP-F14 |
| length | 19.56 mm | 8.89 mm | 9.21 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.008 A | 0.008 A | 0.008 A |
| Number of functions | 4 | 4 | 4 |
| Number of entries | 2 | 2 | 2 |
| Number of terminals | 14 | 20 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | QCCN | QFF |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | FLATPACK |
| Maximum supply current (ICC) | 0.02 mA | 0.02 mA | 0.02 mA |
| Prop。Delay @ Nom-Sup | 8.5 ns | 8.5 ns | 8.5 ns |
| propagation delay (tpd) | 13 ns | 13 ns | 13 ns |
| Certification status | Qualified | Qualified | Qualified |
| Schmitt trigger | NO | NO | NO |
| Filter level | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| Maximum seat height | 5.08 mm | 2.03 mm | 2.03 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| surface mount | NO | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | NO LEAD | FLAT |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL |
| width | 7.62 mm | 8.89 mm | 6.285 mm |
| Base Number Matches | 1 | 1 | - |
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