|
5962-9099602MUC |
5962-9099602MXC |
5962-9099603MYC |
5962-9099602MYC |
5962-9099604MYC |
5962-9099603MXC |
5962-9099604MXC |
5962-9099604MUC |
5962-9099603MUC |
| Description |
Multiplier Accumulator/Summer, 12-Bit, CMOS, CPGA68, CAVITY-DOWN, CERAMIC, PGA-68 |
Multiplier Accumulator/Summer, 12-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64 |
Multiplier Accumulator/Summer, 12-Bit, CMOS, CQCC68, 0.950 X 0.950 INCH, CERAMIC, LCC-68 |
Multiplier Accumulator/Summer, 12-Bit, CMOS, CQCC68, 0.950 X 0.950 INCH, CERAMIC, LCC-68 |
Multiplier Accumulator/Summer, 12-Bit, CMOS, CQCC68, 0.950 X 0.950 INCH, CERAMIC, LCC-68 |
Multiplier Accumulator/Summer, 12-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64 |
Multiplier Accumulator/Summer, 12-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64 |
Multiplier Accumulator/Summer, 12-Bit, CMOS, CPGA68, CAVITY-DOWN, CERAMIC, PGA-68 |
Multiplier Accumulator/Summer, 12-Bit, CMOS, CPGA68, CAVITY-DOWN, CERAMIC, PGA-68 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Parts packaging code |
PGA |
DIP |
LCC |
LCC |
LCC |
DIP |
DIP |
PGA |
PGA |
| package instruction |
PGA, |
DIP, |
QCCN, |
QCCN, |
QCCN, |
DIP, |
DIP, |
PGA, |
PGA, |
| Contacts |
68 |
64 |
68 |
68 |
68 |
64 |
64 |
68 |
68 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
| ECCN code |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
| Other features |
2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ |
2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ |
2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ |
2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ |
2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ |
2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ |
2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ |
2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ |
2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ |
| boundary scan |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
| External data bus width |
12 |
12 |
12 |
12 |
12 |
12 |
12 |
12 |
12 |
| JESD-30 code |
S-CPGA-P68 |
R-CDIP-T64 |
S-CQCC-N68 |
S-CQCC-N68 |
S-CQCC-N68 |
R-CDIP-T64 |
R-CDIP-T64 |
S-CPGA-P68 |
S-CPGA-P68 |
| JESD-609 code |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
| length |
29.4386 mm |
81.28 mm |
24.1935 mm |
24.1935 mm |
24.1935 mm |
81.28 mm |
81.28 mm |
29.4386 mm |
29.4386 mm |
| low power mode |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
| Humidity sensitivity level |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
| Number of terminals |
68 |
64 |
68 |
68 |
68 |
64 |
64 |
68 |
68 |
| Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
| Output data bus width |
27 |
27 |
27 |
27 |
27 |
27 |
27 |
27 |
27 |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
PGA |
DIP |
QCCN |
QCCN |
QCCN |
DIP |
DIP |
PGA |
PGA |
| Package shape |
SQUARE |
RECTANGULAR |
SQUARE |
SQUARE |
SQUARE |
RECTANGULAR |
RECTANGULAR |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY |
IN-LINE |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
IN-LINE |
IN-LINE |
GRID ARRAY |
GRID ARRAY |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Filter level |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
| Maximum seat height |
3.81 mm |
3.81 mm |
3.048 mm |
3.048 mm |
3.048 mm |
3.81 mm |
3.81 mm |
3.81 mm |
3.81 mm |
| Maximum slew rate |
25 mA |
25 mA |
25 mA |
25 mA |
25 mA |
25 mA |
25 mA |
25 mA |
25 mA |
| Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
NO |
NO |
YES |
YES |
YES |
NO |
NO |
NO |
NO |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
| Terminal surface |
GOLD |
GOLD |
GOLD |
GOLD |
GOLD |
GOLD |
GOLD |
GOLD |
GOLD |
| Terminal form |
PIN/PEG |
THROUGH-HOLE |
NO LEAD |
NO LEAD |
NO LEAD |
THROUGH-HOLE |
THROUGH-HOLE |
PIN/PEG |
PIN/PEG |
| Terminal pitch |
2.54 mm |
2.54 mm |
1.27 mm |
1.27 mm |
1.27 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
| Terminal location |
PERPENDICULAR |
DUAL |
QUAD |
QUAD |
QUAD |
DUAL |
DUAL |
PERPENDICULAR |
PERPENDICULAR |
| width |
29.4386 mm |
22.86 mm |
24.1935 mm |
24.1935 mm |
24.1935 mm |
22.86 mm |
22.86 mm |
29.4386 mm |
29.4386 mm |
| uPs/uCs/peripheral integrated circuit type |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
| Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Maker |
LOGIC Devices |
- |
LOGIC Devices |
- |
- |
- |
LOGIC Devices |
LOGIC Devices |
LOGIC Devices |