EEWORLDEEWORLDEEWORLD

Part Number

Search

U0404FC3.3C

Description
UNBUMPED FLIP CHIP ARRAY
CategoryDiscrete semiconductor    diode   
File Size101KB,6 Pages
ManufacturerProTek Devices
Websitehttp://www.protekdevices.com/
Download Datasheet Parametric Compare View All

U0404FC3.3C Overview

UNBUMPED FLIP CHIP ARRAY

U0404FC3.3C Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeFLIP-CHIP
package instructionR-PBGA-B4
Contacts4
Reach Compliance Codecompli
ECCN codeEAR99
Minimum breakdown voltage4 V
Breakdown voltage nominal value4 V
Maximum clamping voltage12.5 V
ConfigurationCOMMON BIPOLAR TERMINAL, 3 ELEMENTS
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-PBGA-B4
JESD-609 codee0
Humidity sensitivity level1
Maximum non-repetitive peak reverse power dissipation250 W
Number of components3
Number of terminals4
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)245
polarityBIDIRECTIONAL
Certification statusNot Qualified
Maximum repetitive peak reverse voltage3.3 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
05159
U0404FC3.3C
thru
Only One Name Means ProT
ek’Tion™
U0404FC36C
UNBUMPED FLIP CHIP ARRA
Y
APPLICA
TIONS
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
IEC COMPA
TIBILITY
(EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
ESD Protection > 25 kilovolts
Available in Multiple Voltage Types Ranging From 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
Bidirectional Configuration & Monolithic Structure
Protects 1 to 3 Lines
RoHS Compliant
MECHANICAL CHARACTERISTICS
Standard EIA Chip Size: 0404
Weight 0.73 milligrams (Approximate)
Solder Reflow Temperature:
Tin-Lead - Sn/Pb: 240-245°C
Lead-Free: 260-270°C
Flammability Rating UL 94V-0
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
Device Marking On Reel
PIN CONFIGURA
TION
05159.R4 3/05
1
www.protekdevices.com

U0404FC3.3C Related Products

U0404FC3.3C U0404FC05C U0404FC33C U0404FC36C U0404FC15C U0404FC24C U0404FC08C U0404FC12C
Description UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY
Is it Rohs certified? incompatible incompatible - incompatible incompatible incompatible incompatible incompatible
Parts packaging code FLIP-CHIP FLIP-CHIP - FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP
package instruction R-PBGA-B4 R-PBGA-B4 - R-PBGA-B4 R-PBGA-B4 R-PBGA-B4 R-PBGA-B4 R-PBGA-B4
Contacts 4 4 - 4 4 4 4 4
Reach Compliance Code compli compli - compli compli compli compli compli
ECCN code EAR99 EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99
Minimum breakdown voltage 4 V 6 V - 40 V 16.7 V 26.7 V 8.5 V 13.3 V
Breakdown voltage nominal value 4 V 6 V - 40 V 16.7 V 26.7 V 8.5 V 13.3 V
Maximum clamping voltage 12.5 V 14.7 V - 84 V 35.7 V 55 V 19.2 V 29.7 V
Configuration COMMON BIPOLAR TERMINAL, 3 ELEMENTS COMMON BIPOLAR TERMINAL, 3 ELEMENTS - COMMON BIPOLAR TERMINAL, 3 ELEMENTS COMMON BIPOLAR TERMINAL, 3 ELEMENTS COMMON BIPOLAR TERMINAL, 3 ELEMENTS COMMON BIPOLAR TERMINAL, 3 ELEMENTS COMMON BIPOLAR TERMINAL, 3 ELEMENTS
Diode component materials SILICON SILICON - SILICON SILICON SILICON SILICON SILICON
Diode type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE - TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code R-PBGA-B4 R-PBGA-B4 - R-PBGA-B4 R-PBGA-B4 R-PBGA-B4 R-PBGA-B4 R-PBGA-B4
JESD-609 code e0 e0 - e0 e0 e0 e0 e0
Humidity sensitivity level 1 1 - 1 1 1 1 1
Maximum non-repetitive peak reverse power dissipation 250 W 250 W - 250 W 250 W 250 W 250 W 250 W
Number of components 3 3 - 3 3 3 3 3
Number of terminals 4 4 - 4 4 4 4 4
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY - GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 245 245 - 245 245 245 245 245
polarity BIDIRECTIONAL BIDIRECTIONAL - BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum repetitive peak reverse voltage 3.3 V 5 V - 36 V 15 V 24 V 8 V 12 V
surface mount YES YES - YES YES YES YES YES
technology AVALANCHE AVALANCHE - AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL - BALL BALL BALL BALL BALL
Terminal location BOTTOM BOTTOM - BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Base Number Matches 1 1 - 1 1 1 1 1
How to add Windows CE startup items without modifying nk.bin so that the program starts with the system?
As the title says, is it possible to write only the booting stuff of Windows CE system into nk.bin, so that when the system starts, the driver of the storage device is loaded first, and then the stora...
ttww007 Embedded System
Please advise on application issues, how to install touch screen driver in WINCE5.0 system
I'm new to diving. I've been diving for many days, but I still don't know how to do it. Please teach me a method, thank you! I have an instrument with a 12-inch LCD and a touch screen. The LCD screen ...
redfox29 Embedded System
See if you can design this circuit?
Title: Interlocking of two high-level signals. Requirements: There are two signals, both of which are low level (0V) when normal and high level (12V) when abnormal. However, the time when the two high...
lixiaohai8211 Analog electronics
F2812 serial communication, a batch of data is sent without writing data when powered on?
[align=left][color=#000000][font=Calibri] [/font]As the title says, [font=Calibri]F2812[/font] has just powered on and initialized [font=Calibri]SCI[/font], and when I check [font=Calibri]SCITXBUF[/fo...
ordinarymengya DSP and ARM Processors
I have a problem with DM9000. I have been dealing with it for a long time. Can you please help me?
The platform is S3C2410. DM9000 is connected to ngsc1. I mainly add the function of DM9000 to eboot so that it can download the kernel file in eboot. Now, the product ID of DM9000 can be read. This sh...
zhrglchp Embedded System
Selection of DC Blocking Capacitor on Primary Side of Transformer in Full-bridge Inverter Circuit
In the full-bridge inverter circuit, the maximum voltage Ucbp across the DC blocking capacitor Cb is about 10% of the input rectified voltage, which is a basis for designing the DC blocking capacitor....
ole007 LED Zone

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2150  2476  1225  80  1427  44  50  25  2  29 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号