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74ALVCF162835APA

Description
TSSOP-56, Tube
Categorylogic   
File Size244KB,7 Pages
ManufacturerIDT (Integrated Device Technology)
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74ALVCF162835APA Overview

TSSOP-56, Tube

74ALVCF162835APA Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeTSSOP
package instructionTSSOP, TSSOP56,.3,20
Contacts56
Manufacturer packaging codePA56
Reach Compliance Codenot_compliant
ECCN codeEAR99
seriesALVC/VCX/A
JESD-30 codeR-PDSO-G56
JESD-609 codee0
length14 mm
Logic integrated circuit typeBUS DRIVER
Humidity sensitivity level1
Number of digits18
Number of functions1
Number of ports2
Number of terminals56
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE WITH SERIES RESISTOR
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP56,.3,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)240
power supply2.5/3.3 V
propagation delay (tpd)5.6 ns
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature20
width6.1 mm
Base Number Matches1
IDT74ALVCF162835A
3.3V CMOS 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS
INDUSTRIAL TEMPERATURE RANGE
3.3V CMOS 18-BIT
UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
FEATURES:
• 0.5 MICRON CMOS Technology
• Typical t
SK(o)
(Output Skew) < 250ps
• ESD > 2000V per MIL-STD-883, Method 3015; > 200V using
machine model (C = 200pF, R = 0)
• V
CC
= 3.3V ± 0.3V, Normal Range
• V
CC
= 2.7V to 3.6V, Extended Range
• V
CC
= 2.5V ± 0.2V
• CMOS power levels (0.4μ W typ. static)
μ
• Rail-to-Rail output swing for increased noise margin
• Available in TSSOP and TVSOP packages
IDT74ALVCF162835A
DESCRIPTION:
This 18-bit universal bus driver is built using advanced dual metal CMOS
technology. Data flow from A to Y is controlled by the output-enable (OE)
input. The device operates in the transparent mode when the latch-enable
(LE) input is high. The A data is latched if the clock (CLK) input is held at
a high or low logic level. If LE is low, the A data is stored in the latch flip-flop
on the low-to-high transition of CLK. When
OE
is high, the outputs are in the
high-impedance state.
The ALVCF162835A has series resistors in the device output structure
which will reduce switching noise in 128MB and 256MB SDRAM modules.
Designed with a drive capability of ±18mA, the ALVCF162835A is a mid-
way drive between the ALVC162835 (±12mA) and ALVC16835 (±24mA).
The ALVCF162835A is a faster version of the ALVCF162835 or
ALVC162835. It is suitable for PC133 applications and particularly SDRAM
Modules clocked at 133 MHz.
DRIVE FEATURES:
• Balanced Output Drivers: ±18mA
• Low switching noise
APPLICATIONS:
• SDRAM Modules
• PC Motherboards
• Workstations
FUNCTIONAL BLOCK DIAGRAM
OE
CLK
LE
A
1
27
30
28
54
1
D
3
C
1
CLK
Y
1
TO 17 OTHER CHANNELS
INDUSTRIAL TEMPERATURE RANGE
1
© 2008 Integrated Device Technology, Inc.
NOVEMBER 2008
DSC-4920/5

74ALVCF162835APA Related Products

74ALVCF162835APA 74ALVCF162835APF 74ALVCF162835APFG8 74ALVCF162835APAG8 74ALVCF162835APA8 74ALVCF162835APAG
Description TSSOP-56, Tube TVSOP-56, Tube TVSOP-56, Reel TSSOP-56, Reel TSSOP-56, Reel TSSOP-56, Tube
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Contains lead Contains lead Lead free Lead free Contains lead Lead free
Is it Rohs certified? incompatible incompatible conform to conform to incompatible conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code TSSOP TVSOP TVSOP TSSOP TSSOP TSSOP
package instruction TSSOP, TSSOP56,.3,20 TVSOP-56 TSSOP, TSSOP56,.25,16 TSSOP, TSSOP56,.3,20 TSSOP, TSSOP56,.3,20 TSSOP, TSSOP56,.3,20
Contacts 56 56 56 56 56 56
Manufacturer packaging code PA56 PF56 PFG56 PAG56 PA56 PAG56
Reach Compliance Code not_compliant not_compliant unknown compliant not_compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
series ALVC/VCX/A ALVC/VCX/A ALVC/VCX/A ALVC/VCX/A ALVC/VCX/A ALVC/VCX/A
JESD-30 code R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56 R-PDSO-G56
JESD-609 code e0 e0 e3 e3 e0 e3
length 14 mm 11.3 mm 11.3 mm 14 mm 14 mm 14 mm
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
Humidity sensitivity level 1 1 1 1 1 1
Number of digits 18 18 18 18 18 18
Number of functions 1 1 1 1 1 1
Number of ports 2 2 2 2 2 2
Number of terminals 56 56 56 56 56 56
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR
Output polarity TRUE TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP
Encapsulate equivalent code TSSOP56,.3,20 TSSOP56,.25,16 TSSOP56,.25,16 TSSOP56,.3,20 TSSOP56,.3,20 TSSOP56,.3,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 240 240 260 260 240 260
power supply 2.5/3.3 V 2.5/3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
propagation delay (tpd) 5.6 ns 5.6 ns 5.6 ns 5.6 ns 5.6 ns 5.6 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15) Matte Tin (Sn) - annealed
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.4 mm 0.4 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 20 20 30 30 20 30
width 6.1 mm 4.4 mm 4.4 mm 6.1 mm 6.1 mm 6.1 mm
Base Number Matches 1 1 1 1 1 1
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