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AM29LV800BB-120WBD

Description
512K X 16 FLASH 3V PROM, 70 ns, PDSO48
Categorystorage    storage   
File Size849KB,49 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Environmental Compliance
Download Datasheet Parametric View All

AM29LV800BB-120WBD Overview

512K X 16 FLASH 3V PROM, 70 ns, PDSO48

AM29LV800BB-120WBD Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerAMD
package instructionFBGA, BGA48,6X8,32
Reach Compliance Codeunknow
Maximum access time120 ns
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Data pollingYES
Durability1000000 Write/Erase Cycles
JESD-30 codeR-PBGA-B48
memory density8388608 bi
Memory IC TypeFLASH
memory width16
Number of departments/size1,2,1,15
Number of terminals48
word count524288 words
character code512000
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX16
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA48,6X8,32
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
Parallel/SerialPARALLEL
power supply3/3.3 V
Certification statusNot Qualified
ready/busyYES
Department size16K,8K,32K,64K
Maximum standby current0.000005 A
Maximum slew rate0.03 mA
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
switch bitYES
typeNOR TYPE
Am29LV800B
Data Sheet
RETIRED
PRODUCT
This product has been retired and is not recommended for designs. For new and current designs,
S29AL008D supersedes Am29LV800B and is the factory-recommended migration path. Please refer
to the S29AL008D datasheet for specifications and ordering information. Availability of this docu-
ment is retained for reference and historical purposes only.
July 2003
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that
originally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appro-
priate, and changes will be noted in a revision summary.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
Publication Number
21490
Revision
G
Amendment
5
Issue Date
May 25, 2005

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