5962-8873401JX datasheet, PDF - EEWORLD Datasheet

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5962-8873401JX: DescriptionOTP ROM, 2KX8, 55ns, CMOS, CDIP24, CERAMIC, DIP-24; Categorystorage; File Size76KB，13 Pages; ManufacturerWaferscale Integration Inc.

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5962-8873401JX Overview

OTP ROM, 2KX8, 55ns, CMOS, CDIP24, CERAMIC, DIP-24

5962-8873401JX Parametric

Parameter Name	Attribute value
Maker	Waferscale Integration Inc.
package instruction	CERAMIC, DIP-24
Reach Compliance Code	unknown
Maximum access time	55 ns
JESD-30 code	R-GDIP-T24
memory density	16384 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX8
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal location	DUAL
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Changes in accordance with NOR 5962-R232-93

Drawing updated to reflect current requirements. Removed

programming logic from truth table B. Editorial changes throughout. -

gap

5 year review and update. Changed input capacitance from 6 pF to

10 pF. ksr

DATE (YR-MO-DA)

93-09-21

00-11-02

APPROVED

Michael A. Frye

Raymond Monnin

06-06-12

Raymond Monnin

THE FRONT PAGE OF THIS DRAWING HAS BEEN REPLACED

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Steve Duncan

CHECKED BY

Ray Monnin

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

APPROVED BY

Michael A. Frye

DRAWING APPROVAL DATE

89-04-26

MICROCIRCUIT, MEMORY,

DIGITAL, CMOS, 2K X 8-BIT,

ONE TIME PROGRAMMABLE

(OTP) PROM, MONOLITHIC

SILICON

SIZE

SHEET

CAGE CODE

AMSC N/A

REVISION LEVEL

67268

1 OF

5962-88734

5962-E481-06

DSCC FORM 2233

APR 97

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-

PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying

activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan

may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.

These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-

PRF-38535 is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535, appendix A and herein.

3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.2 Truth tables. The truth tables shall be as specified on figure 2.

3.2.2.1 Unprogrammed or erased devices. The truth table for unprogrammed devices for contracts involving no altered item

drawing shall be as specified on figure 2 as applicable. When required in groups A, B, or C inspection (see 4.3), the devices

shall be programmed by the manufacturer prior to test in a checkerboard pattern or equivalent (a minimum of 50 percent of the

total number of bits programmed) or to any altered item drawing pattern which includes at least 25 percent of the total number

of bits programmed.

3.2.2.2 Programmed devices. The truth tables for programmed devices shall be as specified by an attached altered item

drawing.

3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full case operating temperature range.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-88734

SHEET

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed

in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN

number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.

3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance

to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in

accordance with MIL-PRF-38535 to identify when the QML flow option is used.

3.6 Processing options. Since the PROM is an unprogrammed memory capable of being programmed by either the

manufacturer or the user to result in a wide variety of PROM configurations, two processing options are provided for selection

in the contract using an altered item drawing.

3.6.1 Unprogrammed PROM delivered to the user. All testing shall be verified through group A testing as defined in 4.3.1. It

is recommended that users perform subgroups 7 and 9 after programming to verify the specific program configuration.

3.6.2 Manufacturer-programmed PROM delivered to the user. All testing requirements and quality assurance provisions

herein, including the requirements of the altered item drawing shall be satisfied by the manufacturer prior to delivery.

3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an

approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to

listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,

appendix A and the requirements herein.

3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided

with each lot of microcircuits delivered to this drawing.

3.9 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.

3.10 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's

facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the

reviewer.

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,

appendix A.

4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices

prior to quality conformance inspection. The following additional criteria shall apply:

Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition C, D, or E. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method

1015 of MIL-STD-883.

(2) T

= +125°C, minimum.

Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter

tests prior to burn-in are optional at the discretion of the manufacturer.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-88734

SHEET

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