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5962-8873403LX

Description
OTP ROM, 2KX8, 35ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24
Categorystorage   
File Size326KB,15 Pages
ManufacturerCypress Semiconductor
Download Datasheet Parametric Compare View All

5962-8873403LX Overview

OTP ROM, 2KX8, 35ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24

5962-8873403LX Parametric

Parameter NameAttribute value
MakerCypress Semiconductor
Parts packaging codeDIP
package instructionDIP,
Contacts24
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time35 ns
JESD-30 codeR-GDIP-T24
memory density16384 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals24
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX8
Output characteristics3-STATE
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal locationDUAL
Base Number Matches1

5962-8873403LX Related Products

5962-8873403LX 5962-8765005LX
Description OTP ROM, 2KX8, 35ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24
Parts packaging code DIP DIP
package instruction DIP, DIP, DIP24,.3
Contacts 24 24
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Maximum access time 35 ns 25 ns
JESD-30 code R-GDIP-T24 R-GDIP-T24
memory density 16384 bit 16384 bit
Memory IC Type OTP ROM UVPROM
memory width 8 8
Number of functions 1 1
Number of terminals 24 24
word count 2048 words 2048 words
character code 2000 2000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C
organize 2KX8 2KX8
Output characteristics 3-STATE 3-STATE
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code DIP DIP
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Certification status Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount NO NO
technology CMOS CMOS
Temperature level MILITARY MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal location DUAL DUAL
Base Number Matches 1 1
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