FIFO, 2KX9, 80ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, THIN, CERAMIC, DIP-28
| Parameter Name | Attribute value |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 80 ns |
| Other features | RETRANSMIT |
| period time | 100 ns |
| JESD-30 code | R-GDIP-T28 |
| JESD-609 code | e0 |
| length | 37.1475 mm |
| memory density | 18432 bit |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX9 |
| Output characteristics | 3-STATE |
| Exportable | NO |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
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