AM29LV320MH112FF datasheet, PDF

AM29LV320MH112FF: Description2M X 16 FLASH 3V PROM, 100 ns, PDSO56; Categorystorage storage; File Size575KB，59 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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AM29LV320MH112FF Overview

2M X 16 FLASH 3V PROM, 100 ns, PDSO56

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	TSOP1
package instruction	REVERSE, MO-142EC, TSOP-56
Contacts	56
Reach Compliance Code	compli
ECCN code	3A991.B.1.A
Maximum access time	110 ns
Spare memory width	8
startup block	BOTTOM/TOP
JESD-30 code	R-PDSO-G56
JESD-609 code	e3
length	18.4 mm
memory density	33554432 bi
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	56
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	250
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
type	NOR TYPE
width	14 mm

Am29LV320MH/L

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not available for designs. For new and current designs,

S29GL032A supersedes Am29LV320M H/L and is the factory-recommended migration path. Please

refer to the S29GL032A datasheet for specifications and ordering information. Availability of this

document is retained for reference and historical purposes only.

April 2005

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that

originally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appro-

priate, and changes will be noted in a revision summary.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

26517

Revision

Amendment

Issue Date

December 14, 2005

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