AM29LV320DB90EC datasheet, PDF

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AM29LV320DB90EC: Description2M X 16 FLASH 3V PROM, 90 ns, PDSO48; Categorystorage storage; File Size828KB，55 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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AM29LV320DB90EC Overview

2M X 16 FLASH 3V PROM, 90 ns, PDSO48

AM29LV320DB90EC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	TSOP1
package instruction	MO-142DD, TSOP-48
Contacts	48
Reach Compliance Code	not_compliant
ECCN code	3A991.B.1.A
Maximum access time	90 ns
Other features	BOTTOM BOOT BLOCK
Spare memory width	8
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PDSO-G48
JESD-609 code	e0
length	18.4 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	8,63
Number of terminals	48
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP48,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	8K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	20
switch bit	YES
type	NOR TYPE
width	12 mm
Base Number Matches	1

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Am29LV320D

Data Sheet

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-

inally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropriate,

and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order

these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

23579

Revision

Amendment

Issue Date

November 15, 2004

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 7

Special Package Handling Instructions .................................... 8

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Ordering Information . . . . . . . . . . . . . . . . . . . . . . 10

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 11

Table 1. Am29LV320D Device Bus Operations ..............................11

Figure 4. Program Operation ......................................................... 27

Chip Erase Command Sequence ........................................... 27

Sector Erase Command Sequence ........................................ 27

Erase Suspend/Erase Resume Commands ........................... 28

Figure 5. Erase Operation.............................................................. 28

Command Definitions ............................................................. 29

Table 14. Am29LV320D Command Definitions ............................. 29

Write Operation Status . . . . . . . . . . . . . . . . . . . . 30

DQ7: Data# Polling ................................................................. 30

Figure 6. Data# Polling Algorithm .................................................. 30

Word/Byte Configuration ........................................................ 11

Requirements for Reading Array Data ................................... 11

Writing Commands/Command Sequences ............................ 12

Accelerated Program Operation .......................................... 12

Autoselect Functions ........................................................... 12

Standby Mode ........................................................................ 12

Automatic Sleep Mode ........................................................... 13

RESET#: Hardware Reset Pin ............................................... 13

Output Disable Mode .............................................................. 13

Table 2. Top Boot Sector Addresses (Am29LV320DT) ..................13

Table 3. Top Boot SecSi

Sector Addresses................................ 14

Table 4. Bottom Boot Sector Addresses (Am29LV320DB) .............15

Table 5. Bottom Boot SecSi

Sector Addresses .......................... 16

RY/BY#: Ready/Busy# ............................................................ 31

DQ6: Toggle Bit I .................................................................... 31

Figure 7. Toggle Bit Algorithm........................................................ 31

DQ2: Toggle Bit II ................................................................... 32

Reading Toggle Bits DQ6/DQ2 ............................................... 32

DQ5: Exceeded Timing Limits ................................................ 32

DQ3: Sector Erase Timer ....................................................... 32

Table 15. Write Operation Status ................................................... 33

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34

Figure 8. Maximum Negative Overshoot Waveform ...................... 34

Figure 9. Maximum Positive Overshoot Waveform........................ 34

Autoselect Mode ..................................................................... 16

Table 6. Autoselect Codes (High Voltage Method) ........................16

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 10. I

CC1

Current vs. Time (Showing Active and

Automatic Sleep Currents) ............................................................. 36

Figure 11. Typical I

CC1

vs. Frequency ............................................ 36

Sector/Sector Block Protection and Unprotection .................. 17

Table 7. Top Boot Sector/Sector Block Addresses

for Protection/Unprotection .............................................................17

Table 8. Bottom Boot Sector/Sector Block

Addresses for Protection/Unprotection ...........................................17

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Figure 12. Test Setup.................................................................... 37

Table 16. Test Specifications ......................................................... 37

Figure 13. Input Waveforms and Measurement Levels ................. 37

Write Protect (WP#) ................................................................ 18

Temporary Sector Unprotect .................................................. 18

Figure 1. Temporary Sector Unprotect Operation........................... 18

Figure 2. In-System Sector Protect/Unprotect Algorithms .............. 19

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38

Figure 14. Read Operation Timings ............................................... 38

Figure 15. Reset Timings ............................................................... 39

SecSi

Sector (Secured Silicon) Flash Memory Region ....... 20

Factory Locked: SecSi Sector Programmed

and Protected at the Factory ............................................... 20

Customer Lockable: SecSi Sector NOT Programmed

or Protected at the Factory .................................................. 20

Figure 3. SecSi Sector Protect Verify.............................................. 21

Word/Byte Configuration (BYTE#) ............................................. 40

Figure 16. BYTE# Timings for Read Operations............................ 40

Figure 17. BYTE# Timings for Write Operations............................ 40

Erase and Program Operations ................................................. 41

Figure 18. Program Operation Timings..........................................

Figure 19. Chip/Sector Erase Operation Timings ..........................

Figure 20. Data# Polling Timings (During Embedded Algorithms).

Figure 21. Toggle Bit Timings (During Embedded Algorithms)......

Figure 22. DQ2 vs. DQ6.................................................................

Hardware Data Protection ...................................................... 21

Low VCC Write Inhibit ......................................................... 21

Write Pulse “Glitch” Protection ............................................ 21

Logical Inhibit ...................................................................... 21

Power-Up Write Inhibit ......................................................... 21

Common Flash Memory Interface (CFI) . . . . . . . 21

Table 9. CFI Query Identification String .......................................... 22

Table 10. System Interface String................................................... 22

Table 11. Device Geometry Definition ............................................ 23

Table 12. Primary Vendor-Specific Extended Query ...................... 24

Temporary Sector Unprotect ..................................................... 46

Figure 23. Temporary Sector Unprotect Timing Diagram .............. 46

Figure 24. Accelerated Program Timing Diagram.......................... 46

Figure 25. Sector/Sector Block Protect and

Unprotect Timing Diagram ............................................................. 47

Alternate CE# Controlled Erase and Program Operations ........ 48

Figure 26. Alternate CE# Controlled Write

(Erase/Program) Operation Timings .............................................. 49

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25

Reading Array Data ................................................................ 25

Reset Command ..................................................................... 25

Autoselect Command Sequence ............................................ 25

Table 13. Autoselect Codes ............................................................25

Enter SecSi

Sector/Exit SecSi Sector

Command Sequence .............................................................. 26

Byte/Word Program Command Sequence ............................. 26

Unlock Bypass Command Sequence .................................. 26

Erase And Programming Performance . . . . . . . 50

Latchup Characteristics . . . . . . . . . . . . . . . . . . . 50

TSOP and BGA Package Capacitance . . . . . . . . 50

Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 51

FBD048—48-ball Fine-Pitch Ball Grid Array (FBGA)

6 x 12 mm package ................................................................... 51

TS 048—48-Pin Standard TSOP ............................................... 52

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 53

November 15, 2004

Am29LV320D

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