AM29LV320DB50WMI datasheet, PDF

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AM29LV320DB50WMI: Description2M X 16 FLASH 3V PROM, 90 ns, PDSO48; Categorystorage; File Size626KB，57 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM29LV320DB50WMI Overview

2M X 16 FLASH 3V PROM, 90 ns, PDSO48

AM29LV320DB50WMI Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	48
Maximum operating temperature	70 Cel
Minimum operating temperature	0.0 Cel
Maximum supply/operating voltage	3.6 V
Minimum supply/operating voltage	2.7 V
Rated supply voltage	3 V
maximum access time	90 ns
Processing package description	MO-142DD, TSOP-48
state	DISCONTINUED
Craftsmanship	CMOS
packaging shape	Rectangle
Package Size	SMALL OUTLINE, THIN PROFILE
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.5000 mm
terminal coating	tin lead
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	COMMERCIAL
memory width	16
organize	2M × 16
storage density	3.36E7 deg
operating mode	ASYNCHRONOUS
Number of digits	2.10E6 words
Number of digits	2M
Spare memory width	8
Memory IC type	FLASH 3V programmable read-only memory
serial parallel	parallel

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Am29LV320D

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not available for designs. For new and current designs,

S29AL032D supersedes Am29LV320D and is the factory-recommended migration path. Please refer

to the S29AL032D datasheet for specifications and ordering information. Availability of this docu-

ment is retained for reference and historical purposes only.

April 2005

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that

originally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appro-

priate, and changes will be noted in a revision summary.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

23579

Revision

Amendment

Issue Date

December 14, 2005

D A T A S H E E T

TABLE OF CONTENTS

Continuity of Specifications ....................................................... i

For More Information ................................................................. i

Distinctive Characteristics . . . . . . . . . . . . . . . . . . 1

ARCHITECTURAL ADVANTAGES ...................................... 1

PERFORMANCE CHARACTERISTICS ............................... 1

SOFTWARE FEATURES ..................................................... 1

HARDWARE FEATURES .................................................... 1

General Description . . . . . . . . . . . . . . . . . . . . . . . 2

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6

Special Package Handling Instructions .................................... 7

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Am29LV320D Device Bus Operations ..............................10

Reset Command ..................................................................... 25

Autoselect Command Sequence ............................................ 25

Table 13. Autoselect Codes ........................................................... 25

Enter Secured Silicon Sector/Exit Secured Silicon Sector

Command Sequence .............................................................. 25

Byte/Word Program Command Sequence ............................. 26

Unlock Bypass Command Sequence .................................. 26

Figure 4. Program Operation ......................................................... 27

Chip Erase Command Sequence ........................................... 27

Sector Erase Command Sequence ........................................ 27

Erase Suspend/Erase Resume Commands ........................... 28

Figure 5. Erase Operation.............................................................. 28

Command Definitions ............................................................. 29

Table 14. Am29LV320D Command Definitions ............................. 29

Write Operation Status . . . . . . . . . . . . . . . . . . . . 30

DQ7: Data# Polling ................................................................. 30

Figure 6. Data# Polling Algorithm .................................................. 30

Word/Byte Configuration ........................................................ 11

Requirements for Reading Array Data ................................... 11

Writing Commands/Command Sequences ............................ 11

Accelerated Program Operation .......................................... 11

Autoselect Functions ........................................................... 11

Standby Mode ........................................................................ 12

Automatic Sleep Mode ........................................................... 12

RESET#: Hardware Reset Pin ............................................... 12

Output Disable Mode .............................................................. 12

Table 2. Top Boot Sector Addresses (Am29LV320DT) ..................13

Table 3. Top Boot Secured Silicon Sector Addresses ................... 14

Table 4. Bottom Boot Sector Addresses (Am29LV320DB) .............14

Table 5. Bottom Boot Secured Silicon Sector Addresses .............. 15

RY/BY#: Ready/Busy# ............................................................ 31

DQ6: Toggle Bit I .................................................................... 31

Figure 7. Toggle Bit Algorithm........................................................ 31

DQ2: Toggle Bit II ................................................................... 31

Reading Toggle Bits DQ6/DQ2 ............................................... 32

DQ5: Exceeded Timing Limits ................................................ 32

DQ3: Sector Erase Timer ....................................................... 32

Table 15. Write Operation Status ................................................... 33

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34

Figure 8. Maximum Negative Overshoot Waveform ...................... 34

Figure 9. Maximum Positive Overshoot Waveform........................ 34

Autoselect Mode ..................................................................... 16

Table 6. Autoselect Codes (High Voltage Method) ........................16

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35

CMOS Compatible .................................................................. 35

Zero-Power Flash ................................................................. 36

Figure 10. I

CC1

Current vs. Time (Showing Active and

Automatic Sleep Currents) ............................................................. 36

Figure 11. Typical I

CC1

vs. Frequency ............................................ 36

Sector/Sector Block Protection and Unprotection .................. 17

Table 7. Top Boot Sector/Sector Block Addresses

for Protection/Unprotection .............................................................17

Table 8. Bottom Boot Sector/Sector Block

Addresses for Protection/Unprotection ...........................................17

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Figure 12. Test Setup.................................................................... 37

Table 16. Test Specifications ......................................................... 37

Figure 13. Input Waveforms and Measurement Levels ................. 37

Write Protect (WP#) ................................................................ 18

Temporary Sector Unprotect .................................................. 18

Figure 1. Temporary Sector Unprotect Operation........................... 18

Figure 2. In-System Sector Protect/Unprotect Algorithms .............. 19

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38

Read-Only Operations ........................................................... 38

Figure 14. Read Operation Timings ............................................... 38

Secured Silicon Sector Flash Memory Region ....................... 20

Factory Locked: Secured Silicon Sector Programmed

and Protected at the Factory ............................................... 20

Customer Lockable: Secured Silicon Sector NOT Programmed

or Protected at the Factory .................................................. 20

Figure 3. Secured Silicon Sector Protect Verify .............................. 21

Hardware Reset (RESET#) .................................................... 39

Figure 15. Reset Timings ............................................................... 39

Word/Byte Configuration (BYTE#) ............................................. 40

Figure 16. BYTE# Timings for Read Operations............................ 40

Figure 17. BYTE# Timings for Write Operations............................ 40

Hardware Data Protection ...................................................... 21

Low VCC Write Inhibit ......................................................... 21

Write Pulse “Glitch” Protection ............................................ 21

Logical Inhibit ...................................................................... 21

Power-Up Write Inhibit ......................................................... 21

Common Flash Memory Interface (CFI) . . . . . . . 21

Table 9. CFI Query Identification String .......................................... 22

Table 10. System Interface String................................................... 22

Table 11. Device Geometry Definition ............................................ 23

Table 12. Primary Vendor-Specific Extended Query ...................... 24

Erase and Program Operations ................................................. 41

Figure 18. Program Operation Timings..........................................

Figure 19. Chip/Sector Erase Operation Timings ..........................

Figure 20. Data# Polling Timings (During Embedded Algorithms).

Figure 21. Toggle Bit Timings (During Embedded Algorithms)......

Figure 22. DQ2 vs. DQ6.................................................................

Temporary Sector Unprotect ..................................................... 46

Figure 23. Temporary Sector Unprotect Timing Diagram .............. 46

Figure 24. Accelerated Program Timing Diagram.......................... 46

Figure 25. Sector/Sector Block Protect and

Unprotect Timing Diagram ............................................................. 47

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25

Reading Array Data ................................................................ 25

December 14, 2005

Alternate CE# Controlled Erase and Program Operations ........ 48

Figure 26. Alternate CE# Controlled Write

Am29LV320D

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