AM29LV065DU50WHFN datasheet, PDF

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AM29LV065DU50WHFN: Description8M X 8 FLASH 3V PROM, 90 ns, PDSO48; Categorystorage; File Size603KB，54 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM29LV065DU50WHFN Overview

8M X 8 FLASH 3V PROM, 90 ns, PDSO48

AM29LV065DU50WHFN Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	48
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	3.6 V
Minimum supply/operating voltage	3 V
Rated supply voltage	3.3 V
maximum access time	90 ns
Processing package description	MO-142DD, TSOP-48
state	DISCONTINUED
Craftsmanship	CMOS
packaging shape	Rectangle
Package Size	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.5000 mm
terminal coating	tin lead
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	INDUSTRIAL
memory width	8
organize	8M × 8
storage density	6.71E7 deg
operating mode	ASYNCHRONOUS
Number of digits	8.39E6 words
Number of digits	8M
Memory IC type	FLASH 3V programmable read-only memory
serial parallel	parallel

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Am29LV065D

Data Sheet

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-

inally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropriate,

and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order

these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

23544

Revision

Amendment 2 Issue Date

February 16, 2006

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 7

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Ordering Information . . . . . . . . . . . . . . . . . . . . . . 10

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 11

Table 1. Am29LV065D Device Bus Operations ..............................11

Table 10. Am29LV065D Command Definitions ............................. 29

Write Operation Status . . . . . . . . . . . . . . . . . . . . 30

DQ7: Data# Polling ................................................................. 30

Figure 6. Data# Polling Algorithm .................................................. 30

RY/BY#: Ready/Busy# ............................................................ 31

DQ6: Toggle Bit I .................................................................... 31

Figure 7. Toggle Bit Algorithm........................................................ 31

VersatileIO

) Control ...................................................... 11

Requirements for Reading Array Data ................................... 11

Writing Commands/Command Sequences ............................ 12

Accelerated Program Operation ............................................. 12

Autoselect Functions .............................................................. 12

Standby Mode ........................................................................ 12

Automatic Sleep Mode ........................................................... 12

RESET#: Hardware Reset Pin ............................................... 12

Output Disable Mode .............................................................. 13

Table 2. Sector Address Table ........................................................13

DQ2: Toggle Bit II ................................................................... 32

Reading Toggle Bits DQ6/DQ2 ............................................... 32

DQ5: Exceeded Timing Limits ................................................ 32

DQ3: Sector Erase Timer ....................................................... 32

Table 11. Write Operation Status ................................................... 33

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34

Figure 8. Maximum Negative Overshoot Waveform ..................... 34

Figure 9. Maximum Positive Overshoot Waveform....................... 34

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 10. I

CC1

Current vs. Time (Showing Active and

Automatic Sleep Currents) ............................................................. 36

Figure 11. Typical I

CC1

vs. Frequency ............................................ 36

Autoselect Mode ..................................................................... 17

Table 3. Am29LV065D Autoselect Codes, (High Voltage Method) 17

Sector Group Protection and Unprotection ............................. 18

Table 4. Sector Group Protection/Unprotection Address Table .....18

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Figure 12. Test Setup.................................................................... 37

Table 12. Test Specifications ......................................................... 37

Figure 13. Input Waveforms and Measurement Levels ................. 37

Temporary Sector Group Unprotect ....................................... 19

Figure 1. Temporary Sector Group Unprotect Operation................ 19

Figure 2. In-System Sector Group Protect/Unprotect Algorithms ... 20

SecSi (Secured Silicon) Sector Flash Memory Region .......... 21

Table 5. SecSi Sector Contents ......................................................21

Figure 3. SecSi Sector Protect Verify.............................................. 22

Key to Switching Waveforms. . . . . . . . . . . . . . . . 37

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38

Read-Only Operations ........................................................... 38

Figure 14. Read Operation Timings ............................................... 38

Hardware Data Protection ...................................................... 22

Low VCC Write Inhibit ............................................................ 22

Write Pulse “Glitch” Protection ............................................... 22

Logical Inhibit .......................................................................... 22

Power-Up Write Inhibit ............................................................ 22

Common Flash Memory Interface (CFI) . . . . . . . 22

Table 6. CFI Query Identification String .......................................... 23

System Interface String................................................................... 23

Table 8. Device Geometry Definition .............................................. 23

Table 9. Primary Vendor-Specific Extended Query ........................ 24

Hardware Reset (RESET#) .................................................... 39

Figure 15. Reset Timings ............................................................... 39

Erase and Program Operations .............................................. 40

Figure 16. Program Operation Timings..........................................

Figure 17. Accelerated Program Timing Diagram..........................

Figure 18. Chip/Sector Erase Operation Timings ..........................

Figure 19. Data# Polling Timings (During Embedded Algorithms).

Figure 20. Toggle Bit Timings (During Embedded Algorithms)......

Figure 21. DQ2 vs. DQ6.................................................................

Temporary Sector Unprotect .................................................. 45

Figure 22. Temporary Sector Group Unprotect Timing Diagram ... 45

Figure 23. Sector Group Protect and Unprotect Timing Diagram .. 46

Figure 24. Alternate CE# Controlled Write

(Erase/Program) Operation Timings .............................................. 48

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25

Reading Array Data ................................................................ 25

Reset Command ..................................................................... 25

Autoselect Command Sequence ............................................ 25

Enter SecSi Sector/Exit SecSi Sector

Command Sequence .............................................................. 25

Byte Program Command Sequence ....................................... 26

Unlock Bypass Command Sequence ..................................... 26

Figure 4. Program Operation .......................................................... 26

Chip Erase Command Sequence ........................................... 27

Sector Erase Command Sequence ........................................ 27

Erase Suspend/Erase Resume Commands ........................... 27

Figure 5. Erase Operation............................................................... 28

Erase And Programming Performance . . . . . . . 49

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 49

TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 49

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 50

TS 048—48-Pin Standard Pinout Thin Small Outline

Package (TSOP) ..................................................................... 50

FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA)

11 x 12 mm package .............................................................. 51

Command Definitions ............................................................. 29

February 16, 2006

Am29LV065D

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