MC54HC573JS datasheet, PDF - EEWORLD Datasheet

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MC54HC573JS: DescriptionIC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,CERAMIC; Categorylogic; File Size485KB，7 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC54HC573JS Overview

IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,CERAMIC

MC54HC573JS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknown
Is Samacsys	N
JESD-30 code	R-XDIP-T20
JESD-609 code	e0
Logic integrated circuit type	D LATCH
Number of digits	8
Number of functions	1
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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MC54HC573JS Related Products

	MC54HC573JS	MC74VHC573DT	MC74VHC573M	MC74HC573ADWR2	MC74HC573NS
Description	IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,AHC/VHC-CMOS,TSSOP,20PIN,PLASTIC	IC,LATCH,SINGLE,8-BIT,AHC/VHC-CMOS,SOP,20PIN,PLASTIC	IC,LATCH,SINGLE,8-BIT,HC-CMOS,SOP,20PIN,PLASTIC	IC,LATCH,SINGLE,8-BIT,HC-CMOS,DIP,20PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP	NXP
package instruction	DIP, DIP20,.3	TSSOP, TSSOP20,.25	SOP, SOP20,.3	SOP, SOP20,.4	DIP, DIP20,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T20	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	R-PDIP-T20
JESD-609 code	e0	e0	e0	e0	e0
Logic integrated circuit type	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
Number of digits	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	20	20	20	20	20
Maximum operating temperature	125 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	TSSOP	SOP	SOP	DIP
Encapsulate equivalent code	DIP20,.3	TSSOP20,.25	SOP20,.3	SOP20,.4	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
power supply	2/6 V	2/5.5 V	2/5.5 V	2/6 V	2/6 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	0.635 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Is Samacsys	N	N	N	-	-
Base Number Matches	1	1	1	-	-
Load capacitance (CL)	-	50 pF	50 pF	50 pF	-
MaximumI(ol)	-	0.008 A	0.008 A	0.006 A	-
Prop。Delay @ Nom-Sup	-	10 ns	10 ns	45 ns	-

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