AM29DL324GT90EF datasheet, PDF

Datasheet> All Categories > storage> storage> AM29DL324GT90EF

AM29DL324GT90EF: Description2M X 16 FLASH 3V PROM, 90 ns, PDSO48; Categorystorage storage; File Size865KB，58 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

Download Datasheet Parametric View All

AM29DL324GT90EF Overview

2M X 16 FLASH 3V PROM, 90 ns, PDSO48

AM29DL324GT90EF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	TSOP1
package instruction	TSSOP, TSSOP48,.8,20
Contacts	48
Reach Compliance Code	compli
ECCN code	3A991.B.1.A
Maximum access time	90 ns
Spare memory width	8
startup block	TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PDSO-G48
JESD-609 code	e3
length	18.4 mm
memory density	33554432 bi
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	8,63
Number of terminals	48
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP48,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	8K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.045 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	12 mm

Preview

Download Datasheet

View All

Am29DL32xG

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not recommended for designs. For new and current designs,

S29JL032H (for TSOP packages) and S29PL032J (for FBGA packages) supersede AM29DL32xG as

the factory-recommended migration path. Please refer to each respective datasheets for specifica-

tions and ordering information. Availability of this document is retained for reference and historical

purposes only.

The following document contains information on Spansion memory products.

Continuity of Specifications

There is no change to this data sheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal data sheet improvement and are noted in the

document revision summary.

For More Information

Please contact your local sales office for additional information about Spansion memory solutions.

Publication Number

25686

Revision

Amendment

Issue Date

December 4, 2006

D A T A

S H E E T

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Device Bus Operations ........................................................................................ 10

Unlock Bypass Command Sequence ................................... 26

Figure 3. Program Operation.............................................................................................. 26

Chip Erase Command Sequence ............................................ 26

Sector Erase Command Sequence ......................................... 27

Erase Suspend/Erase Resume Commands ............................ 27

Figure 4. Erase Operation................................................................................................... 28

Table 14. Command Definitions......................................................................................... 29

Write Operation Status . . . . . . . . . . . . . . . . . . . . 30

DQ7: Data# Polling .................................................................. 30

Figure 5. Data# Polling Algorithm....................................................................................... 30

Word/Byte Configuration .......................................................... 10

Requirements for Reading Array Data .....................................10

Writing Commands/Command Sequences ..............................11

Accelerated Program Operation ...........................................11

Autoselect Functions .............................................................11

Simultaneous Read/Write Operations

with Zero Latency .....................................................................11

Standby Mode .......................................................................... 11

Automatic Sleep Mode .............................................................11

RESET#: Hardware Reset Pin .................................................12

Output Disable Mode ...............................................................12

Table 2. Device Bank Divisions .......................................................................................... 12

Table 3. Top Boot Sector Addresses ...............................................................................13

Table 4. Top Boot Secured Silicon Sector Addresses .................................................... 14

Table 5. Bottom Boot Sector Addresses ........................................................................... 15

Table 6. Bottom Boot Secured Silicon Sector Addresses ............................................. 16

RY/BY#: Ready/Busy# ..............................................................31

DQ6: Toggle Bit I ..................................................................... 31

Figure 6. Toggle Bit Algorithm............................................................................................. 31

DQ2: Toggle Bit II .................................................................... 32

Reading Toggle Bits DQ6/DQ2 ................................................ 32

DQ5: Exceeded Timing Limits ................................................. 32

DQ3: Sector Erase Timer ........................................................ 32

Table 15. Write Operation Status .......................................................................................33

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34

Figure 7. Maximum Negative Overshoot Waveform....................................................... 34

Figure 8. Maximum Positive Overshoot Waveform......................................................... 34

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 9. I

CC1

Current vs. Time (Showing Active and Automatic Sleep Currents)...... 36

Figure 10. Typical I

CC1

vs. Frequency................................................................................ 36

Autoselect Mode ...................................................................... 17

Table 7. Autoselect Codes, (High Voltage Method) ....................................................... 17

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Figure 11. Test Setup.......................................................................................................... 37

Figure 12. Input Waveforms and Measurement Levels.................................................. 37

Sector/Sector Block Protection and Unprotection .................... 18

Table 8. Top Boot Sector/Sector Block Addresses for Protection/Unprotection .........18

Table 9. Bottom Boot Sector/Sector Block Addresses for Protection/Unprotection ...18

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38

Figure 13. Read Operation Timings................................................................................... 38

Figure 14. Reset Timings..................................................................................................... 39

Write Protect (WP#) .................................................................19

Temporary Sector Unprotect ....................................................19

Figure 1. Temporary Sector Unprotect Operation........................................................... 19

Figure 2. In-System Sector Protection/

Sector Unprotection Algorithms.......................................................................................... 20

Word/Byte Configuration (BYTE#) ........................................... 40

Figure 15. BYTE# Timings for Read Operations............................................................. 40

Figure 16. BYTE# Timings for Write Operations.............................................................. 40

Erase and Program Operations ............................................... 41

Figure 17. Program Operation Timings............................................................................. 42

Figure 18. Accelerated Program Timing Diagram........................................................... 42

Figure 19. Chip/Sector Erase Operation Timings............................................................ 43

Figure 20. Back-to-back Read/Write Cycle Timings........................................................ 44

Figure 21. Data# Polling Timings (During Embedded Algorithms)............................... 44

Figure 22. Toggle Bit Timings (During Embedded Algorithms)..................................... 45

Figure 23. DQ2 vs. DQ6...................................................................................................... 45

Secured Silicon Sector

Flash Memory Region ..............................................................21

Factory Locked: Secured Silicon Sector Programmed and Pro-

tected At the Factory .............................................................21

Customer Lockable: Secured Silicon Sector NOT Programmed

or Protected At the Factory ...................................................21

Hardware Data Protection ........................................................21

Low VCC Write Inhibit ...........................................................22

Write Pulse “Glitch” Protection ..............................................22

Logical Inhibit ........................................................................22

Power-Up Write Inhibit ..........................................................22

Temporary Sector Unprotect ................................................... 46

Figure 24. Temporary Sector Unprotect Timing Diagram.............................................. 46

Figure 25. Sector/Sector Block Protect and Unprotect Timing Diagram...................... 47

Alternate CE# Controlled Erase and Program Operations ...... 48

Figure 26. Alternate CE# Controlled Write (Erase/Program) Operation Timings........ 49

Common Flash Memory Interface (CFI) . . . . . . . 22

Table 10. CFI Query Identification String..........................................................................

Table 11. System Interface String......................................................................................

Table 12. Device Geometry Definition...............................................................................

Table 13. Primary Vendor-Specific Extended Query......................................................

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 24

Reading Array Data ..................................................................24

Reset Command ......................................................................25

Autoselect Command Sequence ..............................................25

Enter Secured Silicon Sector/Exit Secured Silicon Sector Com-

mand Sequence .......................................................................25

Byte/Word Program Command Sequence ...............................25

Erase And Programming Performance . . . . . . .

Latchup Characteristics . . . . . . . . . . . . . . . . . . . .

TSOP Pin and Fine-Pitch BGA Capacitance. . . .

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . .

FBD063—63-ball Fine-Pitch Ball Grid Array (FBGA)

8 x 14 mm ................................................................................ 51

FBD048—Fine-Pitch Ball Grid Array, 6 x 12 mm ..................... 52

TS 048—Thin Small Outline Package ..................................... 53

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55

December 4, 2006 25686B10

Am29DL32xG

Recommended Resources

Single-phase power factor measuring instrument circuit a

Light control switch circuit 3 controlled by flashlight

Phase-locked circuit with two clock signals, 10MHz and 20MHz

±50V forward switching converter circuit

Vertical mill (C512 vertical lathe modification) electrical wiring circuit

Two DAC1231 and microcontroller interface circuits

The annual holiday is over, and it’s time for comrades to report to the construction site.: I guess the school is still on winter vacation, right? I guess the work is almost over, so we're going to pack up and get back to work tomorrow.The new year has begun, people are coming back one after...; liuceone Talking

How to re-establish UDP connection after vxworks IP changed: For example, if the IP is changed through telnet, the previous UDP communication will not work and the device must be restarted. Is there any good way?...; zyboy2000 Real-time operating system RTOS

LPC54608: Which expert is using LPC54608? Can you share with me?...; 18434391446 Download Centre

Should the voltage regulator diode of the flyback power supply control chip be connected in parallel?: In the figure below, a Zener diode is added to the control chip of the flyback power supply, the power supply and the ground to protect the IC from damage due to overvoltage. Should the Zener diode be...; kal9623287 Power technology

China's best private life alliance, welcome to join: The best private life alliance in China, welcome to join Northwest Private Life Group 49492172 Sichuan Private Life Exchange 48663781 Shanghai Private Life Group 49493832 Shaanxi Private Life Exchange...; tankli01 Embedded System

Arbitrary Waveform Generator Channel Count Issue: How did you achieve the launch of this channel data hardware?...; stevenkean Test/Measurement

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components