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AM29DL320GT70PCI

Description
2M X 16 FLASH 3V PROM, 70 ns, PDSO48
Categorystorage    storage   
File Size768KB,58 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric View All

AM29DL320GT70PCI Overview

2M X 16 FLASH 3V PROM, 70 ns, PDSO48

AM29DL320GT70PCI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeBGA
package instruction11 X 13 MM, 1 MM PITCH, FBGA-64
Contacts64
Reach Compliance Codeunknow
ECCN code3A991.B.1.A
Maximum access time70 ns
Spare memory width8
startup blockTOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B64
JESD-609 codee0
length13 mm
memory density33554432 bi
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size8,63
Number of terminals64
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA64,8X8,40
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
power supply3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.4 mm
Department size8K,64K
Maximum standby current0.000005 A
Maximum slew rate0.045 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
switch bitYES
typeNOR TYPE
width11 mm
Am29DL320G
Data Sheet
RETIRED
PRODUCT
This product has been retired and is not recommended for designs. For new and current designs,
S29JL032H (for TSOP packages) and S29PL032J (for FBGA packages) supersede AM29DL320G as
the factory-recommended migration path. Please refer to each respective datasheets for specifica-
tions and ordering information. Availability of this document is retained for reference and historical
purposes only.
April 2005
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that
originally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appro-
priate, and changes will be noted in a revision summary.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
Publication Number
25769
Revision
C
Amendment
+3
Issue Date
May 25, 2005
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