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MA4P303-132

Description
SILICON, PIN DIODE, CERAMIC PACKAGE-1
Categorydiode    The PIN diode   
File Size267KB,6 Pages
ManufacturerMACOM
Websitehttp://www.macom.com
Download Datasheet Parametric View All

MA4P303-132 Overview

SILICON, PIN DIODE, CERAMIC PACKAGE-1

MA4P303-132 Parametric

Parameter NameAttribute value
MakerMACOM
package instructionS-CUUC-N1
Contacts1
Reach Compliance Codecompliant
Is SamacsysN
Base Number Matches1
MA4P100 thru MA4P600 Series
Packaged PIN Diodes
Features
M/A-COM Products
Rev. 4
Absolute Maximum Ratings
1
@ T
A
= +25°C (unless otherwise specified)
Parameter
Voltage
Operating Temperature
Storage Temperature
Operating and Storage
Case Style 1088
High Power PIN Diodes
Fast Speed PIN Diodes
Voltage Ratings to 1500 Volts
Long Carrier Lifetime Designs
Wide Variety of Hermetic packages
High Reliability for Space/Military Applications
Absolution Max.
Voltage Rating
- 65°C to +175°C
-65°C to +200°C
- 65°C to +125°C
Description and Applications
M/A-COM's product line of packaged PIN diodes repre-
sents a comprehensive combination of PIN diode
electrical characteristics and package outlines. This
union of semiconductor and packaging technology gives
considerable design flexibility to the PIN diode circuit
designer. The fast switching speed PIN diodes utilize
thin I-region silicon dioxide passivated chips that
incorporate careful control of semiconductor processing.
These diodes achieve consistent performance in control
circuit applications. The packaged CERMACHIP PIN
diodes employ M/A-COM's unique hard glass
passivated, hermetically sealed PIN diode chip. The
packaged CERMACHIP PIN diodes are designed for use
in high power and high RF voltage applications. The PIN
diode chips are bonded into hermetically sealed ceramic
or glass packages that are designed for high volume,
close tolerance utilization. Packages are available which
are suitable for mounting in a variety of microwave and
RF circuit media. The packaged silicon PIN diode series
has high inherent reliability and is capable of meeting
stringent environmental tests. These diodes may be
ordered with testing to selected reliability levels.
Note:
1)
Operation of this device above any one of these parameters
may cause permanent damage.
Maximum Power Dissipation
Cathode Heastink Packages
Case Styles:
Pdiss = T (max operating)-25°C
30, 31, 32, 36, 94, 111, 120, 150,
Thermal Resistance
258, 985, 1072, 1079
Leaded Packages @ +25°C
Case Styles 186,276,1088
Surface Mount Package
Case Style 1056
Pdiss = 250mW
Pdiss = 300mW
Co-Axial Type Packages
Co-planar Surface mount Type Packages
Ordering Information
Packaged PIN diode specifications are listed in the
appropriate tables. The standard package style is
indicated as part of the model number; i.e.,
MA4P506-30. Alternative package styles for the diodes
are also indicated. To order, indicate the desired model
number by indicating the chip model number and desired
package style; i.e., MA4P506-258.
Note that the
specification tables lists total diode capacitance in the
standard case style only. The total capacitance for the
diode in an alternative package are computed from the
difference in package capacitance. Parts are available
only in the case styles as indicated in each product table
.
Threaded Packages
Bondable Die
Specifications subject to change without prior notification.
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
North America
Tel: 800.366.2266 / Fax: 978.366.2266
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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