EDO DRAM, 256KX16, 70ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP-44/40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Micron Technology |
| Parts packaging code | TSOP |
| package instruction | 0.400 INCH, PLASTIC, TSOP-44/40 |
| Contacts | 44 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Is Samacsys | N |
| access mode | FAST PAGE WITH EDO |
| Maximum access time | 70 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G40 |
| JESD-609 code | e0 |
| length | 18.41 mm |
| memory density | 4194304 bit |
| Memory IC Type | EDO DRAM |
| memory width | 16 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 40 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX16 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP2 |
| Encapsulate equivalent code | TSOP40/44,.46,32 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 512 |
| Maximum seat height | 1.2 mm |
| self refresh | NO |
| Maximum standby current | 0.001 A |
| Maximum slew rate | 0.175 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |
| Base Number Matches | 1 |
| MT4C16270TG-7 | MT4C16270TG-7TR | MT4C16270TG-8 | MT4C16270TG-8TR | MT4C16270DJ-8 | MT4C16270DJ-8TR | MT4C16270TG-6TR | MT4C16270TG-6 | |
|---|---|---|---|---|---|---|---|---|
| Description | EDO DRAM, 256KX16, 70ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP-44/40 | EDO DRAM, 256KX16, 70ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP-44/40 | EDO DRAM, 256KX16, 80ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP-44/40 | EDO DRAM, 256KX16, 80ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP-44/40 | EDO DRAM, 256KX16, 80ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40 | EDO DRAM, 256KX16, 80ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40 | EDO DRAM, 256KX16, 60ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP2-44/40 | EDO DRAM, 256KX16, 60ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP-44/40 |
| Maker | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Parts packaging code | TSOP | TSOP | TSOP | TSOP | SOJ | SOJ | TSOP2 | TSOP |
| package instruction | 0.400 INCH, PLASTIC, TSOP-44/40 | TSOP2, | 0.400 INCH, PLASTIC, TSOP-44/40 | TSOP2, | 0.400 INCH, PLASTIC, SOJ-40 | SOJ, | TSOP2, | 0.400 INCH, PLASTIC, TSOP-44/40 |
| Contacts | 44 | 44 | 44 | 44 | 40 | 40 | 44 | 44 |
| Reach Compliance Code | not_compliant | unknown | not_compliant | unknown | not_compliant | unknown | unknown | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
| Maximum access time | 70 ns | 70 ns | 80 ns | 80 ns | 80 ns | 80 ns | 60 ns | 60 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 code | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-J40 | R-PDSO-J40 | R-PDSO-G40 | R-PDSO-G40 |
| length | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 26.06 mm | 26.06 mm | 18.41 mm | 18.41 mm |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM |
| memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP2 | TSOP2 | TSOP2 | TSOP2 | SOJ | SOJ | TSOP2 | TSOP2 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 3.81 mm | 3.81 mm | 1.2 mm | 1.2 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | J BEND | J BEND | GULL WING | GULL WING |
| Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.21 mm | 10.21 mm | 10.16 mm | 10.16 mm |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | - | TIN LEAD | Tin/Lead (Sn/Pb) |