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KIS200-04TT

Description
IC Socket, PGA200, 200 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,
Categorysocket   
File Size175KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

KIS200-04TT Overview

IC Socket, PGA200, 200 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

KIS200-04TT Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAdvanced Interconnections Corp.
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
Other features1.0 OZ. AVG. INSERTION FORCE
body width1.5 inch
subject depth0.12 inch
body length1.5 inch
Contact structure15X15
Contact to complete cooperationTIN LEAD OVER NICKEL
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact materialBERYLLIUM COPPER
Contact styleRND PIN-SKT
Device slot typeIC SOCKET
Type of equipment usedPGA200
Shell materialPOLYAMIDE
JESD-609 codee0
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts200
Maximum operating temperature400 °C
Minimum operating temperature-269 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.1 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Base Number Matches1
Low Insertion Force
Peel-A-Way
®
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Peel-A-Way
®
Low Insertion Force PGA Sockets
Polyimide Film
.005
(.13)
Features:
• Disposable carriers peel away after
soldering.
• Peel-A-Way
®
tabs and full grid wafer
supplied on all Peel-A-Way
®
PGA sockets.
• Maximum air flow under PGA for greater
cooling.
• Better flux rinse and cleaning.
• Allows inspection of solder joints on both
sides of PCB.
• Lowest profile with use of type -210
terminal.
• Peel-A-Way
®
disposable socket terminal
carrier available in any configuration shown
or custom designed to meet your
specifications.
1
Footprint Dash #
If Applicable*
How To Order
KS
068
-85
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Body Type
KS - 2.5 oz.(70.85 g) avg. insertion force
KIS - 1 oz.(28.34 g) avg. insertion force
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Polyimide Film
Polyimide Film
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
Peel away
after soldering
to PCB.
PCB
Solder fillets visible both sides
for inspection and cleaning.
Solder Preform:
63% Tin, 37% Lead
How To Use:
1. Place socket in PCB.
2. Send PCB and socket through soldering operation.
3. Peel away polyimide film carrier.
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Sealant Options
RTV
Seal
Body Material:
KS/KIS -
Polyimide Film
-269˚C to 400˚C (-452˚F to 752˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Peel-A-Way
®
covered by patent rights issued and/or pending.
Tape Sealed
To order: Add 3M to end of part #
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
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