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DP8420V-33

Description
256K X 1, DRAM CONTROLLER, PQCC68, PLASTIC, LCC-68
CategoryMicrocontrollers and processors   
File Size3MB,59 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Download Datasheet Parametric Compare View All

DP8420V-33 Overview

256K X 1, DRAM CONTROLLER, PQCC68, PLASTIC, LCC-68

DP8420V-33 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeLCC
package instructionQCCJ,
Contacts68
Reach Compliance Codeunknown
Is SamacsysN
Address bus width20
boundary scanNO
External data bus width
JESD-30 codeS-PQCC-J68
JESD-609 codee0
length24.2316 mm
low power modeYES
memory organization256K X 1
Humidity sensitivity levelNOT SPECIFIED
Number of blocks4
Number of terminals68
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeSQUARE
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height5.08 mm
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width24.2316 mm
uPs/uCs/peripheral integrated circuit typeMEMORY CONTROLLER, DRAM
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DP8420V-33 Related Products

DP8420V-33 DP8422VX-33 DP8422V-33
Description 256K X 1, DRAM CONTROLLER, PQCC68, PLASTIC, LCC-68 DRAM CONTROLLER, PQCC84, PLASTIC, LCC-84 4M X 1, DRAM CONTROLLER, PQCC84, PLASTIC, LCC-84
Maker Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code LCC LCC LCC
package instruction QCCJ, QCCJ, QCCJ,
Contacts 68 84 84
Reach Compliance Code unknown unknown unknown
Address bus width 20 22 22
boundary scan NO NO NO
JESD-30 code S-PQCC-J68 S-PQCC-J84 S-PQCC-J84
length 24.2316 mm 29.3116 mm 29.3116 mm
low power mode YES NO YES
Number of blocks 4 4 4
Number of terminals 68 84 84
Maximum operating temperature 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ QCCJ QCCJ
Package shape SQUARE SQUARE SQUARE
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER
Maximum seat height 5.08 mm 5.08 mm 5.08 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form J BEND J BEND J BEND
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD
width 24.2316 mm 29.3116 mm 29.3116 mm
uPs/uCs/peripheral integrated circuit type MEMORY CONTROLLER, DRAM MEMORY CONTROLLER, DRAM MEMORY CONTROLLER, DRAM
Is it lead-free? Contains lead - Contains lead
Is it Rohs certified? incompatible - incompatible
JESD-609 code e0 - e0
memory organization 256K X 1 - 4M X 1
Humidity sensitivity level NOT SPECIFIED - NOT SPECIFIED
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED
Terminal surface TIN LEAD - TIN LEAD
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED
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