LMU557CM70 datasheet, PDF - EEWORLD Datasheet

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LMU557CM70: DescriptionMultiplier, 8-Bit, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40; CategoryMicrocontrollers and processors; File Size234KB，8 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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LMU557CM70 Overview

Multiplier, 8-Bit, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40

LMU557CM70 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	DIP
package instruction	DIP, DIP40,.6
Contacts	40
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Is Samacsys	N
Other features	2 X 8 BIT DATA INPUT BUS; RESULT LATCH; ICC SPECIFIED @ 5MHZ
boundary scan	NO
External data bus width	8
JESD-30 code	R-GDIP-T40
JESD-609 code	e0
low power mode	NO
Humidity sensitivity level	3
Number of terminals	40
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output data bus width	16
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.715 mm
Maximum slew rate	35 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, MULTIPLIER
Base Number Matches	1

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LMU557CM70 Related Products

	LMU557CM70	LMU557CC60	LMU557CMB70	LMU558CMB70	LMU558CM70	LMU558CC60
Description	Multiplier, 8-Bit, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40	Multiplier, 8-Bit, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40	Multiplier, 8-Bit, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40	Multiplier, 8-Bit, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40	Multiplier, 8-Bit, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40	Multiplier, 8-Bit, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6
Contacts	40	40	40	40	40	40
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Other features	2 X 8 BIT DATA INPUT BUS; RESULT LATCH; ICC SPECIFIED @ 5MHZ	2 X 8 BIT DATA INPUT BUS; RESULT LATCH; ICC SPECIFIED @ 5MHZ	2 X 8 BIT DATA INPUT BUS; RESULT LATCH; ICC SPECIFIED @ 5MHZ	2 X 8 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ	2 X 8 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ	2 X 8 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
boundary scan	NO	NO	NO	NO	NO	NO
External data bus width	8	8	8	8	8	8
JESD-30 code	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40
JESD-609 code	e0	e0	e0	e0	e0	e0
low power mode	NO	NO	NO	NO	NO	NO
Humidity sensitivity level	3	3	3	3	3	3
Number of terminals	40	40	40	40	40	40
Maximum operating temperature	125 °C	70 °C	125 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-55 °C	-	-55 °C	-55 °C	-55 °C	-
Output data bus width	16	16	16	16	16	16
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.715 mm	5.715 mm	5.715 mm	5.715 mm	5.715 mm	5.715 mm
Maximum slew rate	35 mA	35 mA	35 mA	35 mA	35 mA	35 mA
Maximum supply voltage	5.5 V	5.25 V	5.5 V	5.5 V	5.5 V	5.25 V
Minimum supply voltage	4.5 V	4.75 V	4.5 V	4.5 V	4.5 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	MILITARY	MILITARY	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, MULTIPLIER	DSP PERIPHERAL, MULTIPLIER	DSP PERIPHERAL, MULTIPLIER	DSP PERIPHERAL, MULTIPLIER	DSP PERIPHERAL, MULTIPLIER	DSP PERIPHERAL, MULTIPLIER
ECCN code	3A001.A.2.C	-	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	-

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