For a full list of related documents, visit our website:
•
IS-1845ASRH, IS-1845ASEH
device pages
Applications
• Current-Mode Switching Power Supplies
• Control of High Current FET Drivers
• Motor Speed and Direction Control
Pin Configurations
IS7-1845ASRH, IS7-1845ASEH
(8 LD CDIP2-T8 SBDIP)
TOP VIEW
COMP
VFB
ISENSE
RTCT
1
2
3
4
8
7
6
5
VREF
VCC
OUT
GND
NC
COMP
VFB
NC
NC
NC
ISENSE
RTCT
NC
IS9-1845ASRH, IS9-1845ASEH
(18 LD FLATPACK)
TOP VIEW
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
NC
VREF
VCC
VC
OUT
NC
GND
OSCGND
NC
NOTES:
1. Grounding the COMP pin does not inhibit the output. The output may be inhibited by applying >1.2V to the ISENSE pin.
2. This part should be operated with C
t
= 3.3nF and R
t
= 10k timing components only.
FN9001 Rev.7.00
Nov 1, 2019
Page 1 of 5
IS-1845ASRH, IS-1845ASEH
Ordering Information
SMD ORDERING NUMBER (Note
3)
5962F0150901V9A
5962F0150902V9A
N/A
5962F0150901VPC
5962F0150902VPC
5962F0150901QPC
5962F0150901VXC
5962F0150902VXC
5962F0150901QXC
N/A
N/A
NOTES:
3. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed must be
used when ordering.
4. These Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb
and Pb-free soldering operations.
5. The /PROTO and /SAMPLE are not rated or certified for Total Ionizing Dose (TID) or Single Event Effect (SEE) immunity. These parts are intended for
engineering evaluation purposes only. The /PROTO parts meet the electrical limits and conditions across temperature specified in the DLA SMD and
are in the same form and fit as the qualified device. The /SAMPLE parts are capable of meeting the electrical limits and conditions specified in the
DLA SMD at +25°C only. The /SAMPLE parts do not receive 100% screening across temperature to the DLA SMD electrical limits. These part types
do not come with a Certificate of Conformance because they are not DLA qualified devices.
PART NUMBER (Note
4)
IS0-1845ASRH-Q
IS0-1845ASEH-Q
IS0-1845ASRH/SAMPLE (Note
5)
IS7-1845ASRH-Q
IS7-1845ASEH-Q
IS7-1845ASRH-8
IS9-1845ASRH-Q
IS9-1845ASEH-Q
IS9-1845ASRH-8
IS7-1845ASRH/PROTO (Note
5)
IS9-1845ASRH/PROTO (Note
5)
TEMP. RANGE (°C)
+25
+25
+25
-50 to +125
-50 to +125
-50 to +125
-50 to +125
-50 to +125
-50 to +125
-50 to +125
-50 to +125
Die
Die
Die
8 Ld SBDIP
8 Ld SBDIP
8 Ld SBDIP
18 Ld Flatpack
18 Ld Flatpack
18 Ld Flatpack
8 Ld SBDIP
18 Ld Flatpack
PACKAGE
N/A
N/A
N/A
D8.3
D8.3
D8.3
K18.B
K18.B
K18.B
D8.3
K18.3
PKG. DWG. #
Typical Performance Curves
10k
C470pF
FREQUENCY (kHz)
1k
C1000pF
C2200pF
C4700pF
100
D
MAX
(%)
60
40
20
0
80
100
D
MAX
10
1
1
10
R
t
TIMING RESISTANCE (kΩ)
100
0.1
1
10
R
t
TIMING RESISTANCE (kΩ)
100
FIGURE 1. OSCILLATOR FREQUENCY vs R
t
and C
t
FIGURE 2. MAXIMUM DUTY CYCLE vs R
t
FN9001 Rev.7.00
Nov 1, 2019
Page 2 of 5
IS-1845ASRH, IS-1845ASEH
Die Characteristics
DIE DIMENSIONS
3090µm x 4080µm (121.6 mils x 159.0 mils)
Thickness: 483µm ± 25.4µm (19 mils ± 1 mil)
Substrate
Radiation Hardened Silicon Gate,
Dielectric Isolation
Backside Finish
Silicon
INTERFACE MATERIALS
Glassivation
Type: Phosphorus Silicon Glass (PSG)
Thickness: 8.0kA ± 1.0kA
Top Metallization
Type: AlSiCu
Thickness: 16.0kA ± 2kA
ASSEMBLY RELATED INFORMATION
Substrate Potential
Unbiased (DI)
ADDITIONAL INFORMATION
Worst Case Current Density
<2.0 x 10
5
A/cm
2
Transistor Count
582
Metallization Mask Layout
IS-1845ASRH
ISENSE
VFB
COMP
RTCT
OSCGND
VREF
GND
GND
OUT
NOTES:
6. Both the GND pads must be bonded to ground.
7. The OUT double-sized bond pad must be double bonded for current sharing purposes.
VC
VCC
8. The OSCGND double-sized bond pad must be double bonded to ground for current sharing purposes.
FN9001 Rev.7.00
Nov 1, 2019
Page 3 of 5
IS-1845ASRH, IS-1845ASEH
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make sure
you have the latest revision.
DATE
Nov 1, 2019
REVISION
FN9001.7
CHANGE
Added Related Literature
Updated Links throughout.
Updated Ordering information by updating temperature for die parts and adding applicable notes.
Added Revision History.
Updated Disclaimer.
FN9001 Rev.7.00
Nov 1, 2019
Page 4 of 5
IMPORTANT NOTICE AND DISCLAIMER
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SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING
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INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible
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