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AX1000-2BGG729I

Description
Field Programmable Gate Array, 12096 CLBs, 1000000 Gates, 870MHz, 18144-Cell, CMOS, PBGA729
CategoryProgrammable logic devices    Programmable logic   
File Size13MB,262 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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Field Programmable Gate Array, 12096 CLBs, 1000000 Gates, 870MHz, 18144-Cell, CMOS, PBGA729

AX1000-2BGG729I Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrochip
package instruction1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-729
Reach Compliance Codecompli
Revision 18
Axcelerator Family FPGAs
Leading-Edge Performance
350+ MHz System Performance
500+ MHz Internal Performance
High-Performance Embedded FIFOs
700 Mb/s LVDS Capable I/Os
– Voltage-Referenced I/O Standards: GTL+, HSTL Class 1,
SSTL2 Class 1 and 2, SSTL3 Class 1 and 2
– Registered I/Os
– Hot-Swap Compliant I/Os (except PCI)
– Programmable Slew Rate and Drive Strength on Outputs
– Programmable Delay and Weak Pull-Up/Pull-Down Circuits
on Inputs
Embedded Memory:
– Variable-Aspect 4,608-bit RAM Blocks (x1, x2, x4, x9, x18,
x36 Organizations Available)
– Independent, Width-Configurable Read and Write Ports
– Programmable Embedded FIFO Control Logic
Segmentable Clock Resources
Embedded Phase-Locked Loop:
– 14-200 MHz Input Range
– Frequency Synthesis Capabilities up to 1 GHz
Deterministic, User-Controllable Timing
Unique In-System Diagnostic and Debug Capability with
Microsemi Silicon Explorer II
Boundary-Scan Testing Compliant with IEEE Standard 1149.1
(JTAG)
FuseLock™ Programming Technology Protects Against
Reverse Engineering and Design Theft
Specifications
Up to 2 Million Equivalent System Gates
Up to 684 I/Os
Up to 10,752 Dedicated Flip-Flops
Up to 295 kbits Embedded SRAM/FIFO
Manufactured on Advanced 0.15
μm
CMOS Antifuse Process
Technology, 7 Layers of Metal
Single-Chip, Nonvolatile Solution
Up to 100% Resource Utilization with 100% Pin Locking
1.5 V Core Voltage for Low Power
Footprint Compatible Packaging
Flexible, Multi-Standard I/Os:
– 1.5 V, 1.8 V, 2.5 V, 3.3 V Mixed Voltage Operation
– Bank-Selectable I/Os – 8 Banks per Chip
– Single-Ended I/O Standards: LVTTL, LVCMOS, 3.3V PCI,
and 3.3 V PCI-X
– Differential I/O Standards: LVPECL and LVDS
Features
Table 1 • Axcelerator Family Product Profile
Device
Capacity (in Equivalent System Gates)
Typical Gates
Modules
Register (R-cells)
Combinatorial (C-cells)
Maximum Flip-Flops
Embedded RAM/FIFO
Number of Core RAM Blocks
Total Bits of Core RAM
Clocks (Segmentable)
Hardwired
Routed
PLLs
I/Os
I/O Banks
Maximum User I/Os
Maximum LVDS Channels
Total I/O Registers
Package
PQ
BG
FG
CQ
CG
AX125
AX250
AX500
AX1000
AX2000
125,000
82,000
672
1,344
1,344
4
18,432
4
4
8
8
168
84
504
250,000
154,000
1,408
2,816
2,816
12
55,296
4
4
8
8
248
124
744
208
500,000
286,000
2,688
5,376
5,376
16
73,728
4
4
8
8
336
168
1,008
208
484, 676
208, 352
1,000,000
612,000
6,048
12,096
12,096
36
165,888
4
4
8
8
516
258
1,548
2,000,000
1,060,000
10,752
21,504
21,504
64
294,912
4
4
8
8
684
342
2,052
256, 324
256, 484
208, 352
729
484, 676, 896
352
624
896, 1152
256, 352
624
March 2012
© 2012 Microsemi Corporation
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