S40S THRU S500S
Features
· Glass Passivated Die Construction
· Diffused Junction
· Low Forward Voltage Drop, High Current Capability
· Surge Overload Rating to 30A Peak
· Designed for Printed Circuit Board Applications
· Plastic Material - UL Flammability Classification 94V-0
L
CURRENT 0.8 Amperes
VOLTAGE 100 to 1000 Volts
G
A B
D E
H
J
K
Dim
A
B
C
D
E
G
H
J
K
L
C
MiniDIP
Min
5.43
3.60
0.15
0.05
0.70
4.50
2.80
2.50
0.50
Max
5.75
4.00
0.35
0.20
7.00
1.10
4.90
2.90
2.70
0.80
Mechanical Data
· Case : Molded Plastic
· Terminals : Solder Plated Leads,
Solderable per MIL-STD-202, Method 2026
· Polarity : As Marked on Case
· Approx. Weight : 0.125 grams
· Mounting Position : Any
· Marking : Type Number
A ll Dimens ions in mm
Maximum Ratings And Electrical Characteristics
(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
load. For capacitive load, derate by 20%)
Symbols
Peak Repetitive Reverse voltage
Working Peak Reverse voltage
DC Blocking voltage
RMS Reverse voltage
Average Rectified Output Current
@ T
A
=40
℃
V
RMM
V
RWM
V
R
V
RMS
Io
I
FSM
V
FM
I
RM
C
j
Rθ
JA
T
j
T
STG
S40S
100
70
S80S
200
140
S125S
400
280
0.8
30
1.0
10
500
10
75
S250S
600
420
S380S
800
560
S500S
1000
700
Units
Volts
Volts
Amp
Amp
Volts
μA
pF
℃/W
℃
Non-Repetitive Peak Forward Surge Current,
8.3ms single half-sine-wave superimposed
on rated load (JEDEC method)
Forward voltage (per element)
Peak Reverse Current at Rated
DC Blocking voltage (per element)
Typical Junction Capacitance
per element (Note 1)
Typical Thermal Resistance,
Junction to Ambient (Note 2)
Operating and Storage Temperature Range
@ I
F
=0.4 A
@ T
A
=25℃
@ T
A
=125℃
-55 to +150
Notes:
(1) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC.
(2) Thermal Resistance, junction to ambient, measured on PC board with 5.0
2
mm (0.03mm thick) land areas.
RATING AND CHARACTERISTIC CURVES S40S THRU S500S
(A )
CURRENT
0.6
I
F
, INST ANT ANEOUS FOR WARD CURRENT
(A)
Ceramic PC Board
0.8
10
FOR WARD RECTIFIED
1.0
0.4
0.1
0.2
I
(AV)
, AVERAGE
Resistive or Inductive Load
0
0
40
80
120
160
T
A
, AMBIENT TEMPERA TURE ( C )
Fi g. 1 Output Current Deratin g Curve
0.01
0.2
0.4
0.6
0.8
1.0
T
j
= 25 C
Pulse Width = 300 s
1.2
1.4
1.6
V
F
, INST ANT ANEOUS FOR WARD V OLTAGE (V)
Fi g. 2 T ypical Forward Characteristics (per leg)
(A)
35
30
C
j
, JUNCTION CAP ACIT ANCE (pF)
100
T
j
= 25 C
f = 1.0MHz
I
FSM
, PEAK FOR WARD SURGE
CURRENT
20
10
10
T
A
= 25 C
Single Half Sine-W ave
Pulse Width = 5.3ms
(JEDEC Method)
0
1.0
10
NUMBER OF CYCLES AT 60 Hz
Fi g. 3 Maximum Peak Forward Sur ge Current (per leg)
(
μ
A)
100
1
1
10
V
R
, REVERSE VOL TAGE (V)
Fi g. 4 Typical Junction Capacitance
100
CURRENT
10
T
j
= 125 C
I
R
, INST ANT ANEOUS REVERSE
1.0
0.1
T
j
= 25 C
0.01
0
20
40
60
80
100
120
140
PERCENT OF RA TED PEAK REVERSE VOL TAGE (%)
Fi g. 5 Typical Reverse Characteristics (per element )
Microcontroller MCU
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