datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > Passive components> The resistor> HCHP2010K2183DBPA
PDF
Preview

HCHP2010K2183DBPA

Description
Fixed Resistor, Metal Glaze/thick Film, 1W, 218000ohm, 200V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP
CategoryPassive components    The resistor   
File Size156KB，9 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

HCHP2010K2183DBPA Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 218000ohm, 200V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP

HCHP2010K2183DBPA Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid145112781066
package instructionSMT, 2010
Reach Compliance Codeunknown
Country Of OriginFrance
ECCN codeEAR99
YTEOL7.8
structureRectangular
JESD-609 codee0
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.5 mm
Package length5.03 mm
Package formSMT
Package width2.64 mm
method of packingTR, PAPER
Rated power dissipation(P)1 W
Rated temperature70 °C
resistance218000 Ω
Resistor typeFIXED RESISTOR
size code2010
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage200 V

HCHP2010K2183DBPA Preview

CHP, HCHP
www.vishay.com
Vishay Sfernice
High Stability Resistor Chips
(< 0.25 % at Pn at 70 °C during 1000 h) Thick Film Technology
FEATURES
• CHP: standard passivated version for
industrial, professional and military applications
Available
• Robust terminations
• Large ohmic value range 0.1
to 100 M
• Tight tolerance to 0.5 %
• HCHP: for high frequency applications
• ESCC approved see CHPHR
Available
DESIGN SUPPORT TOOLS
Models
Available
click logo to get started
• High temperature (245 °C) see CHPHT
• SMD wraparound chip resistor
• Halogen-free according to IEC 61249-2-21 definition
• Withstand moisture resistance test of AEC-Q200
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
Vishay Sfernice thick film resistor chips are specially
designed to meet very stringent specifications in terms
of reliability, stability < 0.25 % at Pn at +70 °C during
1000 h, homogeneity, reproducibility and quality.
They conform to specifications NFC 83-240 and
MIL-R-55342 D.
Evaluated to ESCC 4001/026 (see CHPHR datasheet).
Sputtered Thin Film terminations, with nickel barrier, are
very convenient for high operating conditions. They can
withstand thousands of very severe thermal shocks.
B (W/A), N (W/A), and F (one face) types are for solder reflow
assembly.
G (W/A) and W (one face) types are for wire bonding, gluing
and even high temperature solder reflow.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE
RATED
POWER
Pn
W
LIMITING
ELEMENT
VOLTAGE
V
MAX. OVERLOAD RESISTANCE
TEMPERATURE UNIT
TOLERANCE
VOLTAGE
RANGE
(1)
COEFFICIENT WEIGHT
±%
V
± ppm/°C
mg
1
3
2
4
5
8
8
26
25
21
42
12
CHP0502
0.050
50
100
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0502 0502
CHP0505
0505
0.125
50
100
0.1 to 10M
0.5, 1, 2, 5
100, 200
HCHP0505
CHP0603
0603
0.125
50
100
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0603
CHP0805
(2)
0.200
150
300
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0805 0805
CHP1005
1005
0.250
150
300
0.1 to 50M
0.5, 1, 2, 5
100, 200
HCHP1005
CHP1206
1206
0.250
200
400
0.1 to 50M
0.5, 1, 2, 5
100, 200
HCHP1206
CHP1505
0.500
200
400
0.1 to 75M
0.5, 1, 2, 5
100, 200
HCHP1505 1505
CHP2010
2010
1.000
(3)
200
400
0.1 to 100M
0.5, 1, 2, 5
100, 200
HCHP2010
CHP1020
1020
1.000
(3)
200
400
0.1 to 10M
0.5, 1, 2, 5
100, 200
HCHP1020
CHP2208
0.750
200
400
0.1 to 100M
0.5, 1, 2, 5
100, 200
HCHP2208 2208
CHP2512
2512
2.000
(3)
250
500
0.1 to 100M
0.5, 1, 2, 5
100, 200
CHP2512
CHP1010
1010
0.500
200
400
0.1 to 25M
0.5, 1, 2, 5
100, 200
CHP1010
Notes
(1)
Shall be read in conjunction with other tables
(2)
Model CHP0805 being same size than case 0705 with same performances, only codification of CHP0805 remains
(3)
With special assembly care
Revision: 24-Jan-18
Document Number: 52023
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
DIMENSIONS
in millimeters
(F) and (W)
(B), (G), and (N)
D
C
D
C
B
B
E
A
E
A
CASE
SIZE
0502
0505
0603
0805
1005
1010
1020
1206
1505
2010
2208
2512
A
± 0.152
1.22
1.22
1.60
1.85
2.49
2.49
2.49
3.00
3.70
5.03
5.53
6.30
B
± 0.127
0.70
1.25
0.90
1.25
1.25
2.64
5.18
1.73
1.25
2.64
2.05
3.30
C
± 0.127
0.38
0.38
0.38
0.38
0.38
0.38
0.50
0.38
0.50
0.50
0.50
0.50
D
± 0.127
0.20
0.20
0.31
0.31
0.31
0.31
0.31
0.40
0.50
0.50
0.50
0.50
E
± 0.127
0.31
0.31
0.40
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
SUGGESTED LAND PATTERN
(to IPC-7351A) in millimeters
G
min.
X
max.
Z
max.
CASE SIZE
0502
0505
0603
0805
1005
1010
1020
1206
1505
2010
2208
2512
Z
max.
1.77
1.77
2.15
2.70
3.34
3.34
3.34
3.85
4.55
5.88
6.38
7.15
G
min.
0.19
0.19
0.39
0.44
1.08
1.08
1.08
1.59
2.29
3.62
4.12
4.89
X
max.
0.83
1.38
1.03
1.38
1.38
2.77
5.31
1.85
1.38
2.77
2.18
3.43
Revision: 24-Jan-18
Document Number: 52023
2
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
POWER DERATING CURVE
Rated Power (%)
100
80
60
40
20
0
Vishay Sfernice
MECHANICAL SPECIFICATIONS
Substrate
Technology
Protection
Alumina
Thick film (ruthenium oxide)
0.5
<
R
< 100 M: epoxy coating
R
0.5
:
overglaze protection
(no epoxy coating)
B (W/A):
SnPb over nickel barrier
for solder reflow
N (W/A):
SnAg over nickel barrier
for solder reflow
F (Flip Chip):
SnAg over nickel barrier
for solder reflow
W (one face) and G (W/A) type:
gold over nickel barrier
for other applications
Terminations
0
20
40
60 70 80
100
120
140 155
Ambient Temperature in °C
PACKAGING
ESD packaging available: Waffle pack and plastic tape and
reel (low conductivity). Paper tapes available on request
(ESD only).
NUMBER OF PIECES PER
WAFFLE
TAPE AND
PACK
MIN. MAX.
400
4000
100
221
140
60
100
60
60
50
5000
8 mm
4000
100
2000
2500
4000
1000
2000
8 mm
8 mm
8 mm
8 mm
8 mm
Note
• Refer to Application Note “Guidelines for Vishay
Sfernice
Resistive
and
Inductive
Components”
(www.vishay.com/doc?52029) for recommended reflow profile.
Profile #3 applies
SIZE
MOQ
TAPE
WIDTH
CLIMATIC SPECIFICATIONS
Operating temperature
range
-55 °C; +155 °C
0502
0505
0603
0805
1005
1206
1505
2010
1010
2208
1020
2512
Note
• For temperature up to 215 °C please consult Vishay Sfernice
BEST TOL. AND TCR VS. OHMIC VALUE
OHMIC VALUE
RANGE in
10
<
R
< 5M
5
<
R
< 10M
1
<
R
<
R
max.
0.1
<
R
<
R
max.
TIGHTEST
TOLERANCE
(%)
0.5 % (D)
1 % (F)
2 % (G)
5 % (J)
(1)
100
BEST
TCR
(ppm/°C)
100 (K)
100 (K)
200 (L)
200 (L)
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay Sfernice for specific ordering
code
Tape and Reel
See Part Numbering information to get the quantity desired
by tape.
Note
(1)
Improved performance on request
CHIPS FOR HIGH FREQUENCY APPLICATIONS
The HF performance of flip chip and W/A types can be
improved on request.
Please ask for HCHP
Revision: 24-Jan-18
Document Number: 52023
3
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
TYPICAL HF PERFORMANCE OF HCHP
2.0
1.8
1.6
1.4
1.2
2.0
1
Ω
10
Ω
1.8
1.6
1.4
1.2
1
Ω
10
Ω
Vishay Sfernice
|Z|/R
|Z|/R
1.0
0.8
0.6
0.4
0.2
0
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
100
Ω
200
Ω
1.0
0.8
0.6
100
Ω
1 kΩ
200
Ω
1 kΩ
0.4
0.2
0
10 000
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
10 000
Size 0603 (W/A)
f (MHz)
Size 0603 (Flip chip)
f (MHz)
POPULAR OPTIONS
For any option it is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged terminations:
0063
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat
sinks (see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film,
PRA Arrays, CHP Thick Film)
www.vishay.com/doc?53048.
Option to order: 0063 (applies to size 1206 / 1505 / 1020 / 2010 / 2512).
DIMENSIONS
(Option 0063) in millimeters
Bottom view for mounting
Uncoated
ceramic
Enlarged
termination
C
E
B
D
A
CASE
SIZE
1206
1505
2010
1020
2208
2512
A
± 0.152
3.00
3.70
5.03
2.49
5.53
6.30
B
± 0.127
1.73
1.25
2.64
5.18
2.05
3.30
C
± 0.127
0.38
0.50
0.50
0.50
0.50
0.50
D
± 0.127
0.40
0.50
0.50
0.31
0.50
0.50
E
± 0.127
1.19
1.54
2.20
0.93
2.45
2.84
Revision: 24-Jan-18
Document Number: 52023
4
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
SUGGESTED LAND PATTERN
(Option 0063)
G
min.
X
max.
Z
max.
CASE SIZE
1206
1505
2010
1020
2208
2512
DIMENSIONS (IN MILLIMETERS)
Z
max.
3.85
4.55
5.88
3.34
6.38
7.15
G
min.
0.50
0.50
0.50
0.50
0.50
0.50
X
max.
1.86
1.38
2.77
5.31
2.18
3.43
OPTION: MARKING
Option to order 0013:
Marking of ohmic value and tolerance:
Sizes: 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes: 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
Tolerance indicated by a color dot.
Option to order 0014:
Marking of ohmic value:
Sizes 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
No standard marking available for smaller sizes.
A price adder will apply to the unit price of the parts for options 0013 and 0014.
PERFORMANCE
TESTS
Termination adhesion
Resistance to solder heat
CONDITIONS
5N for 10 s
Immersion 10 s
in Sn/Pb 60/40
at +260 °C
5 cycles
-55 °C
+155 °C
Phase A dry heat
Phase B damp heat
Phase C cold -55 °C
Phase D damp heat 5 cycles
56 days
AEC-Q200
85 °C / 85 % RH / Pn / 10
1000 h
6.25 Pr
for 2 s
1000 h at rated power
90’/30’ at +70 °C
REQUIREMENTS
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
TYPICAL VALUES
AND DRIFTS
< ± 0.1 %
< ± 0.1 %
Rapid temperature change
< ± 0.1 %
Climatic sequence
Humidity (steady state)
Moisture resistance
Short time overload
Load life
± (1 % + 0.05
)
± (1 % + 0.05
)
5 % + 0.05
± (0.25 % + 0.05
)
1000 h
± (1 % + 0.05
)
1000 h
< 0.25 %
< ± 0.2 %
< ± 0.2 %
Max. < 3 % + 0.05
< ± 0.1 %
2000 h
< 0.5 %
10 000 h
<1%
Revision: 24-Jan-18
Document Number: 52023
5
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

Differential input circuit

RF modulator circuit

Night clock circuit with 6 digit display

12V soft start regulated power supply circuit

DUM23-48/300II AC power distribution unit electrical schematic diagram

Introduction to PCB packaging
...
elvike PCB Design
Your resume is the first step to your success
A resume is the foundation for you to successfully get an offer. Only when the foundation is laid, the road to a successful job search will be broad and smooth. Are you confident in your resume? How c...
lijiaoeeworld Talking about work
MSP430 IIC controller programming (1)
[font=Arial][color=#000000][size=14px]Recently, I am developing a microcontroller program for a micro projector. The main purpose is to use a microcontroller to control the DLP chipset for correspondi...
Aguilera Microcontroller MCU
The ultrasonic generator control circuit frequently burns the protection resistor.
Recently, I found that after the circuit board on a product was re-made, the protection resistor R3 frequently burned out. Using an oscilloscope to measure, I found that the control signal wave1 wavef...
liuchuangc Power technology
How to calibrate the sensor tile?
I am a newbie, I would like to ask the experts, if I want to produce a product, I need to calibrate the g sensor, gyroscope and magnetometer. How do I calibrate it? The g sensor generally does not nee...
hezhengjia MEMS sensors
What is the assembly code for the ucos interrupt service subroutine to save the stack pointer to the task control block? I really don't know how to assemble it.
What is the assembly code for saving the stack pointer to the task control block in the ucos interrupt service subroutine? I really don't know how to assemble it. Please give me some advice. Thanks....
woshiyulei Real-time operating system RTOS
Shortcut:   S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components

  1. 57GE-20500-661(D40)-FA
  2. 240-384JMT15-35PPCBNK
  3. C192T224K5R5CS7409
  4. FW-08-03-L-D-255-065
  5. 550BF148M500DG
  6. 05007-BP221BFUR
  7. MC1206P-2320-FT101W
  8. C111301JCG1LF
  9. AME8501BEFVAF22
  10. 3.0SMCJ40A_R1_10001
  11. A2541HWV-2x10P
  12. A2541WR-4P-C808-G50

Popular Articles

  1. Wenjie cooperates with Israel's StoreDot to develop fast charging technology
  2. What are the advantages and disadvantages of ternary polymer lithium batteries?
  3. 35-Pulse meter (heart rate meter) based on 51 single chip microcomputer
  4. Honor foldable phone to be released at the end of the year: BOE and Visionox may supply screens
  5. Sichuan's "14th Five-Year Plan" new infrastructure plan is released, with 250,000 5G base stations by 2025
  6. Principle of generator hydrogen system_Main characteristics of generator hydrogen system
  7. Charging in 5 minutes and reaching 200+ kilometers of battery life, is electric vehicle supercharging technology a gimmick or black technology?
  8. USTC makes progress in machine learning to improve superconducting quantum bit reading efficiency
  9. Pinejie plans to build a SiC module packaging production line for automobiles
  10. Some speculations about "Apple Car"

Technical ResourceMore

  1. Highly sensitive underground metal detector
  2. Digital Electronic Technology Premium Course Electronic Lesson Plan
  3. Several Microwave Circuit Calculation Software
  4. OPNET14.5 Help Documentation
  5. Multi-output 5V/12V/3.3V switching regulated power supply
  6. Switching power supplies – principles, design and practical circuits
  7. Spread spectrum time domain reflectometry for locating cable faults.
  8. ULN2803 Chinese information.pdf
  9. Illustrated Introduction to New Technologies in Automotive Body Electronic Control Systems
  10. dToF (direct time of flight) algorithm model SimuLink simulation

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Index Files: 2130  1055  93  1549  2350  43  22  2  32  48 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号