A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
Live Topic: A new generation of products based on the optimized design of Melexis second-generation position sensors, with higher performance and competitive costBrief introduction: This seminar mainl...
Now I am doing a project. Due to the limitation of 51 MCU resources, I can only communicate by simulating I2C. It is relatively simple for the host to simulate I2C, but it is a bit difficult for the s...
The lower computer sends data to the upper computer, but I haven't written the receiving software for the upper computer yet. I want to know whether the GPRS data has been sent to the upper computer c...
In the process of PCB wiring, what is the bus wiring method? ? In the county card, the motherboard saw that its wiring was very beautiful. After asking, it was said that it was bus wiring. I don't und...
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
The structure of an LCD TV primarily consists of the LCD display module, power module, driver module (primarily including the main driver board and tuner board), and keypad module. LCD display modu...[Details]
Amidst the wave of intelligent automotive transformation, advanced driver assistance is gradually emerging from cutting-edge technology into the mainstream, becoming a new frontier of industry comp...[Details]
Smartphones have become essential digital devices, and the growing number of smartphone-centric applications is enriching people's lives. As users, they desire a better app experience and a wider r...[Details]
Charging is a familiar process for new energy vehicles, and as a source of battery energy, charging piles are crucial. New energy vehicle charging can be divided into fast charging and slow chargin...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
During daily operation of an R-type power transformer, the voltage used varies as the equipment being used adjusts. This raises the question: can the transformer change voltage at this point? The a...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
Silicon Labs (also known as "Silicon Labs"), an innovative leader in low-power wireless connectivity, will showcase its cutting-edge artificial intelligence (AI) and Internet of Things (IoT) solu...[Details]
Renesas Electronics introduces a new USB-C power solution with an innovative three-level topology.
Improve performance while reducing system size
New solution combines excel...[Details]
As the power density of modern electronic systems continues to increase, effective thermal management has become critical to ensuring system performance, reliability, and longevity—especially in hi...[Details]
In recent years, with the development of MOSFETs, they have gradually replaced transistors in the low-power, fast-switching industry. Major manufacturers in this field have also been reducing their...[Details]
Electronic devices are small individual components in electronic circuits. Transistors are common electronic components. Because of their wide range of applications, according to the usage of the e...[Details]
EVTank predicts that all-solid-state batteries will achieve small-scale mass production in 2027 and large-scale shipments by 2030. Global solid-state battery shipments will reach 614.1GWh, of which...[Details]
introduction
Commercial air conditioner PCBs involve both high-voltage and low-voltage power. The power supply for commercial air conditioners often passes through the controller. This forces ...[Details]