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DSPIC33EP256MU806T-I/MR

Description
IC MCU 16BIT 256KB FLASH 64QFN
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size6MB,20 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Download user manual Parametric View All

DSPIC33EP256MU806T-I/MR Overview

IC MCU 16BIT 256KB FLASH 64QFN

DSPIC33EP256MU806T-I/MR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeQFN
package instructionQFN-64
Contacts64
Reach Compliance Codecompliant
ECCN code3A991.A.2
Factory Lead Time23 weeks
Has ADCYES
Address bus width
bit size16
boundary scanYES
CPU seriesDSPIC33
maximum clock frequency60 MHz
DAC channelNO
DMA channelYES
External data bus width
FormatFLOATING-POINT
Integrated cacheNO
JESD-30 codeS-PQCC-N64
JESD-609 codee3
length9 mm
low power modeYES
Humidity sensitivity level3
Number of DMA channels15
Number of external interrupt devices5
Number of I/O lines51
Number of serial I/Os
Number of terminals64
Number of timers9
On-chip data RAM width8
On-chip program ROM width8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Encapsulate equivalent codeLCC64,.35SQ,20
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Certification statusNot Qualified
RAM (bytes)28672
rom(word)286720
ROM programmabilityFLASH
Maximum seat height1 mm
speed70 MHz
Maximum slew rate320 mA
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width9 mm
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