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MXLP6KE9.1CAE3TR

Description
600W, BIDIRECTIONAL, SILICON, TVS DIODE, ROHS COMPLIANT, PLASTIC, T-18, 2 PIN
Categorydiode   
File Size320KB,4 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance  
Download Datasheet Parametric View All

MXLP6KE9.1CAE3TR Overview

600W, BIDIRECTIONAL, SILICON, TVS DIODE, ROHS COMPLIANT, PLASTIC, T-18, 2 PIN

MXLP6KE9.1CAE3TR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrosemi
package instructionO-PALF-W2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Other featuresHIGH RELIABILITY
Maximum breakdown voltage9.55 V
Minimum breakdown voltage8.65 V
Breakdown voltage nominal value9.1 V
Shell connectionISOLATED
Maximum clamping voltage13.4 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeO-PALF-W2
JESD-609 codee3
Humidity sensitivity level1
Maximum non-repetitive peak reverse power dissipation600 W
Number of components1
Number of terminals2
Package body materialPLASTIC/EPOXY
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityBIDIRECTIONAL
Maximum power dissipation1.47 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage7.78 V
surface mountNO
technologyAVALANCHE
Terminal surfaceMATTE TIN
Terminal formWIRE
Terminal locationAXIAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
Website: http://www.microsemi.com
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
600W Transient Voltage Suppressor
- High Reliability controlled devices
- Economical series for thru hole mounting
- Unidirectional (A) and Bidirectional (CA) construction
- Selections for 5.8 to 171 V standoff voltages (V
WM
)
LEVELS
M, MA, MX, MXL
DEVICES
MP6KE6.8A thru MP6KE200CA, e3
FEATURES
High reliability controlled devices with wafer fabrication and assembly lot traceability
100 % surge tested devices
Optional upscreening available by replacing the M prefix with MA, MX or MXL. These prefixes
specify various screening and conformance inspection options based on MIL-PRF-19500.
Refer to
MicroNote 129
for more details on the screening options.
Surface mount equivalents available as MSMBJ5.0A to MSMBJ170CA
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B
RoHS Compliant devices available by adding “e3” suffix
3σ lot norm screening performed on Standby Current I
D
APPLICATIONS / BENEFITS
Economical TVS series for thru-hole mounting
2
Protects sensitive components such as IC’s, CMOS, Bipolar, BiCMOS, ECL, DTL, T L, etc.
Protection from switching transients & induced RF
Compliant to IEC 61000-4-2 and IEC 61000-4-4 for ESD and EFT protection respectively
Secondary lightning protection per IEC61000-4-5 with 42 Ohms source impedance:
o
Class 1: MP6KE6.8A to MP6KE130A or CA
o
Class 2: MP6KE6.8A to MP6KE68A or CA
o
Class 3: MP6KE6.8A to MP6KE36A or CA
o
Class 4: MP6KE6.8A to MP6KE18A or CA
Secondary lightning protection per IEC61000-4-5 with 12 Ohms source impedance:
o
Class 1: MP6KE6.8A to MP6KE43A or CA
o
Class 2: MP6KE6.8A to MP6KE22A or CA
T-18
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25 C: 600 watts at 10/1000 μs (also see Figures 1,2, and 3)
with impulse repetition rate (duty factor) of 0.01 % or less
t
clamping
(0 V to
V
(BR)
min.): < 100 ps theoretical for unidirectional and < 5 ns for bidirectional
°
°
Operating and Storage temperature: -65 C to +150 C
°
Thermal Resistance: 25 C/W at 3/8 inch (10 mm) lead length from body, or 85
C/W
junction
2
to ambient when mounted on FR4 PC board with 4 mm copper pads (1 oz) and track width 1
mm, length 25 mm
°
Steady-State Power: 5 watts @ T
L
=25 C 3/8 inch (10 mm) from body, or 1.47 W when
mounted on FR4 PC board described for thermal resistance
°
Forward Voltage at 25 C: 3.5 Volts maximum @ 100 Amp peak impulse of 8.3 ms half-sine
wave (unidirectional only)
°
Solder temperatures: 260 C for 10 s (maximum)
°
RF01007 Rev A, June 2010
High Reliability Product Group
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