18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
CONNEXION POSITION ON STRIP
PACKAGING SPECIFICATION : PK-98915-001
Strip unwinded
L
3
Engineering Control ID
(23
max )
(4)
0
7.0
-0.1
L
Dire
(2)
⌖
0.05
B
1
2
1
Adhesive paper
ctio
no
f un
win
d
(PITCH = 9.2)
(
⌀
2)
2
K
⌀
2.70
±
0.05
K
Paper intermediate layer
+0.05
4
0.2
-0.10
Packaging
J
3
±
0.2
23
3.5
24
Y
4.1
A
6
25
Tool Code
0.50
+0.15
-0.20
12
⌯
0.1
B
7
+0.10
5
0.10
-0.0
D
17
⌯
0.1
B
18
J
8
0.15 max
W-W
1
+0.05
22
-0.10
16
0.80
±
0.20
9
B
0.15 max
W
Z
26
1.5
19
E
H
5
2.05
±
0.20
H
13
20
U
B
U
27
G
11
⌯
0.1
B
10
21
G
0.75
+0.15
0
R
RC
Z-Z
15
⌯
0.15
B
14
W
X-X
0
5.5
-0.2
29
Z
RF
Y
Y-Y
G
X
V
R
0.
35
+
-0
0.10
.0
5
(x
4)
34
F
sp
he
r
F
0.50
±
0.05
41
31
30
±
0
45
T-T
1.50
+0.10
-0.30
33
39
U-U
90
°
±
1
°
36
V-V
D
1.
28
3.
00
18 max (for note)
±
0
.1
E
(x
.0
5
32
3.
4)
X
V
1.60
+0.25
-0.15
0
0.90
-0.05
E
0
25
±
0
.0
5
45
35
T
(SKC)
COTES CARACTERISTIQUES SPECIALES
SPECIAL KEY CHARACTERISTICS
INDICATION DIMENSIONS S.P.C
DENOTES S.P.C DIMENSIONS
D
1.1
±
0.15
40
°
NOTE:
C
INDICATION DIMENSIONS CRITIQUES
DENOTES CRITICAL DIMENSIONS
- APPLICATION SPECIFICATION ACCORDING TO AS-64323-001
- ALL DIMENSIONS ARE TAKE OVER FROM THE 3D MODEL.
37
3.
55
DELIMITED GOLD PLATED AREA
T
1
INDICATION DIMENSIONS FONCTIONNELLES
DENOTES FUNCTIONAL DIMENSIONS
QUANTITE PAR FEUILLE INDIVIDUELLE
QUANTITY PER INDIVIDUAL SHEET
C
±
0
.0
5
0
4
(SKC) 0
2
B
BOX TERMINAL
BODY TERMINAL
DESIGNATION
STAINLESS STEEL thickness : 0.15 mm
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
1
MARK
HIGH CONDUCTIVITY COPPER ALLOY thickness : 0.3 mm
MATERIAL
DIMENSION UNITS
SCALE
CURRENT REV DESC: NX RE-MASTERING
B
MM
0.2420
0.50 TO 1
15:1
±
±
±
±
±
±
2.0 °
0643231029
0643231319
0643231039
0643231219
A
Sn
Au 1.27µ MINI
Sn
3.1
2.8
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
0.575
3.25
3.45
0.95
0.15
EC NO:
114689
Sn
Sn
Ni
>1 TO 2
0.2442
0.2580
3.7
3.3
0.9
4 PLACES
0.1
0.1
0.1
0.1
0.1
Sn
Au 1.27µ MINI
3.95
4.15
1.15
0.3
3 PLACES
2 PLACES
1 PLACE
0 PLACES
Sn
CRIMPING AREA
PLATING
Ni
UNDERLAYER
CRIMPING RANGE
(mm2)
0.2602
A±0.3
B±0.3
rC±0.2
D±0.3
E±0.3
rF±0.2
G
±
0.1
CONTACT AREA
MATERIAL NUMBER
WEIGHT
(g)
DRWN:
GMANIVANNAN
CHK'D: SLAFAURE
APPR:
SLAFAURE
INITIAL REVISION:
DRWN:
VGUERIN
APPR:
LSTICKEIR
FIRST ANGLE PROJECTION
2018/03/15
2018/06/04
2018/06/14
2007/11/07
2007/11/07
SERIES
CP RCPT TRM 1.5
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
A
SD-64323-001
MATERIAL NUMBER
CUSTOMER
PSD
000
C1
DOCUMENT STATUS
FORMAT: master-tb-prod-A1
REVISION: H
DATE: 2018/01/18
P1
17
RELEASE DATE
16
2018/06/14
12:23:40
15
14
13
12
11
10
9
8
7
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
DRAWING
SHEET NUMBER
A1-SIZE
5
4
64323
SEE CHART
3
GENERAL MARKET
2
1 OF 1
1
18
6
Microcontroller MCU
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