EEWORLDEEWORLDEEWORLD

Part Number

Search

0603J2002P70DUT

Description
CAP CER 2.7PF 200V C0G/NP0 0603
CategoryPassive components   
File Size1MB,13 Pages
ManufacturerKnowles
Websitehttp://www.knowles.com
Environmental Compliance
Download Datasheet Parametric View All

0603J2002P70DUT Overview

CAP CER 2.7PF 200V C0G/NP0 0603

0603J2002P70DUT Parametric

Parameter NameAttribute value
capacitance2.7pF
Tolerance±0.5pF
Voltage - Rated200V
Temperature CoefficientC0G,NP0
Operating temperature-55°C ~ 125°C
characteristicHigh Q value, low loss, ultra-low ESR
grade-
applicationRF, microwave, high frequency
failure rate-
Installation typeSurface mount, MLCC
Package/casing0603 (1608 Metric)
size/dimensions0.063" long x 0.032" wide (1.60mm x 0.80mm)
Height - Installation (maximum)-
Thickness (maximum)0.032"(0.80mm)
lead spacing-
Lead form-
notifyThere is currently market demand for these product types, so lead times will change and extend. Lead times may vary.
ESR
Ultra-low ESR “U” Range
“U” range of Ultra-low ESR Capacitors
Electrical Details
Capacitance Range
0.1pF to 1.0nF
Temperature Coefficient of Capacitance (TCC) 0 ± 30ppm/˚C (C0G)
Q factor
Insulation Resistance (IR)
Dielectric Withstand Voltage (DWV)
Operating temperature range
Ageing Rate
>2000 @ 1MHz
100GΩ or 1000secs (whichever is the less)
Voltage applied for 5 ±1 seconds, 50mA
charging current maximum
-55ºC / +125ºC
Zero
The Ultra-low ESR “U” range offers a very stable, High Q material system
that provides excellent low loss performance in systems below 3GHz.
Optimised for lowest possible ESR, this range of high frequency capacitors
is suitable for many applications where economical, high performance is
required.
Size
Length mm
(L1)
1.6 ± 0.2
Width mm
(W)
0.8 ± 0.2
Thickness mm
(T)
0.8 Max
Band mm
(L2)
0.10 – 0.40
0603
0805
2.0 ± 0.3
1.25 ± 0.2
1.3 Max
0.13 – 0.75
1111
2.79 +0.51/-0.25
2.79 ± 0.38
2.0±0.2*
0.13
– 0.63
* - 1111 capacitance values < 2.2pF, maximum thickness 1.78mm
Ordering Information – Ultra-low ESR “U” Range
0805
Chip Size
0603
0805
1111
J
Termination
J
= Silver or copper
base with nickel
barrier (100% matte
tin plating).
RoHS compliant
A
= Silver or copper
base with nickel
barrier (tin/lead
plating with min. 10%
lead).
Not RoHS compliant
250
Voltage d.c.
(marking code)
200 = 200V
250 = 250V
300 = 300V
500 = 500V
630 = 630V
1K0 = 1000V
1K5 = 1500V
2K0 = 2000V
0101
Capacitance in Pico
farads (pF)
<1.0pF
Insert a P for the decimal
point as the first character.
e.g.,
P300
= 0.3pF
Values in 0.1pF steps
≥1.0pF & <10pF
Insert a P for the decimal
point as the second
character.
e.g.,
8P20
= 8.2pF
Values are E24 series
≥10pF
First digit is 0.
Second and third digits are
significant figures of
capacitance code.
The fourth digit is the
number of zeros following.
e.g.,
0101
= 100 pF
Values are E24 series
≥10pF
F:
± 1%
G:
± 2%
J:
± 5%
K:
± 10%
J
Capacitance
Tolerance
<10pF
H:
± 0.05pF
B:
± 0.10pF
C:
± 0.25pF
D:
± 0.5pF
U
Dielectric
U =
Ultra-low ESR
“U” range
T
Packaging
T
= 178mm
(7”) reel
R
= 330mm
(13”) reel
B
= Bulk pack
– tubs or trays
Europe:
Knowles Precision Devices
Sales contact e-mail
Asia:
USA:
KPD-Europe-sales@knowles.com
KPD-Asia-sales@knowles.com
KPD-NA-sales@knowles.com
© Knowles 2015
www.knowlescapacitors.com
UESRDatasheet Issue 10 Release Date 11/09/18
Page 1 of 13
Types and characteristics of chip capacitors
Types and characteristics of chip capacitorsMonolithic ceramic capacitors ( commonly known as chip capacitors ) are currently a common component with a relatively large amount of use. As for the chip ...
fighting Discrete Device
Doubts about s3c2440 watchdog!!
First post the source code of FL, which is an assembly source file, and its function is to make all 4 LEDs light up.AREA SAMPLE,CODE,READONLYENTRY;EntranceSTART;Write the label at the topLDRR3,=0x5600...
xujiangyu0619 Embedded System
Are there any pure domestically produced microcontrollers?
Are there any pure domestic microcontrollers? Including development software IDE...
kernelkoder MCU
Very good, powerful and appropriate - real-time image dehazing
[table=98%] [tr][td][align=left][p=16, null, left]Fujitsu's panoramic in-vehicle 3D imaging system solution was used in product development before (the main chip used was the MB86R11 launched in 2010,...
lord Automotive Electronics
EEWORLD University ---- Renesas Developer Conference
Renesas Developer Conference : https://training.eeworld.com.cn/course/3889...
wanglan123 Talking
Driver DLL migration
I now have a hardware platform, the OS inside is from another company, I have the BSP developed by this company, but I don't have the source code of the Bluetooth template. Can I make a new BSP by mys...
swustboy Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2538  1709  2174  1679  2292  52  35  44  34  47 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号