MKI48Z12B20 datasheet, PDF - EEWORLD Datasheet

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MKI48Z12B20: Description2KX8 NON-VOLATILE SRAM MODULE, 200ns, PDIP24, PLASTIC, HDIP-24; Categorystorage; File Size304KB，11 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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MKI48Z12B20 Overview

2KX8 NON-VOLATILE SRAM MODULE, 200ns, PDIP24, PLASTIC, HDIP-24

MKI48Z12B20 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	DIP
package instruction	DIP, DIP24,.6
Contacts	24
Reach Compliance Code	not_compliant
ECCN code	EAR99
Is Samacsys	N
Maximum access time	200 ns
Other features	BATTERY BACKUP; POWER SUPPLY WRITE PROTECTION
JESD-30 code	R-PDIP-T24
JESD-609 code	e0
memory density	16384 bit
Memory IC Type	NON-VOLATILE SRAM MODULE
memory width	8
Mixed memory types	N/A
Number of functions	1
Number of ports	1
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	9.562 mm
Maximum standby current	0.001 A
Maximum slew rate	0.08 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

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MKI48Z12B20 Related Products

	MKI48Z12B20	MKI48Z02B20	MKI48Z12B15	MKI48Z12B25	MKI48Z02B25	MKI48Z02B15
Description	2KX8 NON-VOLATILE SRAM MODULE, 200ns, PDIP24, PLASTIC, HDIP-24	2KX8 NON-VOLATILE SRAM MODULE, 200ns, PDIP24, PLASTIC, HDIP-24	2KX8 NON-VOLATILE SRAM MODULE, 150ns, PDIP24, PLASTIC, HDIP-24	2KX8 NON-VOLATILE SRAM MODULE, 250ns, PDIP24, PLASTIC, HDIP-24	2KX8 NON-VOLATILE SRAM MODULE, 250ns, PDIP24, PLASTIC, HDIP-24	2KX8 NON-VOLATILE SRAM MODULE, 150ns, PDIP24, PLASTIC, HDIP-24
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP, DIP24,.6	DIP, DIP24,.6	PLASTIC, HDIP-24	PLASTIC, HDIP-24	DIP, DIP24,.6	PLASTIC, HDIP-24
Contacts	24	24	24	24	24	24
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maker	STMicroelectronics	-	-	STMicroelectronics	STMicroelectronics	STMicroelectronics
Maximum access time	200 ns	-	150 ns	250 ns	250 ns	150 ns
Other features	BATTERY BACKUP; POWER SUPPLY WRITE PROTECTION	-	BATTERY BACKUP; POWER SUPPLY WRITE PROTECTION	BATTERY BACKUP; POWER SUPPLY WRITE PROTECTION	BATTERY BACKUP; POWER SUPPLY WRITE PROTECTION	BATTERY BACKUP; POWER SUPPLY WRITE PROTECTION
JESD-30 code	R-PDIP-T24	-	R-PDIP-T24	R-PDIP-T24	R-PDIP-T24	R-PDIP-T24
JESD-609 code	e0	-	e0	e0	e0	e0
memory density	16384 bit	-	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	NON-VOLATILE SRAM MODULE	-	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE
memory width	8	-	8	8	8	8
Mixed memory types	N/A	-	N/A	N/A	N/A	N/A
Number of functions	1	-	1	1	1	1
Number of ports	1	-	1	1	1	1
Number of terminals	24	-	24	24	24	24
word count	2048 words	-	2048 words	2048 words	2048 words	2048 words
character code	2000	-	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	-	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C
organize	2KX8	-	2KX8	2KX8	2KX8	2KX8
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	-	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	-	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.6	-	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	-	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	-	5 V	5 V	5 V	5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	9.562 mm	-	9.562 mm	9.562 mm	9.562 mm	9.562 mm
Maximum standby current	0.001 A	-	0.001 A	0.001 A	0.001 A	0.001 A
Maximum slew rate	0.08 mA	-	0.08 mA	0.08 mA	0.08 mA	0.08 mA
Maximum supply voltage (Vsup)	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	-	4.5 V	4.5 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	-	5 V	5 V	5 V	5 V
surface mount	NO	-	NO	NO	NO	NO
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	-	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	-	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	-	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	-	15.24 mm	15.24 mm	15.24 mm	15.24 mm

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