SPC5744PGK1AMMM9 datasheet, PDF

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SPC5744PGK1AMMM9: DescriptionIC MCU 32BIT 2.5MB FLASH 257PBGA; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，115 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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SPC5744PGK1AMMM9 Overview

IC MCU 32BIT 2.5MB FLASH 257PBGA

SPC5744PGK1AMMM9 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
package instruction	FBGA,
Reach Compliance Code	compliant
Samacsys Description	32-bit Microcontrollers - MCU 2 x e200Z4 cores in LS, 200 MHz, 2.5MB Flash, 384kB SRAM, MAPBGA 257, 1 x FlexRay, 1 x Ethernet, 40 C to +125 C
Has ADC	YES
Address bus width	32
bit size	32
maximum clock frequency	40 MHz
DMA channel	YES
External data bus width	64
length	14 mm
Humidity sensitivity level	3
Number of terminals	257
PWM channel	YES
encapsulated code	FBGA
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)	260
speed	200 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	3.15 V
Nominal supply voltage	3.3 V
surface mount	YES
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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NXP Semiconductors

Data Sheet: Technical Data

Document Number MPC5744P

Rev. 6.1, 11/2017

32-bit MCU suitable for ISO26262 ASIL-

D chassis and safety applications

Features

• The MPC5744P microcontroller is based on the Power

Architecture® developed by NXP. It targets chassis

and safety applications and other applications requiring

a high Automotive Safety Integrity Level (ASIL). The

MPC5744P is a SafeAssure solution.

• This document provides electrical specifications, pin

assignments, and package diagram information for the

MPC5744P series of microcontroller units (MCUs).

For functional characteristics and the programming

model, see the MPC5744P Reference Manual.

• Junction temperature: The upper limit is 150°C or

165°C depending on the device marking.

MPC5744P Data Sheet

MPC5744P

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Introduction.......................................................................................... 3

1.1

1.2

Features......................................................................................3

Block Diagram...........................................................................5

3.12 Main oscillator electrical characteristics................................... 69

3.13 PLLDIG electrical characteristics............................................. 72

3.14 16 MHz Internal RC Oscillator (IRCOSC) electrical

specifications............................................................................. 73

3.15 ADC electrical characteristics................................................... 74

3.16 Flash memory specifications..................................................... 77

3.16.1

3.16.2

3.16.3

Maximum junction temperature 150°C.....................77

Maximum junction temperature 165°C.....................80

Flash memory read wait-state and address-pipeline

control settings.......................................................... 84

3.17 SGEN electrical characteristics................................................. 85

3.18 RESET sequence duration.........................................................86

3.19 AC specifications.......................................................................86

3.19.1

Reset pad (EXT_POR, RESET) electrical

characteristics............................................................87

3.19.2

3.19.3

3.19.4

3.19.5

3.19.6

3.19.7

3.19.8

WKUP/NMI timing...................................................89

Debug/JTAG/Nexus/Aurora timing..........................89

External interrupt timing (IRQ pin).......................... 96

SPI timing................................................................. 97

LFAST...................................................................... 102

FlexRay..................................................................... 106

Ethernet switching specifications..............................109

2 Pinouts..................................................................................................6

2.1

2.2

Package pinouts and ballmap.................................................... 6

Pin/ball descriptions ................................................................. 8

2.2.1

2.2.2

2.2.3

2.2.4

2.2.5

2.2.6

Pin/ball startup and reset states................................. 8

Power supply and reference voltage pins/balls......... 9

System pins/balls.......................................................12

LVDS pins/balls........................................................13

Generic pins/balls......................................................14

Peripheral input muxing............................................43

3 Electrical characteristics.......................................................................55

3.1

3.2

3.3

3.4

3.5

Introduction............................................................................... 55

165°C junction temperature option........................................... 55

Absolute maximum ratings....................................................... 55

Recommended operating conditions......................................... 57

Thermal characteristics..............................................................58

3.5.1

General notes for specifications at maximum

junction temperature................................................. 59

3.6

3.7

3.8

3.9

Electromagnetic compatibility (EMC)...................................... 60

Electrostatic discharge (ESD) characteristics............................62

Voltage regulator electrical characteristics............................... 62

DC electrical characteristics...................................................... 65

4 Obtaining package dimensions.............................................................111

5 Ordering information............................................................................112

6 Document revision history................................................................... 113

3.10 Supply current characteristics....................................................67

3.11 Temperature sensor................................................................... 69

MPC5744P Data Sheet, Rev. 6.1, 11/2017

NXP Semiconductors

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