Default packaging is "Bulk Bag." An ordering code C-Spec is not required for "Bulk Bag" packaging.
The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking."
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
3
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information."
3
For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
3
All automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For
[i=s] This post was last edited by Chu Zhiheng on 2015-3-27 18:08 [/i] I am making a board recently. Because the power of the circuit is relatively high, part of the circuit is directly laid out with ...
[i=s]This post was last edited by tiankai001 on 2018-2-11 14:07[/i] [align=left][color=rgb(34, 34, 34)][font="]There are a lot of high-frequency interference components in the 220V AC city power grid....
Requirements: Input DC110V, output DC5V, 12V, 24V. Please recommend a suitable chip. Price is not a big deal, quantity is not large. It is best to find the block diagram online. Electrical isolation a...
Many editors now support holding down a key combination like CTRL+ALT to select multiple lines, and then writing or editing multiple lines at the same time. The editor provided by Gao Yunyun can also ...
This design consists of a land-based unit, a motor unit and a submarine model. The motion control of the submarine model is realized through medium wave communication and infrared communication. The l...
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Administration (USPTO) for a patent for a remote vehicle control system that may be used in future ...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
In recent years, with the application of the IEC61850 standard and the development and deployment of optoelectronic transformers, the concept of digital substations has been put into practical use ...[Details]
Current Development Status of DVR Market
A DVR, or digital video recorder, uses a hard disk for recording, unlike traditional analog video recorders. It's often called a DVR because it's a com...[Details]
The structure of an LCD TV primarily consists of the LCD display module, power module, driver module (primarily including the main driver board and tuner board), and keypad module. LCD display modu...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Smartphones have become essential digital devices, and the growing number of smartphone-centric applications is enriching people's lives. As users, they desire a better app experience and a wider r...[Details]
In the electronics manufacturing industry, surface mount technology (SMT) placement machines are core equipment for production lines. However, with many different models available on the market, ch...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Through AI connection technology supported by Qualcomm X85 5G modem and RF and Qualcomm FastConnect 7900 mobile connection system, seamless switching can be achieved between cellular net...[Details]
On August 22, the Wall Street Journal reported on the 21st local time that the new US government does not plan to acquire equity in semiconductor wafer foundry giant TSMC and Micron, one of the thr...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
When American cartoonist Chester Gould sketched the watch on Dick Tracy's wrist, he had no idea that science fiction would become reality 70 years later. As a comic strip artist, Gould imagined fut...[Details]
Compiled from semiengineering
The industry is increasingly concerned about power consumption in AI, but there are no simple solutions. This requires a deep understanding of software and ...[Details]