RF integration without compromise
At NXP, we are committed to ensuring you have the best
mobile connection at all times.
With more than 3 Billion consumers online and over 50 Billion connected
devices, the demand for always-on, always-connected devices continues
to surge. With access to the internet by mobile device increasing by more
than 200% every year, mobile device manufacturers and infrastructure
network vendors now face unprecedented challenges to deliver the high
performance voice and data services for all the downloading, streaming
and cloud based services we have come to expect.
RF front-ends are becoming increasingly complex with the rapid
deployment of LTE underway. More antennas are needed as well as
support for an ever increasing number of cellular frequency bands. Just
a few years ago only a handful of bands would need to be supported,
whereas now 30+ bands are supported. To address all these RF
challenges, while simultaneously achieving miniaturization and cost
reduction, a new approach is needed.
The 20th edition of the RF Manual provides you with a comprehensive
overview of our Smart Antenna Solutions with the highest level of
integration without compromise; High performance, fully integrated
combinations of multiple RF functions close to the antennas, delivering
the highest, flawless performance, reliability, flexibility, quality or cost-
of-ownership.
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NXP Semiconductors RF Manual 20
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How to use the RF Manual
This document is a resource that lets you explore our RF portfolio.
Chapter 1 – Products by application
Discusses trends and requirements for particular applications,
and lists the products we recommend for target systems.
Chapter 2 – NXP technologies
Describes the special process and packaging technologies that
position us as a leader in RF.
Chapter 3 – Products by category
Presents products by function, with detailed specs for easy
comparison.
Chapter
4 – Design resources
Summarizes the design-support resources that help make it
easier to work with our products and reduce time-to-market.
Chapter 5 – Replacement for discontinued parts
Provides an overview of recently discontinued parts and their
(close) replacements from NXP.
Chapter 6 – Packaging information
Gives an overview of the packages and the marking codes.
Chapter 7 – Products by NXP type number
Gives all the NXP type numbers mentioned in this manual, in
alphanumeric order, so you can quickly find the details for a
specific product.
RF Manual web page
www.nxp.com/rfmanual
NXP Semiconductors RF Manual 20
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Contents
1
1.1
1.2
Products by application
8
New products
_______________________________________________________________________________________________________________________________________________________________________________________________________
8
Wireless connectivity mobile & wearable
___________________________________________________________________________________________________________________________________________________________
9
1.2.1 WLAN for mobile & wearable application
_________________________________________________________________________________________________________________________________________________
9
1.2.2 LTE LNA
____________________________________________________________________________________________________________________________________________________________________________________________________
10
1.2.3 GPS for smartphones, tablets and wearables
__________________________________________________________________________________________________________________________________________
11
Wireless communication infrastructure
_____________________________________________________________________________________________________________________________________________________________
14
1.3.1 Base stations (all cellular standards and frequencies)
_____________________________________________________________________________________________________________________________
14
1.3.2 Repeater
___________________________________________________________________________________________________________________________________________________________________________________________________
16
1.3.3 Small cells
_________________________________________________________________________________________________________________________________________________________________________________________________
17
Broadband communication infrastructure and TV
_____________________________________________________________________________________________________________________________________________
18
1.4.1 WLAN: access points and routers, fixed consumer electronics
_______________________________________________________________________________________________________________
18
1.4.2 Cable modem and set-top boxes based on DOCSIS 3.0 & 3.1
________________________________________________________________________________________________________________
19
1.4.3
1.4.4
1.4.5
Network Interface Module (NIM) for TV reception
_________________________________________________________________________________________________________________________________
20
Optical mini- and midi-node line-up
________________________________________________________________________________________________________________________________________________________
21
Broadband line extenders
_______________________________________________________________________________________________________________________________________________________________________
22
1.3
1.4
1.5
Satellite
_______________________________________________________________________________________________________________________________________________________________________________________________________________
23
1.5.1 Satellite outdoor unit, QUAD LNB with integrated mixer/oscillator/downconverter/switch matrix
________________________________________________________
23
1.5.2 Satellite outdoor unit, twin LNB with integrated mixer/oscillator/downconverter
___________________________________________________________________________________
24
1.5.3 Satellite outdoor unit, twin LNB with discrete components
___________________________________________________________________________________________________________________
25
1.5.4 Satellite multi-switch box - 4 x 4 (up to 16 x 16)/DiSEqC/SMATV
_____________________________________________________________________________________________________________
26
1.5.5 VSAT with integrated mixer/oscillator/downconverter
_____________________________________________________________________________________________________________________________
27
Generic RF front-end for IOT
_____________________________________________________________________________________________________________________________________________________________________________
29
Automotive
______________________________________________________________________________________________________________________________________________________________________________________________________
31
1.7.1 Remote Keyless Entry (RKE), RF generic front-end with dedicated antenna for reception and transmission
_________________________________________
31
1.7.2 Tire-pressure monitoring system
_____________________________________________________________________________________________________________________________________________________________
32
1.7.3
SDARS and HD radio
_______________________________________________________________________________________________________________________________________________________________________________
33
1.6
1.7
2
Technologies
35
2.1 Looking for a leader in SiGe:C? You just found us!
___________________________________________________________________________________________________________________________________________
35
2.2 High-performance, small-size packaging
__________________________________________________________________________________________________________________________________________________________
36
3
3.1
Products by function
39
RF ICs
_________________________________________________________________________________________________________________________________________________________________________________________________________________
39
3.1.1 RF MMIC amplifiers and mixers
________________________________________________________________________________________________________________________________________________________________
39
3.1.2 Wideband amplifiers
________________________________________________________________________________________________________________________________________________________________________________
42
3.1.3 Variable gain and discrete step amplifiers
______________________________________________________________________________________________________________________________________________
43
3.1.4 Power amplifiers
______________________________________________________________________________________________________________________________________________________________________________________
44
3.1.5 Modulators, mixers, PLL and downconverters
________________________________________________________________________________________________________________________________________
44
3.2 RF Bipolar transistors
________________________________________________________________________________________________________________________________________________________________________________________
46
3.2.1 Wideband transistors
______________________________________________________________________________________________________________________________________________________________________________
46
3.3 RF diodes
____________________________________________________________________________________________________________________________________________________________________________________________________________
49
3.3.1 Varicap diodes
__________________________________________________________________________________________________________________________________________________________________________________________
49
3.3.2 PIN diodes
_______________________________________________________________________________________________________________________________________________________________________________________________
50
3.3.3 Band-switch diodes
__________________________________________________________________________________________________________________________________________________________________________________
52
3.4 RF MOS transistors
____________________________________________________________________________________________________________________________________________________________________________________________
53
3.4.1 JFETs
_______________________________________________________________________________________________________________________________________________________________________________________________________
53
3.4.2 MOSFETs
_________________________________________________________________________________________________________________________________________________________________________________________________
54
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4.1
Design support
57
Explore NXP's RF portfolio
________________________________________________________________________________________________________________________________________________________________________________
57
4.2 Product selection on NXP.com
__________________________________________________________________________________________________________________________________________________________________________
57
4.3 Product evaluation
_____________________________________________________________________________________________________________________________________________________________________________________________
57
4.4
Additional design-in support
_____________________________________________________________________________________________________________________________________________________________________________
58
4.5 Application notes
_______________________________________________________________________________________________________________________________________________________________________________________________
58
4.6 Simulation models
______________________________________________________________________________________________________________________________________________________________________________________________
64
5
5.1
Replacement for discontinued parts
_____________________________________________________68
Cross-references: NXP discontinued types versus NXP replacement types
___________________________________________________________________________________________________
68
6
Packing and packaging information______________________________________________________ 70
6.1 Packing quantities per package with relevant ordering codes
_________________________________________________________________________________________________________________________
70
6.2 Marking codes
_____________________________________________________________________________________________________________________________________________________________________________________________________
71
7
Product index
__________________________________________________________________________
73
NXP Semiconductors RF Manual 20
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