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74LVU04BQ,115

Description
IC INVERTER 6CH 6-INP 14DHVQFN
Categorylogic    logic   
File Size212KB,20 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74LVU04BQ,115 Overview

IC INVERTER 6CH 6-INP 14DHVQFN

74LVU04BQ,115 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeQFN
package instruction2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14
Contacts14
Manufacturer packaging codeSOT762-1
Reach Compliance Codecompliant
seriesLV/LV-A/LVX/H
JESD-30 codeR-PQCC-N14
JESD-609 codee4
length3 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeINVERTER
MaximumI(ol)0.006 A
Humidity sensitivity level1
Number of functions6
Number of entries1
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Encapsulate equivalent codeLCC14,.1X.12,20
Package shapeRECTANGULAR
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Sup10 ns
propagation delay (tpd)17 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width2.5 mm
74LVU04
Hex unbuffered inverter
Rev. 7 — 18 September 2014
Product data sheet
1. General description
The 74LVU04 is a low-voltage Si-gate CMOS device that is pin and function compatible
with 74HCU04.
The 74LVU04 is a general purpose hex inverter. Each of the six inverters is a single stage
with unbuffered outputs.
2. Features and benefits
Wide operating voltage: 1.0 V to 5.5 V
Optimized for low voltage applications: 1.0 V to 3.6 V
Typical output ground bounce < 0.8 V at V
CC
= 3.3 V and T
amb
= 25
C
Typical HIGH-level output voltage (V
OH
) undershoot: > 2 V at V
CC
= 3.3 V and
T
amb
= 25
C
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from
40 C
to +85
C
and from
40 C
to +125
C
3. Applications
Linear amplifier
Crystal oscillator
Astable multivibrator

74LVU04BQ,115 Related Products

74LVU04BQ,115 74LVU04DB,112 74LVU04DB,118 74LVU04N,112
Description IC INVERTER 6CH 6-INP 14DHVQFN IC INVERTER 6CH 6-INP 14SSOP IC INVERTER 6CH 6-INP 14SSOP IC INVERTER 6CH 6-INP 14DIP
Brand Name NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to
Maker NXP NXP NXP NXP
Parts packaging code QFN SSOP1 SSOP1 DIP
package instruction 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 DIP, DIP14,.3
Contacts 14 14 14 14
Manufacturer packaging code SOT762-1 SOT337-1 SOT337-1 SOT27-1
Reach Compliance Code compliant compliant compliant compliant
series LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H
JESD-30 code R-PQCC-N14 R-PDSO-G14 R-PDSO-G14 R-PDIP-T14
JESD-609 code e4 e4 e4 e4
length 3 mm 6.2 mm 6.2 mm 19.025 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type INVERTER INVERTER INVERTER INVERTER
MaximumI(ol) 0.006 A 0.006 A 0.006 A 0.006 A
Number of functions 6 6 6 6
Number of entries 1 1 1 1
Number of terminals 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVQCCN SSOP SSOP DIP
Encapsulate equivalent code LCC14,.1X.12,20 SSOP14,.3 SSOP14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH IN-LINE
method of packing TAPE AND REEL TUBE TAPE AND REEL TUBE
Peak Reflow Temperature (Celsius) 260 260 260 260
power supply 3.3 V 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Sup 10 ns 10 ns 10 ns 10 ns
propagation delay (tpd) 17 ns 17 ns 17 ns 17 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO
Maximum seat height 1 mm 2 mm 2 mm 4.2 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1 V 1 V 1 V 1 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES NO
technology CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form NO LEAD GULL WING GULL WING THROUGH-HOLE
Terminal pitch 0.5 mm 0.65 mm 0.65 mm 2.54 mm
Terminal location QUAD DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30
width 2.5 mm 5.3 mm 5.3 mm 7.62 mm
Humidity sensitivity level 1 1 1 -
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