74HCT4066N,112 datasheet, PDF - EEWORLD Datasheet

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74HCT4066N,112: DescriptionIC SWITCH QUAD 1X1 14DIP; CategoryAnalog mixed-signal IC The signal circuit; File Size453KB，25 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74HCT4066N,112 Overview

IC SWITCH QUAD 1X1 14DIP

74HCT4066N,112 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconductor
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	DIP
package instruction	DIP, DIP14,.3
Contacts	14
Manufacturer packaging code	SOT27-1
Reach Compliance Code	compliant
Analog Integrated Circuits - Other Types	SPST
JESD-30 code	R-PDIP-T14
JESD-609 code	e4
length	19.025 mm
normal position	NO
Number of channels	1
Number of functions	4
Number of terminals	14
Nominal off-state isolation	50 dB
On-state resistance matching specifications	5 Ω
Maximum on-state resistance (Ron)	142 Ω
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
output	SEPARATE OUTPUT
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.2 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	4.5 V
surface mount	NO
Maximum disconnect time	53 ns
Maximum connection time	36 ns
switch	MAKE-BEFORE-BREAK
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	7.62 mm
Base Number Matches	1

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74HC4066; 74HCT4066

Quad single-pole single-throw analog switch

Rev. 7 — 2 April 2013

Product data sheet

1. General description

The 74HC4066; 74HCT4066 is a quad single pole, single throw analog switch. Each

switch features two input/output terminals (nY and nZ) and an active HIGH enable input

(nE). When nE is LOW, the analog switch is turned off. Inputs include clamp diodes. This

enables the use of current limiting resistors to interface inputs to voltages in excess of

2. Features and benefits



Input levels nE inputs:



For 74HC4066: CMOS level



For 74HCT4066: TTL level



Low ON resistance:





(typical) at V

= 4.5 V





(typical) at V

= 6.0 V





(typical) at V

= 9.0 V



Specified in compliance with JEDEC standard no. 7A



ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-A exceeds 200 V



Multiple package options



Specified from

40 C

to +85

C

and

40 C

to +125

C

74HCT4066N,112 Related Products

	74HCT4066N,112	74HC4066N,652
Description	IC SWITCH QUAD 1X1 14DIP	IC SWITCH QUAD 1X2 14DIP
Brand Name	NXP Semiconductor	NXP Semiconductor
Is it Rohs certified?	conform to	conform to
Maker	NXP	NXP
Parts packaging code	DIP	DIP
package instruction	DIP, DIP14,.3	DIP, DIP14,.3
Contacts	14	14
Manufacturer packaging code	SOT27-1	SOT27-1
Reach Compliance Code	compliant	compliant
Analog Integrated Circuits - Other Types	SPST	SPST
JESD-30 code	R-PDIP-T14	R-PDIP-T14
JESD-609 code	e4	e4
length	19.025 mm	19.025 mm
normal position	NO	NO
Number of channels	1	1
Number of functions	4	4
Number of terminals	14	14
Nominal off-state isolation	50 dB	50 dB
On-state resistance matching specifications	5 Ω	5 Ω
Maximum on-state resistance (Ron)	142 Ω	142 Ω
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C
output	SEPARATE OUTPUT	SEPARATE OUTPUT
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	260	260
power supply	5 V	2/9 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	4.2 mm	4.2 mm
Maximum supply voltage (Vsup)	5.5 V	10 V
Minimum supply voltage (Vsup)	4.5 V	2 V
Nominal supply voltage (Vsup)	4.5 V	4.5 V
surface mount	NO	NO
Maximum disconnect time	53 ns	45 ns
Maximum connection time	36 ns	30 ns
switch	MAKE-BEFORE-BREAK	MAKE-BEFORE-BREAK
technology	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	30	30
width	7.62 mm	7.62 mm
Base Number Matches	1	1

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