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74FST3383DTR2

Description
10−Bit Low Power Bus Exchange
Categorylogic    logic   
File Size212KB,8 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance
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74FST3383DTR2 Overview

10−Bit Low Power Bus Exchange

74FST3383DTR2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerON Semiconductor
Parts packaging codeTSSOP
package instructionTSSOP, TSSOP24,.25
Contacts24
Reach Compliance Codeunknown
Factory Lead Time1 week
Base Number Matches1
74FST3383
10−Bit Low Power
Bus Exchange
The ON Semiconductor 74FST3383 is a 10−bit low power bus
exchange. The device is CMOS TTL compatible when operating
between 4 and 5.5 Volts. The device exhibits extremely low R
ON
and
adds nearly zero propagation delay. The device adds no noise or
ground bounce to the system.
Features
http://onsemi.com
MARKING
DIAGRAMS
24
24
1
SOIC−24
DW SUFFIX
CASE 751E
1
FST3383
AWLYWW
R
ON
t
4
W
Typical
Less Than 0.25 ns−Max Delay Through Switch
Nearly Zero Standby Current
No Circuit Bounce
Control Inputs are TTL/CMOS Compatible
Pin−For−Pin Compatible With QS3383, FST3383, CBT3383
All Popular Packages: SOIC−24, TSSOP−24, QSOP−24
All Devices in Package TSSOP are Inherently Pb−Free*
24
OE
C
0
A
0
B
0
D
0
C
1
A
1
B
1
D
1
C
2
A
2
GND
24
FST
3383
ALYW
1
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
V
CC
D
4
B
4
A
4
C
4
D
3
B
3
A
3
C
3
D
2
B
2
BX
1
TSSOP−24
DT SUFFIX
CASE 948H
24
1
QSOP−24
QS SUFFIX
CASE 492B
A
L, WL
Y, YY
W, WW
=
=
=
=
24
FST3383
AWLYYWW
1
Figure 1. 24−Lead Pinout
TRUTH TABLE
OE
H
L
L
BX
X
L
H
A
0
−A
4
HIGH−Z State
C
0
−C
4
D
0
−D
4
B
0
−B
4
HIGH−Z State
D
0
−D
4
C
0
−C
4
Function
Disconnect
Connect
Exchange
Assembly Location
Wafer Lot
Year
Work Week
PIN NAMES
Pin
OE
BX
A
0
−A
4
, B
0
−B
4
C
0
−C
4
, D
0
−D
4
Description
Bus Switch Enable
Bus Exchange
Buses A, B
Buses C, D
NOTE: H = HIGH Voltage Level, L = LOW Voltage Level, X = Don’t Care
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
June, 2006
Rev. 6
1
Publication Order Number:
74FST3383/D

74FST3383DTR2 Related Products

74FST3383DTR2 74FST3383QSR 74FST3383DW 74FST3383DWR2 74FST3383_06 74FST3383DT 74FST3383 74FST3383QS
Description 10−Bit Low Power Bus Exchange 10−Bit Low Power Bus Exchange 10−Bit Low Power Bus Exchange 10−Bit Low Power Bus Exchange 10−Bit Low Power Bus Exchange 10−Bit Low Power Bus Exchange 10−Bit Low Power Bus Exchange 10−Bit Low Power Bus Exchange
Is it Rohs certified? conform to incompatible incompatible incompatible - conform to - incompatible
Maker ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor - ON Semiconductor - ON Semiconductor
Parts packaging code TSSOP SOIC SOIC SOIC - TSSOP - SOIC
package instruction TSSOP, TSSOP24,.25 SSOP, SSOP24,.24 SOP, SOP24,.4 SOP, SOP24,.4 - TSSOP, TSSOP24,.25 - SSOP, SSOP24,.24
Contacts 24 24 24 24 - 24 - 24
Reach Compliance Code unknown not_compliant not_compliant not_compliant - unknown - not_compliant
Factory Lead Time 1 week 1 week 1 week 1 week - 1 week - 1 week
Base Number Matches 1 1 1 1 - 1 - 1
series - CBT/FST/QS/5C/B CBT/FST/QS/5C/B CBT/FST/QS/5C/B - CBT/FST/QS/5C/B - CBT/FST/QS/5C/B
JESD-30 code - R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 - R-PDSO-G24 - R-PDSO-G24
JESD-609 code - e0 e0 e0 - e4 - e0
length - 8.65 mm 15.395 mm 15.395 mm - 7.8 mm - 8.65 mm
Logic integrated circuit type - BUS EXCHANGER BUS EXCHANGER BUS EXCHANGER - BUS EXCHANGER - BUS EXCHANGER
Humidity sensitivity level - 1 1 1 - 1 - 1
Number of digits - 10 10 10 - 10 - 10
Number of functions - 1 1 1 - 1 - 1
Number of ports - 4 4 4 - 4 - 4
Number of terminals - 24 24 24 - 24 - 24
Maximum operating temperature - 85 °C 85 °C 85 °C - 85 °C - 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C - -40 °C - -40 °C
Output characteristics - 3-STATE 3-STATE 3-STATE - 3-STATE - 3-STATE
Output polarity - TRUE TRUE TRUE - TRUE - TRUE
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code - SSOP SOP SOP - TSSOP - SSOP
Encapsulate equivalent code - SSOP24,.24 SOP24,.4 SOP24,.4 - TSSOP24,.25 - SSOP24,.24
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR - RECTANGULAR
Package form - SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, SHRINK PITCH
power supply - 5 V 5 V 5 V - 5 V - 5 V
propagation delay (tpd) - 6.5 ns 6.5 ns 6.5 ns - 6.5 ns - 6.5 ns
Certification status - Not Qualified Not Qualified Not Qualified - Not Qualified - Not Qualified
Maximum seat height - 1.73 mm 2.65 mm 2.65 mm - 1.2 mm - 1.73 mm
Maximum supply voltage (Vsup) - 5.5 V 5.5 V 5.5 V - 5.5 V - 5.5 V
Minimum supply voltage (Vsup) - 4 V 4 V 4 V - 4 V - 4 V
Nominal supply voltage (Vsup) - 5 V 5 V 5 V - 5 V - 5 V
surface mount - YES YES YES - YES - YES
technology - CMOS CMOS CMOS - CMOS - CMOS
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL - INDUSTRIAL - INDUSTRIAL
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Nickel/Palladium/Gold (Ni/Pd/Au) - Tin/Lead (Sn/Pb)
Terminal form - GULL WING GULL WING GULL WING - GULL WING - GULL WING
Terminal pitch - 0.635 mm 1.27 mm 1.27 mm - 0.65 mm - 0.635 mm
Terminal location - DUAL DUAL DUAL - DUAL - DUAL
width - 3.9 mm 7.5 mm 7.5 mm - 4.4 mm - 3.9 mm

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